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公开(公告)号：US20240243114A1
公开(公告)日：2024-07-18
申请号：US18414485
申请日：2024-01-17
Applicant: Acer Incorporated
Inventor： Yu-Ming Lin , Mao-Neng Liao , Cheng-Wen Hsieh , Kuang-Hua Lin , Wei-Chin Chen , Kuan-Lin Chen , Chun-Chieh Wang
CPC classification number: H01L25/165 , H01L23/24 , H01L24/29 , H01L24/32 , H01L24/33 , H05K7/20445 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/33183 , H01L2924/0665 , H01L2924/1432
Abstract: An electronic package structure includes first and second package modules combined with each other. The first package module includes a substrate and a first electronic component disposed thereon, at least one second electronic component, and an insulation film. The first electronic component and the second electronic component are adjacent to each other. The insulation film includes a base material and a foam glue body, and the foam glue body is viscous and compressible. The second package module includes a heat dissipation plate and a liquid metal and an insulation protrusion portion disposed thereon. The liquid metal is pressed by the heat dissipation plate and the first electronic component. The insulation protrusion portion covers and abuts against the insulation film to press the foam glue body through the base material so as to deform the foam glue body and enable the foam glue body to cover the second electronic component.
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公开(公告)号：US11946483B2
公开(公告)日：2024-04-02
申请号：US18318852
申请日：2023-05-17
Applicant: Acer Incorporated
Inventor： Jau-Han Ke , Tsung-Ting Chen , Chun-Chieh Wang , Yu-Ming Lin , Cheng-Wen Hsieh , Wen-Neng Liao
CPC classification number: F04D29/281 , F04D17/10 , F04D29/4226 , F04D29/666
Abstract: A fan is provided herein, including a housing, a hub, and a plurality of blades. The housing includes a top case and a bottom case. The hub is rotatably disposed between the top case and the bottom case in an axial direction. The blades extend from the hub in a radial direction, located between the top case and the bottom case. Each of the blades has a proximal end and a distal end. The proximal end is connected to the hub. The distal end is opposite from the proximal end, located at the other side of the blade, having at least one recessed portion. Each of the recessed portions form a passage for air.
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公开(公告)号：US20220290684A1
公开(公告)日：2022-09-15
申请号：US17688910
申请日：2022-03-08
Applicant: Acer Incorporated
Inventor： Yu-Ming Lin , Wen-Neng Liao , Cheng-Wen Hsieh , Chun-Chieh Wang , Han-Liang Huang , Sheng-Yan Chen , Tsung-Ting Chen
Abstract: A fan adapted for being disposed in an electronic device is provided. The fan includes a hub and a plurality of metal blades respectively extending from the hub. Each of the metal blades has a root portion connected to the hub and an end portion away from the hub, and a mass of the end portion is greater than a mass of the root portion, such that the metal blade is elongated while the fan is rotated.
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公开(公告)号：US20210364238A1
公开(公告)日：2021-11-25
申请号：US17325217
申请日：2021-05-20
Applicant: Acer Incorporated
Inventor： Chun-Chieh Wang , Wen-Neng Liao , Cheng-Wen Hsieh , Kuang-Hua Lin , Jau-Han Ke
Abstract: A vapor chamber structure for heat dissipation of a heat source is provided. The vapor chamber structure includes a housing having a heat absorption side and a heat dissipation side, a first capillary structure disposed in the housing, and a working fluid filled in the housing. The first capillary structure is formed into cavities isolated from each other, and each of the cavities is connected between the heat absorption side and the heat dissipation side. Heat generated by the heat source is absorbed by the heat absorption side, thereby transforming the working fluid from liquid state to vapor state. The working fluid in the vapor state is transmitted to the heat dissipation side via the cavities, and is transformed to the liquid state while the heat is dissipated. The working fluid in the liquid state returns to the heat absorption side via the first capillary structure.
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公开(公告)号：US12140159B2
公开(公告)日：2024-11-12
申请号：US18407486
申请日：2024-01-09
Applicant: Acer Incorporated
Inventor： Tsung-Ting Chen , Wen-Neng Liao , Cheng-Wen Hsieh , Yu-Ming Lin , Wei-Chin Chen , Chun-Chieh Wang , Shu-Hao Kuo
Abstract: A heat dissipation system of an electronic device including a body, a plurality of heat sources disposed in the body, and at least one centrifugal heat dissipation fan disposed in the body is provided. The centrifugal heat dissipation fan includes a housing and an impeller disposed in the housing on an axis. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions, and the plurality of outlets respectively correspond to the plurality of heat sources.
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Patent Agency Ranking
公开(公告)号：US12025382B2
公开(公告)日：2024-07-02
申请号：US17325217
申请日：2021-05-20
Applicant: Acer Incorporated
Inventor： Chun-Chieh Wang , Wen-Neng Liao , Cheng-Wen Hsieh , Kuang-Hua Lin , Jau-Han Ke
CPC classification number: F28D15/046 , H05K7/20336 , F28D2021/0028
Abstract: A vapor chamber structure for heat dissipation of a heat source is provided. The vapor chamber structure includes a housing having a heat absorption side and a heat dissipation side, a first capillary structure disposed in the housing, and a working fluid filled in the housing. The first capillary structure is formed into cavities isolated from each other, and each of the cavities is connected between the heat absorption side and the heat dissipation side. Heat generated by the heat source is absorbed by the heat absorption side, thereby transforming the working fluid from liquid state to vapor state. The working fluid in the vapor state is transmitted to the heat dissipation side via the cavities, and is transformed to the liquid state while the heat is dissipated. The working fluid in the liquid state returns to the heat absorption side via the first capillary structure.
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公开(公告)号：US11775034B2
公开(公告)日：2023-10-03
申请号：US17572634
申请日：2022-01-11
Applicant: Acer Incorporated
Inventor： Tsung-Ting Chen , Wen-Neng Liao , Cheng-Wen Hsieh , Yu-Ming Lin , Wei-Chin Chen , Kuang-Hua Lin , Chun-Chieh Wang , Shu-Hao Kuo
CPC classification number: G06F1/203 , H05K7/20145 , H05K7/20163
Abstract: A heat dissipation system of a portable electronic device is provided. The heat dissipation system includes a body and at least one fan. A heat source of the portable electronic device is disposed in the body. The fan is a centrifugal fan disposed in the body. The fan has at least one flow inlet, at least one flow outlet, and at least one spacing portion. The flow outlet faces toward the heat source, and the spacing portion surrounds the flow inlet and abuts against the body, so as to isolate the flow inlet and the heat source in two spaces independent of each other in the body.
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公开(公告)号：US20220342455A1
公开(公告)日：2022-10-27
申请号：US17724453
申请日：2022-04-19
Applicant: Acer Incorporated
Inventor： Chun-Chieh Wang , Wen-Neng Liao , Cheng-Wen Hsieh , Chuan-Hua Wang , Yi-Ta Huang
Abstract: A portable electronic device including a first body, a second body, a pivot element, a heat source, a first flexible heat conductive element, and a flip cover is provided. The pivot element is connected to the second body, and the second body is pivotally connected to the first body through the pivot element. The heat source is disposed in the first body. The first flexible heat conductive element is thermally coupled to the heat source and extends toward the pivot element from the heat source. The first flexible heat conductive element passes through the pivot element and extends into the inside of the second body and is thus thermally coupled to the second body. The flip cover is pivotally connected to the first body and located on a moving path of the pivot element.
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公开(公告)号：US20220325962A1
公开(公告)日：2022-10-13
申请号：US17711069
申请日：2022-04-01
Applicant: Acer Incorporated
Inventor： Yu-Ming Lin , Wen-Neng Liao , Cheng-Wen Hsieh , Chun-Chieh Wang , Tsung-Ting Chen , Chi-Tai Ho , Kuan-Lin Chen , Jau-Han Ke
Abstract: A multi-loop cycling heat dissipation module including a first tank, a first pipe, a second tank, and a second pipe is provided. The first pipe is connected to the first tank to form a first loop, a first working fluid fills the first loop to transfer heat via phase transformation, and a first high-temperature section and a first low-temperature section are formed on the first pipe. The second pipe is connected to the second tank to form a second loop, a second working fluid fills the second loop to transfer heat via phase transformation, and a second high-temperature section and a second low-temperature section are formed on the second pipe. The first high-temperature section is in thermal contact with the second low-temperature section, and the first low-temperature section is in thermal contact with the second high-temperature section.
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公开(公告)号：US20220132700A1
公开(公告)日：2022-04-28
申请号：US17471176
申请日：2021-09-10
Applicant: Acer Incorporated
Inventor： Tsung-Ting Chen , Wen-Neng Liao , Cheng-Wen Hsieh , Yu-Ming Lin , Wei-Chin Chen , Kuang-Hua Lin , Chun-Chieh Wang , Shu-Hao Kuo
IPC: H05K7/20
Abstract: A heat dissipation system of portable electronic device includes a body, at least one fan and at least one spacing member. At least one heat source of the portable electronic device is arranged in the body. The fan is a centrifugal fan disposed in the body. The fan has at least one flow inlet located in the axial direction and at least one flow outlet located in the radial direction. The spacing member is disposed on at least one of the body or the fan to form a stratified air flow in the body along the axial direction. The stratified air flows into the fan through the flow inlet and out of the fan through the flow outlet respectively.
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