公开(公告)号：US20030042006A1

公开(公告)日：2003-03-06

申请号：US10229831

申请日：2002-08-28

Applicant: Advanced Materials Technologies Pte. Ltd.

Inventor： Randall M. German ,  Lye-King Tan ,  John Johnson

IPC: F28F007/00 ,  F28D015/00 ,  B23P006/00

CPC classification number: H01L23/427 ,  F28D15/0275 ,  F28D2015/0225 ,  H01L21/4871 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

Abstract: Heat dissipation during the operation of integrated circuit chips is an old problem that continues to get worse. The present invention significantly ameliorates this by placing an embedded heat pipe directly beneath the chip. Using powder injection molding, the lower portion of the package is formed first as an initial green part which includes one or more cavities. The latter are then lined with a feedstock that is designed to produce a porous material after sintering, at which time a working fluid is introduced into the porous cavities and sealed, thereby forming one or more heat pipes located directly below the chip. The latter is then sealed inside an enclosure. During operation, heat generated by the chip is efficiently transferred to points outside the enclosure. A process for manufacturing the structure is also described.

Abstract translation: 集成电路芯片运行过程中的散热是一个不断恶化的老问题。 本发明通过将嵌入的热管直接放置在芯片的正下方而显着地改善了这一点。 使用粉末注射成型，首先将包装的下部形成为包括一个或多个空腔的初始绿色部分。 然后，后者衬有被设计成在烧结之后产生多孔材料的原料，此时将工作流体引入多孔孔并密封，由此形成位于芯片正下方的一个或多个热管。 然后将后者密封在外壳内。 在操作期间，由芯片产生的热量有效地传递到外壳外部的点。 还描述了用于制造该结构的方法。

公开(公告)号：US20020071781A1

公开(公告)日：2002-06-13

申请号：US09960908

申请日：2001-09-24

Applicant: Advanced Materials Technologies Pte., Ltd

Inventor： Kay Leong Lim ,  Lye-King Tan ,  Eng-Seng Tan ,  Robin Baumgartner

IPC: B22F007/02

CPC classification number: B22F3/225 ,  B21C3/02 ,  B22F5/00 ,  B22F7/06 ,  B22F7/062 ,  B22F2998/00 ,  B22F2998/10 ,  H01F1/22 ,  B22F5/007 ,  B22F5/10 ,  B22F2207/20 ,  B22F3/02 ,  B22F3/22

Abstract: The invention shows how powder injection molding may be used to form a continuous body having multiple parts, each of which has different functional properties such as corrosion resistance or hardness, there being no connective materials such as solder or glue between the parts. This is accomplished through careful control of the relative shrinkage rates of these various parts. Although there is no limit to how many parts with different functional properties can make up an object, special attention is paid to certain pairs of functional properties that are difficult and/or expensive to combine in a single object when other manufacturing means are used.

Abstract translation: 本发明示出了如何使用粉末注射成型来形成具有多个部分的连续体，每个部分具有不同的功能性质如耐腐蚀性或硬度，在部件之间不存在诸如焊料或粘合剂的连接材料。 这是通过仔细控制这些各个部件的相对收缩率来实现的。 尽管对于具有不同功能性质的多个部件可以组成一个对象没有限制，但是特别注意在使用其它制造装置时在单个对象中组合的某些功能特性对很困难和/或昂贵。

公开(公告)号：US20030039571A1

公开(公告)日：2003-02-27

申请号：US09940049

申请日：2001-08-27

Applicant: Advanced Materials Technologies Pte., Ltd.

Inventor： Kay-Leong Lim ,  Lye-King Tan ,  Eng-Seng Tan

IPC: B22F007/06

CPC classification number: B22F3/225 ,  B22F7/06 ,  B22F7/062 ,  B22F2998/00 ,  B22F2998/10 ,  H01L21/4807 ,  H01L23/367 ,  H01L2924/0002 ,  Y10T428/12028 ,  B22F5/10 ,  B22F3/22 ,  B22F3/02 ,  B22F3/1021 ,  H01L2924/00

Abstract: A method to form a combined enclosure and heat sink structure for a semiconductor device is achieved. A first feedstock comprising a first mixture of powdered metal materials, lubricants, and binders is prepared. A second feedstock comprising a second mixture of powdered metal materials, lubricants, and binders is prepared such that the difference between the sintering shrinkage of each of the first and second feedstocks is less than 1%. The first and second feedstocks are pressed to form a first green part having an enclosure shape and a second green part having a heat sink shape. The lubricants and the binders from said first and second green parts are removed to form a first powdered skeleton and a second powdered skeleton. The first and second powdered skeletons are sintered to complete the combined enclosure and heat sink structure. The first and second powdered skeletons are in intimate contact during the sintering. Optionally, at least one hollow cooling channel is formed in the combine structure by burning away a fugitive plastic structure during the sintering process.

Abstract translation: 实现了形成用于半导体器件的组合外壳和散热器结构的方法。 制备包含粉末金属材料，润滑剂和粘合剂的第一混合物的第一原料。 制备包含粉末金属材料，润滑剂和粘合剂的第二混合物的第二原料，使得第一和第二原料中的每一种的烧结收缩率之间的差异小于1％。 第一和第二原料被压制以形成具有外壳形状的第一生坯部分和具有散热器形状的第二生坯部件。 去除来自所述第一和第二绿色部分的润滑剂和粘合剂以形成第一粉末骨架和第二粉末骨架。 第一和第二粉状骨架被烧结以完成组合的外壳和散热器结构。 第一和第二粉状骨架在烧结过程中紧密接触。 可选地，在烧结过程中，通过烧掉一个短暂的塑料结构，在组合结构中形成至少一个空心冷却通道。

公开(公告)号：US20030170137A1

公开(公告)日：2003-09-11

申请号：US10095272

申请日：2002-03-11

Applicant: Advanced Materials Technologies Pte Ltd.

Inventor： Chee-Tian Yeo ,  Lye-King Tan

IPC: B22F003/10

CPC classification number: C22C1/058 ,  B22F3/1003 ,  B22F3/1035 ,  B22F2998/00 ,  B22F2998/10 ,  B22F2999/00 ,  C22C32/0063 ,  C22C32/0089 ,  B22F1/0014 ,  B22F3/1025 ,  B22F3/225 ,  B22F3/1021

Abstract: Although MIM (metal injection molding) has received widespread application, aluminum has not been widely used for MIM in the prior art because of the tough oxide layer that grows on aluminum particles, thus preventing metal-metal bonding between the particles. The present invention solves this problem by adding a small amount of material that forms a eutectic mixture with aluminum oxide, and therefore aids sintering, to reduce the oxide, thereby allowing intimate contact between aluminum surfaces. The process includes the ability to mold and then sinter the feedstock into the form of compacted items of intricate shapes, small sizes (if needed), and densities of about 95% of bulk.

Abstract translation: 虽然MIM（金属注射成型）已经得到广泛应用，但是由于在铝颗粒上生长的韧性氧化物层，因此铝在现有技术中尚未广泛用于MIM，从而防止颗粒之间的金属 - 金属结合。 本发明通过添加少量与氧化铝形成共晶混合物的材料来解决该问题，因此有助于烧结以减少氧化物，从而允许铝表面之间的紧密接触。 该方法包括将原料模塑并随后烧结成复杂形状，小尺寸（如果需要）和压实体积约95％的压实物品的形式的能力。