METROLOGY METHOD AND ASSOCIATED METROLOGY AND LITHOGRAPHIC APPARATUSES

    公开(公告)号:US20220121128A1

    公开(公告)日:2022-04-21

    申请号:US17565422

    申请日:2021-12-29

    IPC分类号: G03F7/20

    摘要: Disclosed is a method of metrology comprising using measurement illumination to measure a target, said measurement illumination comprising a plurality of illumination conditions. The method comprises performing a first measurement capture with a first subset of said plurality of illumination conditions, e.g., each comprising a positive weighting, to obtain a first parameter value and performing a second measurement capture with a second subset of said plurality of illumination conditions, e.g., each comprising a negative weighting, to obtain a second parameter value. An optimized parameter value is determined as a weighted combination of at least the first parameter value and the second parameter value.

    MONOLITHIC PARTICLE INSPECTION DEVICE
    3.
    发明公开

    公开(公告)号:US20230266255A1

    公开(公告)日:2023-08-24

    申请号:US18012801

    申请日:2021-06-09

    IPC分类号: G01N21/956

    CPC分类号: G01N21/956 G01N2021/95676

    摘要: Systems, apparatuses, and methods are provided for detecting a particle on a substrate surface. An example method can include receiving, by a grating structure, coherent radiation from a radiation source. The method can further include generating, by the grating structure, a focused coherent radiation beam based on the coherent radiation. The method can further include transmitting, by the grating structure, the focused coherent radiation beam toward a region of a surface of a substrate. The method can further include receiving, by the grating structure, photons scattered from the region in response to illuminating the region with the focused coherent radiation beam. The method can further include measuring, by a photodetector, the photons received by the grating structure. The method can further include generating, by the photodetector and based on the measured photons, an electronic signal for detecting a particle located in the region of the surface of the substrate.

    METROLOGY METHOD AND APPARATUS
    5.
    发明公开

    公开(公告)号:US20240231247A1

    公开(公告)日:2024-07-11

    申请号:US18413910

    申请日:2024-01-16

    IPC分类号: G03F9/00

    CPC分类号: G03F9/7088 G03F9/7046

    摘要: Disclosed is a method for measuring alignment on an alignment mark, and associated apparatuses. The method comprises illuminating the alignment mark with illumination comprising at least one wavelength; capturing the scattered radiation scattered from the alignment mark as a result of said illumination step, and determining at least one position value for said alignment mark from an angularly resolved representation of said scattered radiation, wherein said alignment mark, or a feature thereof, is smaller than said at least one wavelength in at least one dimension of a substrate plane.