Light emitting diode communication device, method of forming and operating the same

    公开(公告)号:US10826608B2

    公开(公告)日:2020-11-03

    申请号:US16855725

    申请日:2020-04-22

    Abstract: Various embodiments may relate to a light emitting diode (LED) communication device including a communication interface configured to couple with an electronic device. The LED communication device may also include an electrical interface electrically coupled to the communication interface. The LED communication device may further include a light emitting diode electrically coupled to the electrical interface. The electrical interface may be configured to convert data signals received from the electronic device into driving signals transmitted to the light emitting diode during uplink, and to convert sensing signals received from the light emitting diode into data signals transmitted to the electronic device during downlink. The light emitting diode may be configured to convert the driving signals received from the electrical interface into a plurality of light pulses during uplink, and to convert a plurality of light pulses received by the light emitting diode into the sensing signals during downlink.

    Light emitting diode communication device, method of forming and operating the same

    公开(公告)号:US10666357B2

    公开(公告)日:2020-05-26

    申请号:US16349812

    申请日:2017-11-01

    Abstract: Various embodiments may relate to a light emitting diode (LED) communication device including a communication interface configured to couple with an electronic device. The LED communication device may also include an electrical interface electrically coupled to the communication interface. The LED communication device may further include a light emitting diode electrically coupled to the electrical interface. The electrical interface may be configured to convert data signals received from the electronic device into driving signals transmitted to the light emitting diode during uplink, and to convert sensing signals received from the light emitting diode into data signals transmitted to the electronic device during downlink. The light emitting diode may be configured to convert the driving signals received from the electrical interface into a plurality of light pulses during uplink, and to convert a plurality of light pulses received by the light emitting diode into the sensing signals during downlink.

    LIGHT EMITTING DIODE COMMUNICATION DEVICE, METHOD OF FORMING AND OPERATING THE SAME

    公开(公告)号:US20190363791A1

    公开(公告)日:2019-11-28

    申请号:US16349812

    申请日:2017-11-01

    Abstract: Various embodiments may relate to a light emitting diode (LED) communication device including a communication interface configured to couple with an electronic device. The LED communication device may also include an electrical interface electrically coupled to the communication interface. The LED communication device may further include a light emitting diode electrically coupled to the electrical interface. The electrical interface may be configured to convert data signals received from the electronic device into driving signals transmitted to the light emitting diode during uplink, and to convert sensing signals received from the light emitting diode into data signals transmitted to the electronic device during downlink The light emitting diode may be configured to convert the driving signals received from the electrical interface into a plurality of light pulses during uplink, and to convert a plurality of light pulses received by the light emitting diode into the sensing signals during downlink.

    LIGHT EMITTING DIODE COMMUNICATION DEVICE, METHOD OF FORMING AND OPERATING THE SAME

    公开(公告)号:US20200259564A1

    公开(公告)日:2020-08-13

    申请号:US16855725

    申请日:2020-04-22

    Abstract: Various embodiments may relate to a light emitting diode (LED) communication device including a communication interface configured to couple with an electronic device. The LED communication device may also include an electrical interface electrically coupled to the communication interface. The LED communication device may further include a light emitting diode electrically coupled to the electrical interface. The electrical interface may be configured to convert data signals received from the electronic device into driving signals transmitted to the light emitting diode during uplink, and to convert sensing signals received from the light emitting diode into data signals transmitted to the electronic device during downlink. The light emitting diode may be configured to convert the driving signals received from the electrical interface into a plurality of light pulses during uplink, and to convert a plurality of light pulses received by the light emitting diode into the sensing signals during downlink.

    HIGH SPEED SURFACE PLASMON COUPLED LIGHT EMITTING DIODES
    7.
    发明申请
    HIGH SPEED SURFACE PLASMON COUPLED LIGHT EMITTING DIODES 有权
    高速表面等离子体偶联发光二极管

    公开(公告)号:US20160087143A1

    公开(公告)日:2016-03-24

    申请号:US14787122

    申请日:2014-04-28

    Abstract: A light emitting diode device (LED) is provided. The LED comprises a first-doped layer on a substrate, an active layer on the first-doped layer, a second-doped layer on the active layer, and a metal layer on the second-doped layer. The second-doped layer is patterned on a surface opposite to the active layer to define a first portion and a second portion. The first portion of the second-doped layer has a first portion thickness constrained for electron-hole pairs in the active layer to couple efficiently to a surface plasmon mode at an interface of the metal layer and the second-doped layer thereby increasing the spontaneous emission rate of the LED. The second portion of the second-doped layer has a second portion thickness sufficient to ensure formation of a p-n junction in the LED.

    Abstract translation: 提供了一种发光二极管器件(LED)。 LED包括衬底上的第一掺杂层,第一掺杂层上的有源层,有源层上的第二掺杂层和第二掺杂层上的金属层。 第二掺杂层在与有源层相对的表面上被图案化以限定第一部分和第二部分。 第二掺杂层的第一部分具有受限于有源层中的电子 - 空穴对的第一部分厚度,以有效地耦合到金属层和第二掺杂层的界面处的表面等离子体模式,从而增加自发发射 LED的速率。 第二掺杂层的第二部分具有足以确保在LED中形成p-n结的第二部分厚度。

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