Abstract:
In a complex semiconductor device including embedded memories, the round trip latency may be determined during a memory self-test by applying a ping signal having the same latency as control and failure signals used during the self-test. The ping signal may be used for controlling an operation counter in order to obtain a reliable correspondence between the counter value and a memory operation causing a specified memory failure.
Abstract:
In a complex semiconductor device including embedded memories, the round trip latency may be determined during a memory self-test by applying a ping signal having the same latency as control and failure signals used during the self-test. The ping signal may be used for controlling an operation counter in order to obtain a reliable correspondence between the counter value and a memory operation causing a specified memory failure.
Abstract:
Integrated circuits with memory built-in self test (MBIST) circuitry and methods are disclosed that employ enhanced features. In one aspect of the invention, an integrated circuit is provided having MIBST circuitry configured to serially test multiple arrays of memory elements within a component of the integrated circuit and to also conduct parallel initialization of the serially tested arrays. In another aspect of the invention, the MBST circuitry is used set the memory elements of the arrays to a first state and then to an inverse state during a burn-in operation to maintain each of the two opposing states for a desired time in order to either force a failure of the integrated circuit component or produce a pre-stressed component beyond an infancy stage.
Abstract:
Integrated circuits with memory built-in self test (MBIST) circuitry and methods are disclosed that employ enhanced features. In one aspect of the invention, an integrated circuit is provided having MIBST circuitry configured to serially test multiple arrays of memory elements within a component of the integrated circuit and to also conduct parallel initialization of the serially tested arrays. In another aspect of the invention, the MBST circuitry is used set the memory elements of the arrays to a first state and then to an inverse state during a burn-in operation to maintain each of the two opposing states for a desired time in order to either force a failure of the integrated circuit component or produce a pre-stressed component beyond an infancy stage.