Measurement apparatus
    2.
    发明授权

    公开(公告)号:US11874103B2

    公开(公告)日:2024-01-16

    申请号:US17412525

    申请日:2021-08-26

    IPC分类号: G01B11/27

    CPC分类号: G01B11/272

    摘要: In order to improve the throughput performance and/or economy of a measurement apparatus, the present disclosure provides a metrology apparatus including: a first measuring apparatus; a second measuring apparatus; a first substrate stage configured to hold a first substrate and/or a second substrate; a second substrate stage configured to hold the first substrate and/or the second substrate; a first substrate handler configured to handle the first substrate and/or the second substrate; and a second substrate handler configured to handle the first substrate and/or the second substrate, wherein the first substrate is loaded from a first, second or third FOUP, wherein the second substrate is loaded from the first, second or third FOUP, wherein the first measuring apparatus is an alignment measuring apparatus, and wherein the second measuring apparatus is a level sensor, a film thickness measuring apparatus or a spectral reflectance measuring apparatus.

    Measurement apparatus
    4.
    发明授权

    公开(公告)号:US11105619B2

    公开(公告)日:2021-08-31

    申请号:US16629990

    申请日:2018-07-13

    IPC分类号: G01B11/27

    摘要: In order to improve the throughput performance and/or economy of a measurement apparatus, the present disclosure provides a metrology apparatus including: a first measuring apparatus; a second measuring apparatus; a first substrate stage configured to hold a first substrate and/or a second substrate; a second substrate stage configured to hold the first substrate and/or the second substrate; a first substrate handler configured to handle the first substrate and/or the second substrate; and a second substrate handler configured to handle the first substrate and/or the second substrate, wherein the first substrate is loaded from a first, second or third FOUP, wherein the second substrate is loaded from the first, second or third FOUP, wherein the first measuring apparatus is an alignment measuring apparatus, and wherein the second measuring apparatus is a level sensor, a film thickness measuring apparatus or a spectral reflectance measuring apparatus.

    Lithographic method and apparatus

    公开(公告)号:US10401735B2

    公开(公告)日:2019-09-03

    申请号:US15778093

    申请日:2016-11-03

    IPC分类号: G03F7/20 G03F1/42 G03F9/00

    摘要: A measurement method comprising using multiple radiation poles to illuminate a diffraction grating on a mask at a mask side of a projection system of a lithographic apparatus, coupling at least two different resulting diffraction orders per illumination pole through the projection system, using the projection system to project the diffraction orders onto a grating on a wafer such that a pair of combination diffraction orders is formed by diffraction of the diffraction orders, coupling the combination diffraction orders back through the projection system to detectors configured to measure the intensity of the combination diffraction orders, and using the measured intensity of the combination diffraction orders to measure the position of the wafer grating.

    Lithographic method and apparatus

    公开(公告)号:US10747120B2

    公开(公告)日:2020-08-18

    申请号:US16558265

    申请日:2019-09-02

    IPC分类号: G03F7/20 G03F1/42 G03F9/00

    摘要: A measurement method comprising using multiple radiation poles to illuminate a diffraction grating on a mask at a mask side of a projection system of a lithographic apparatus, coupling at least two different resulting diffraction orders per illumination pole through the projection system, using the projection system to project the diffraction orders onto a grating on a wafer such that a pair of combination diffraction orders is formed by diffraction of the diffraction orders, coupling the combination diffraction orders back through the projection system to detectors configured to measure the intensity of the combination diffraction orders, and using the measured intensity of the combination diffraction orders to measure the position of the wafer grating.

    Lithographic Apparatus and Device Manufacturing Method
    9.
    发明申请
    Lithographic Apparatus and Device Manufacturing Method 有权
    光刻设备和器件制造方法

    公开(公告)号:US20130215408A1

    公开(公告)日:2013-08-22

    申请号:US13748889

    申请日:2013-01-24

    IPC分类号: G03F7/00

    摘要: A substrate handler for transferring substrates to be exposed from a track to a lithographic apparatus. The substrate handler comprises a controller. The controller is configured to determine an instance for starting a transfer process of a first one of the substrates. The instance is based on a predetermined processing characteristic of the lithographic apparatus, in order to maintain a transfer period of the substrate in the substrate handler substantially constant.

    摘要翻译: 用于将要从轨道暴露的衬底转移到光刻设备的衬底处理器。 基板处理器包括控制器。 控制器被配置为确定用于开始第一个基板的传送处理的实例。 该实例基于光刻设备的预定处理特性,以便保持基板处理器中的基板的转印周期基本恒定。