公开(公告)号：US11277917B2

公开(公告)日：2022-03-15

申请号：US16351026

申请日：2019-03-12

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： Yu-Ju Liao ,  Chien-Fan Chen ,  Chien-Hao Wang ,  I-Chia Lin

IPC: H05K1/18 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498

Abstract: An embedded component package structure including a circuit substrate, an embedded component and a stress compensation layer is provided. The circuit substrate includes a core layer and an asymmetric circuit structure, and the core layer has a first thickness. The embedded component is disposed in the core layer. The stress compensation layer is disposed on one side of the core layer, and the stress compensation layer has a second thickness between 4 μm and 351 μm.

公开(公告)号：US09871005B2

公开(公告)日：2018-01-16

申请号：US14990366

申请日：2016-01-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： I-Chia Lin ,  Chieh-Chen Fu ,  Kuo Hsien Liao ,  Cheng-Nan Lin

IPC: H01L23/552

CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L24/97 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/81

Abstract: A semiconductor device package includes a carrier, an electronic component disposed over a top surface of the carrier, and a package body disposed over the top surface of the carrier and covering the electronic component. The semiconductor device package further includes a shield layer, which in turn includes a first electrically conductive layer, a first magnetically permeable layer, and a second electrically conductive layer, where the first magnetically permeable layer is interposed between and directly contacts the first electrically conductive layer and the second electrically conductive layer.

公开(公告)号：US09269673B1

公开(公告)日：2016-02-23

申请号：US14521342

申请日：2014-10-22

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： I-Chia Lin ,  Chieh-Chen Fu ,  Kuo-Hsien Liao ,  Cheng-Nan Lin

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/60

CPC classification number: H01L23/552 ,  H01L23/13 ,  H01L23/31 ,  H01L23/3121 ,  H01L23/49805 ,  H01L23/49822 ,  H01L24/97 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/81005 ,  H01L2224/85005 ,  H01L2224/97 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00012

Abstract: A semiconductor device package includes a substrate, at least one component, a package body, a first conductive layer, a first shielding layer, a second shielding layer and a second conductive layer. The component is disposed on a first surface of the substrate. The package body is disposed on the first surface of the substrate and covers the component. The first conductive layer covers the package body and at least a portion of the substrate. The first shielding layer covers the first conductive layer and has a first thickness and includes a high conductivity material. The second shielding layer covers the first shielding layer and has a second thickness and includes a high permeability material. A ratio of the first thickness to the second thickness being in a range of 0.2 to 3. The second conductive layer covers the second shielding layer.

Abstract translation: 半导体器件封装包括衬底，至少一个部件，封装体，第一导电层，第一屏蔽层，第二屏蔽层和第二导电层。 该部件设置在基板的第一表面上。 包装体设置在基板的第一表面上并覆盖该部件。 第一导电层覆盖封装主体和衬底的至少一部分。 第一屏蔽层覆盖第一导电层并且具有第一厚度并且包括高导电性材料。 第二屏蔽层覆盖第一屏蔽层并且具有第二厚度并且包括高磁导率材料。 第一厚度与第二厚度的比率在0.2至3的范围内。第二导电层覆盖第二屏蔽层。

公开(公告)号：US10431554B2

公开(公告)日：2019-10-01

申请号：US15871805

申请日：2018-01-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： I-Chia Lin ,  Chieh-Chen Fu ,  Kuo Hsien Liao ,  Cheng-Nan Lin

IPC: H01L23/552 ,  H01L23/00 ,  H01L21/56

Abstract: A semiconductor device package includes: (1) a carrier; (2) an electronic component disposed over a top surface of the carrier; (3) a package body disposed over the top surface of the carrier and covering the electronic component; and (4) a shield layer, including a first magnetically permeable layer disposed over the package body, a first electrically conductive layer disposed over the first magnetically permeable layer, and a second magnetically permeable layer disposed over the first electrically conductive layer. The first electrically conductive layer is interposed between the first magnetically permeable layer and the second magnetically permeable layer. A permeability of the first electrically conductive layer is different from a permeability of the first magnetically permeable layer and a permeability of the second magnetically permeable layer.