公开(公告)号：US20030162003A1

公开(公告)日：2003-08-28

申请号：US10391835

申请日：2003-03-19

Applicant: Axsun Technologies, Inc.

Inventor： Walid A. Atia ,  Steven D. Conover ,  Eric E. Fitch ,  Sean P. O'Connor ,  Randal A. Murdza

IPC: B32B003/00

CPC classification number: G02B6/4226 ,  G02B6/4232 ,  G02B6/4238 ,  H05K3/303 ,  H05K2201/2036 ,  H05K2203/0186 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49769 ,  Y10T29/49771 ,  Y10T29/49778 ,  Y10T29/49861 ,  Y10T29/53174 ,  Y10T428/24917

Abstract: A process for assembling micro-optical systems, such as optoelectronic and/or fiber optic components uses solder self-alignment to achieve a coarse, passive alignment of optical components relative to the optical bench. The fine, final alignment is performed using plastic deformation of the optical components to thereby improve the alignment of the optical components. As a result, the sub-micrometer alignment accuracies are attainable, if required.

公开(公告)号：US20040100686A1

公开(公告)日：2004-05-27

申请号：US10392353

申请日：2003-03-19

Applicant: AXSUN Technologies, Inc.

Inventor： Dale C. Flanders ,  Walid Atia ,  Eric E. Fitch ,  Minh Van Le ,  Randal A. Murdza ,  Robert L. Payer ,  Jeffrey A. Korn ,  Xiaomei Wang ,  Walter R. Buchwald ,  L. James Newman III

IPC: H01S003/00

CPC classification number: H01S5/02216 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/0683

Abstract: A detector system for a fiber optic component is insensitive to stray light. Specifically, the invention comprises a detector chip, which converts received light into an electric signal. A baffle substrate is positioned over the detector chip. This baffle substrate has a transmission port through which an optical signal is transmitted to the detector chip. As a result, light that is not directed to be transmitted through the port is blocked by the baffle substrate. In this way, it rejects stray light that may be present in the hermetic package. A detector substrate is provided on which the detector chip is mounted. This detector substrate preferably comprises electrical traces to which the detector chip is electrically connected. The detector substrate can further comprise bond pads for wire bonding to make electrical connections to the electrical traces.

Abstract translation: 用于光纤部件的检测器系统对杂散光不敏感。 具体地，本发明包括将接收的光转换成电信号的检测器芯片。 挡板基板位于检测器芯片上。 该挡板基板具有传输端口，通过该传输端口将光信号传输到检测器芯片。 结果，不被透射通过端口的光被挡板衬底阻挡。 以这种方式，它拒绝可能存在于密封包装中的杂散光。 设置有检测器芯片安装在其上的检测器基板。 该检测器基板优选地包括检测器芯片电连接到的电迹线。 检测器基板还可以包括用于引线键合的接合焊盘以与电迹线进行电连接。