公开(公告)号：US20020168136A1

公开(公告)日：2002-11-14

申请号：US09851510

申请日：2001-05-08

Applicant: AXSUN Technologies, Inc.

Inventor： Walid A. Atia ,  Minh Van Le

IPC: G02B006/35 ,  G02B007/182

CPC classification number: G02B6/29358 ,  G02B6/12007 ,  G02B6/122 ,  G02B6/29395 ,  G02B6/3516 ,  G02B6/3518 ,  G02B26/001 ,  G02B26/02 ,  G02B2006/12104 ,  G02B2006/12109

Abstract: In a MOEMS device and corresponding fabrication process, absorbing material along the optical axis of the device is removed. The result is a suspended optical coating, such as a dielectric thin film mirror stack. Such optical coatings can have very low absorption. Thus, the invention can materially lower the net absorption in the device, and thereby improve performance, by degrading power related dependencies.

Abstract translation: 在MOEMS装置和相应的制造工艺中，沿着装置的光轴吸收材料被去除。 结果是悬浮的光学涂层，例如电介质薄膜反射镜叠层。 这种光学涂层可以具有非常低的吸收。 因此，通过降低与电力相关的依赖性，本发明可以实质上降低装置中的净吸收，从而提高性能。

公开(公告)号：US20040100686A1

公开(公告)日：2004-05-27

申请号：US10392353

申请日：2003-03-19

Applicant: AXSUN Technologies, Inc.

Inventor： Dale C. Flanders ,  Walid Atia ,  Eric E. Fitch ,  Minh Van Le ,  Randal A. Murdza ,  Robert L. Payer ,  Jeffrey A. Korn ,  Xiaomei Wang ,  Walter R. Buchwald ,  L. James Newman III

IPC: H01S003/00

CPC classification number: H01S5/02216 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/0683

Abstract: A detector system for a fiber optic component is insensitive to stray light. Specifically, the invention comprises a detector chip, which converts received light into an electric signal. A baffle substrate is positioned over the detector chip. This baffle substrate has a transmission port through which an optical signal is transmitted to the detector chip. As a result, light that is not directed to be transmitted through the port is blocked by the baffle substrate. In this way, it rejects stray light that may be present in the hermetic package. A detector substrate is provided on which the detector chip is mounted. This detector substrate preferably comprises electrical traces to which the detector chip is electrically connected. The detector substrate can further comprise bond pads for wire bonding to make electrical connections to the electrical traces.

Abstract translation: 用于光纤部件的检测器系统对杂散光不敏感。 具体地，本发明包括将接收的光转换成电信号的检测器芯片。 挡板基板位于检测器芯片上。 该挡板基板具有传输端口，通过该传输端口将光信号传输到检测器芯片。 结果，不被透射通过端口的光被挡板衬底阻挡。 以这种方式，它拒绝可能存在于密封包装中的杂散光。 设置有检测器芯片安装在其上的检测器基板。 该检测器基板优选地包括检测器芯片电连接到的电迹线。 检测器基板还可以包括用于引线键合的接合焊盘以与电迹线进行电连接。

公开(公告)号：US20020167713A1

公开(公告)日：2002-11-14

申请号：US09850720

申请日：2001-05-08

Applicant: AXSUN Technologies, Inc.

Inventor： Minh Van Le ,  Jo-Ey Wong

IPC: G02B026/00

CPC classification number: G02B26/02 ,  G02B26/001

Abstract: An electrostatically operated microelectromechanical system comprises a movable and a stationary structure, with a discharge system that is activated upon pull-in of the movable structure to discharge the voltage across an electrostatic cavity to thereby prevent stiction adhesion of the movable structure to the stationary structure. Specifically, a membrane release structure comprises a mirror optical element. The membrane is separated from a stationary support by an electrostatic cavity. The discharge switch comprises a membrane conductor pad on the membrane and a support conductor pad on the support that conducts a current upon activation of the discharge switch to discharge the electrostatic voltage. Preferably, these pads are metal.

Abstract translation: 静电操作的微机电系统包括可移动和静止结构，其中放电系统在可移动结构的拉入时被激活，以将静电空腔上的电压放电，从而防止可移动结构到固定结构的粘结。 具体地，膜释放结构包括镜面光学元件。 膜通过静电腔与固定支架分离。 放电开关包括膜上的膜导体焊盘和支撑体上的支撑导体焊盘，其在激活放电开关时传导电流以释放静电电压。 优选地，这些垫是金属的。

公开(公告)号：US20020048839A1

公开(公告)日：2002-04-25

申请号：US09954861

申请日：2001-09-18

Applicant: AXSUN Technologies, Inc.

Inventor： Michael F. Miller ,  Minh Van Le ,  Christopher C. Cook ,  Dale C. Flanders ,  Steven F. Nagle

IPC: H01L021/00

CPC classification number: B81B3/0083 ,  B81B2201/042 ,  B81B2201/047 ,  B81C1/0038 ,  B81C2201/0159 ,  B81C2201/053 ,  B81C2201/056 ,  G02B26/001

Abstract: A process for patterning dielectric layers of the type typically found in optical coatings in the context of MEMS manufacturing is disclosed. A dielectric coating is deposited over a device layer, which has or will be released, and patterned using a mask layer. In one example, the coating is etched using the mask layer as a protection layer. In another example, a lift-off process is shown. The primary advantage of photolithographic patterning of the dielectric layers in optical MEMS devices is that higher levels of consistency can be achieved in fabrication, such as size, location, and residual material stress. Competing techniques such as shadow masking yield lower quality features and are difficult to align. Further, the minimum feature size that can be obtained with shadow masks is limited to null100 nullm, depending on the coating system geometry, and they require hard contact with the surface of the wafer, which can lead to damage and/or particulate contamination.

Abstract translation: 公开了一种用于在MEMS制造的上下文中通常在光学涂层中发现的类型的介电层图案的工艺。 电介质涂层沉积在器件层上，器件层已经或将被释放，并使用掩模层进行图案化。 在一个实例中，使用掩模层作为保护层来蚀刻涂层。 在另一示例中，示出了剥离过程。 光学MEMS器件中电介质层的光刻图案的主要优点是可以在诸如尺寸，位置和残余材料应力的制造中实现更高水平的稠度。 诸如阴影掩蔽的竞争技术产生较低的质量特征并且难以对准。 此外，根据涂层系统的几何形状，使用荫罩可获得的最小特征尺寸限制在〜100μm，并且它们需要与晶片的表面硬接触，这可能导致损坏和/或微粒污染。