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1.发明申请METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD CONSISTING OF AT LEAST TWO PRINTED CIRCUIT BOARD REGIONS, AND PRINTED CIRCUIT BOARD 有权生产印刷电路板的方法，包括至少两个印刷电路板区域和印刷电路板公开(公告)号：US20140376196A1
公开(公告)日：2014-12-25
申请号：US14368623
申请日：2012-12-28
CPC分类号： H05K3/4611 , H05K1/11 , H05K1/142 , H05K1/18 , H05K3/368 , H05K3/403 , H05K3/4694 , H05K2201/09045 , H05K2201/0919 , H05K2201/09572 , H05K2201/1059 , H05K2201/209 , Y10T29/49126
摘要： The invention relates to a method for producing a printed circuit board consisting of at least two printed circuit board regions, wherein the printed circuit board regions each comprise at least one conductive layer and/or at least one conductive component, wherein printed circuit board regions to be connected to one another, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a mechanical coupling. According to the invention, at least one sub-region or connection port of the conductive layer, and/or a conductive element of the component are electrically conductively coupled to each other at the lateral surface, whereby a simple and reliable lateral electrical coupling between printed circuit board regions to be connected to each other is rendered possible. The invention further relates to such a printed circuit board.
摘要翻译： 本发明涉及一种用于制造由至少两个印刷电路板区域组成的印刷电路板的方法，其中印刷电路板区域各自包括至少一个导电层和/或至少一个导电部件，其中印刷电路板区域 彼此连接，在每种情况下，至少一个彼此直接相邻的侧表面的区域通过机械联接相互连接。 根据本发明，导电层的至少一个子区域或连接端口和/或该部件的导电元件在侧面处彼此导电耦合，从而在印刷之间形成简单且可靠的横向电耦合 使彼此连接的电路板区域成为可能。 本发明还涉及这种印刷电路板。
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2.发明申请Method for the Production of a Circuit Board Involving the Removal of a Subregion thereof, and Use of such a Method 审中-公开涉及除去其子区域的电路板的制造方法以及这种方法的使用公开(公告)号：US20140373350A1
公开(公告)日：2014-12-25
申请号：US14363223
申请日：2012-12-03
IPC分类号： H05K3/46
CPC分类号： H05K3/46 , H05K3/0044 , H05K3/4691 , H05K2201/09127 , H05K2203/0191 , H05K2203/0264 , H05K2203/107 , Y10T29/49156
摘要： The invention relates to a method for producing a circuit board involving the removal of a subregion thereof. In said method, at least two layers or plies of the circuit board (1) are interconnected, the subregion (6) to be removed is prevented from being connected to an adjacent ply of the circuit board by providing a layer (7) of adhesion-preventing or bonding-preventing material, and peripheral zones (8) of the subregion (6) to be removed are separated from adjoining zones of the circuit board (1). According to the invention, a fissure formation and/or a detachment from the subregion (6) of the circuit board (1) to be removed is initiated in a subregion in or on the layer (7) of adhesion-preventing or bonding-preventing material, and the subregion (6) to be removed is then removed, thus making it possible to remove a subregion (6) to be removed from a circuit board (1) in a simple and reliable, and if necessary automated, manner. Also disclosed is a use of such a method for producing a multilayer circuit board (1) and especially for creating voids in such a circuit board (1).
摘要翻译： 本发明涉及一种生产电路板的方法，该方法包括去除其子区域。 在所述方法中，电路板（1）的至少两层或多层相互连接，通过提供粘合层（7），防止要移除的子区域（6）与电路板的相邻层相连接 要除去的防止或接合防止材料和所述子区域（6）的周边区域（8）与电路板（1）的邻接区域分离。 根据本发明，将要去除的电路板（1）的子区域（6）的裂缝形成和/或脱离开始于防粘附或防粘接层（7）中或其上的一个子区域 材料和要除去的子区域（6）被去除，从而可以以简单可靠且如果需要的自动化方式去除要从电路板（1）移除的子区域（6）。 还公开了这种用于制造多层电路板（1）的方法，特别是在这种电路板（1）中产生空隙的方法。
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3.发明授权公开(公告)号：US10051747B2
公开(公告)日：2018-08-14
申请号：US14362873
申请日：2012-12-03
摘要： Methods for the production of a circuit board involving the removal of a subregion in accordance with various embodiments of the invention are disclosed. In one embodiment, the production of a circuit board, made of at least two interconnected layers of material, involving the removal of a subregion including a portion of at least one of the at least two interconnected layers from the circuit board includes providing an adhesion preventing material under the subregion to be removed to a layer in the at least two interconnected layers that is adjacent to the at least one layer including the subregion, separating edge regions of the subregion to be removed from adjoining regions of the circuit board, connecting an external surface of the subregion to be removed to an external element, and displacing the external element to separate the subregion to be removed from the adjacent layer of the circuit board.
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4.发明授权Method for producing a printed circuit board consisting of at least two printed circuit board regions, and printed circuit board 有权用于制造由至少两个印刷电路板区域和印刷电路板组成的印刷电路板的方法公开(公告)号：US09480172B2
公开(公告)日：2016-10-25
申请号：US14368623
申请日：2012-12-28
CPC分类号： H05K3/4611 , H05K1/11 , H05K1/142 , H05K1/18 , H05K3/368 , H05K3/403 , H05K3/4694 , H05K2201/09045 , H05K2201/0919 , H05K2201/09572 , H05K2201/1059 , H05K2201/209 , Y10T29/49126
摘要： A printed circuit board and a method for producing a printed circuit board consisting of at least two printed circuit board regions, wherein the printed circuit board regions each comprise at least one conductive layer and/or at least one conductive component, wherein printed circuit board regions to be connected to one another, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a mechanical coupling. At least one sub-region or connection port of the conductive layer, and/or a conductive element of the component are electrically conductively coupled to each other at the lateral surface.
摘要翻译： 一种印刷电路板和由至少两个印刷电路板区域组成的印刷电路板的制造方法，其中印刷电路板区域各自包括至少一个导电层和/或至少一个导电部件，其中印刷电路板区域 在彼此连接的情况下，在每种情况下，至少一个彼此直接相邻的侧面的区域通过机械联接彼此连接。 导电层的至少一个子区域或连接端口和/或该部件的导电元件在侧表面处彼此导电耦合。
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