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公开(公告)号：US20220342316A1
公开(公告)日：2022-10-27
申请号：US17640792
申请日：2020-09-03
发明人： Marleen KOOIMAN , Maxim PISARENCO , Abraham SLACHTER , Mark John MASLOW , Bernardo Andres OYARZUN RIVERA , Wim Tjibbo TEL , Ruben Cornelis MAAS
摘要： Described herein is a method of training a model configured to predict whether a feature associated with an imaged substrate will be defective after etching of the imaged substrate and determining etch conditions based on the trained model. The method includes obtaining, via a metrology tool, (i) an after development image of the imaged substrate at a given location, the after development image including a plurality of features, and (ii) an after etch image of the imaged substrate at the given location; and training, using the after development image and the after etch image, the model configured to determine defectiveness of a given feature of the plurality of features in the after development image. In an embodiment, the determining of defectiveness is based on comparing the given feature in the after development image with a corresponding etch feature in the after etch image.
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公开(公告)号：US20220107571A1
公开(公告)日：2022-04-07
申请号：US17467441
申请日：2021-09-06
摘要： Disclosed is a method of, and associated apparatus for, determining an edge position relating to an edge of a feature comprised within an image, such as a scanning electron microscope image, which comprises noise. The method comprises determining a reference signal from said image; and determining said edge position with respect to said reference signal. The reference signal may be determined from the image by applying a 1-dimensional low-pass filter to the image in a direction parallel to an initial contour estimating the edge position.
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3.发明申请公开(公告)号：US20210327678A1
公开(公告)日：2021-10-21
申请号：US17271667
申请日：2019-08-22
IPC分类号： H01J37/304 , H01J37/147 , H01J37/302 , H01J37/317 , H01L21/263 , G03F7/20
摘要： A particle beam apparatus includes an object table configured to hold a semiconductor substrate; a particle beam source configured to generate a particle beam; a detector configured to detect a response of the substrate caused by interaction of the particle beam with the substrate and to output a detector signal representative of the response; and a processing unit configured to: receive or determine a location of one or more defect target areas on the substrate; control the particle beam source to inspect the one or more defect target areas; identify one or more defects within the one or more defect target areas, based on the detector signal obtained during the inspection of the one or more defect target areas; control the particle beam source to repair the one or more defects.
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公开(公告)号：US20210079519A1
公开(公告)日：2021-03-18
申请号：US16971012
申请日：2019-02-21
发明人： Pieter Willem Herman DE JAGER , Sander Frederik WUISTER , Marie-Claire VAN LARE , Ruben Cornelis MAAS , Alexey Olegovich POLYAKOV , Tamara DRUZHININA , Victoria VORONINA , Evgenia KURGANOVA , Jim Vincent OVERKAMP , Bernardo KASTRUP , Maarten VAN KAMPEN , Alexandr DOLGOV
IPC分类号： C23C16/04 , C23C16/455 , C23C16/48
摘要： Methods and apparatuses for forming a patterned layer of material are disclosed. In one arrangement, a selected portion of a surface of a substrate is irradiated with electromagnetic radiation having a wavelength of less than 100 nm during a deposition process. Furthermore, an electric field controller is configured to apply an electric field that is oriented so as to force secondary electrons away from the substrate. The irradiation locally drives the deposition process in the selected portion and thereby causes the deposition process to, for example, form a layer of material in a pattern defined by the selected portion.
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