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1.发明申请公开(公告)号：US20080239617A1
公开(公告)日：2008-10-02
申请号：US12055372
申请日：2008-03-26
申请人： Akihiro MOTOKI , Kenichi KAWASAKI , Makoto OGAWA , Shigeyuki KURODA , Shunsuke TAKEUCHI , Hideyuki KASHIO
发明人： Akihiro MOTOKI , Kenichi KAWASAKI , Makoto OGAWA , Shigeyuki KURODA , Shunsuke TAKEUCHI , Hideyuki KASHIO
摘要： A method for manufacturing a laminated ceramic capacitor includes a step of preparing a laminate which has a first principal surface, a second principal surface, a first end surface, a second end surface, a first side surface, and a second side surface and which includes insulating layers and internal electrodes having end portions exposed at the first or second end surface; a step of forming external electrodes on the first and second end surfaces such that plating deposits are formed on the exposed end portions of the internal electrodes so as to be connected to each other; and a step of forming thick end electrodes electrically connected to the external electrodes such that a conductive paste is applied onto edge portions of the first and second principal surfaces and first and second side surfaces of the laminate and then baked.
摘要翻译： 层压陶瓷电容器的制造方法包括：制备具有第一主表面，第二主表面，第一端面，第二端面，第一侧表面和第二侧表面的层压体的步骤， 绝缘层和具有在第一或第二端面露出的端部的内部电极; 在所述第一和第二端面上形成外部电极的步骤，使得在所述内部电极的所述暴露端部上形成电镀沉积物以彼此连接; 以及形成与外部电极电连接的厚端电极的步骤，使得将导电浆料施加到层压体的第一和第二主表面和第一和第二侧表面的边缘部分上，然后烘烤。
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2.发明申请公开(公告)号：US20110162180A1
公开(公告)日：2011-07-07
申请号：US13051013
申请日：2011-03-18
申请人： Akihiro MOTOKI , Kenichi KAWASAKI , Makoto OGAWA , Shigeyuki KURODA , Shunsuke TAKEUCHI , Hideyuki KASHIO
发明人： Akihiro MOTOKI , Kenichi KAWASAKI , Makoto OGAWA , Shigeyuki KURODA , Shunsuke TAKEUCHI , Hideyuki KASHIO
摘要： A method for manufacturing a laminated ceramic capacitor includes a step of preparing a laminate which has a first principal surface, a second principal surface, a first end surface, a second end surface, a first side surface, and a second side surface and which includes insulating layers and internal electrodes having end portions exposed at the first or second end surface; a step of forming external electrodes on the first and second end surfaces such that plating deposits are formed on the exposed end portions of the internal electrodes so as to be connected to each other; and a step of forming thick end electrodes electrically connected to the external electrodes such that a conductive paste is applied onto edge portions of the first and second principal surfaces and first and second side surfaces of the laminate and then baked.
摘要翻译： 层压陶瓷电容器的制造方法包括：制备具有第一主表面，第二主表面，第一端面，第二端面，第一侧表面和第二侧表面的层压体的步骤， 绝缘层和具有在第一或第二端面露出的端部的内部电极; 在所述第一和第二端面上形成外部电极的步骤，使得在所述内部电极的所述暴露端部上形成电镀沉积物以彼此连接; 以及形成与外部电极电连接的厚端电极的步骤，使得将导电浆料施加到层压体的第一和第二主表面和第一和第二侧表面的边缘部分上，然后烘烤。
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公开(公告)号：US20130095233A1
公开(公告)日：2013-04-18
申请号：US13439916
申请日：2012-04-05
IPC分类号： B05D5/12
CPC分类号： H01C7/008 , B05D5/12 , H01F27/2804 , H01G4/005 , H01G4/012 , H01G4/228 , H01G4/2325 , H01G4/30 , H01G4/308 , H01L41/083
摘要： A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.
摘要翻译： 一种多层电子部件的制造方法，其特征在于，具有：制造层叠绝缘层的多个层叠体和沿着绝缘层的界面配置的多个内部电极的层叠体的工序，在所述层叠体的规定表面露出内部电极的边缘 并且在所述预定表面上形成外部电极以电连接所述内部电极的边缘。 形成外部电极的步骤包括：电镀步骤，通过在暴露于预定表面的内部电极的边缘上沉积电镀沉积物并且通过进行电镀生长彼此连接来形成连续的镀膜;以及热处理步骤 在约5ppm或更低的氧分压和约600℃或更高的温度下进行热处理。
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公开(公告)号：US20080210564A1
公开(公告)日：2008-09-04
申请号：US12110484
申请日：2008-04-28
CPC分类号： H01C7/008 , B05D5/12 , H01F27/2804 , H01G4/005 , H01G4/012 , H01G4/228 , H01G4/2325 , H01G4/30 , H01G4/308 , H01L41/083
摘要： A method for manufacturing a multilayer electronic component, includes the steps of preparing a laminate including a plurality of insulating layers laminated to each other and a plurality of internal electrodes formed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface so as to electrically connect the edges of the internal electrodes, which are exposed at the predetermined surface of the laminate. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface of the laminate which is prepared in the step of preparing a laminate and by performing plating growth of the plating deposits so as to be connected to each other, and a heat treatment step of performing a heat treatment on the laminate provided with the plating film formed thereon at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.
摘要翻译： 一种多层电子部件的制造方法，其特征在于，包括以下步骤：层叠多个绝缘层的层叠体，以及沿着所述绝缘层的界面形成的多个内部电极，以预定的方式露出所述内部电极的边缘 表面，并且在预定表面上形成外部电极，以便电连接在层压体的预定表面处暴露的内部电极的边缘。 形成外部电极的步骤包括：电镀步骤，通过在制备层压体的步骤中制备的层压体的预定表面处暴露在内部电极的边缘上沉积电镀沉积物形成连续的镀膜，并进行电镀 电镀沉积物的生长以彼此连接;以及热处理步骤，对形成在其上的镀膜的层压体在氧分压为约5ppm以下，温度为 约600℃以上。
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公开(公告)号：US20080225462A1
公开(公告)日：2008-09-18
申请号：US12109371
申请日：2008-04-25
CPC分类号： H01G4/2325 , H01G4/30 , Y10T29/435
摘要： A multilayer electronic device includes a laminate and an external electrode that is formed on an end surface of the laminate after a plurality of conductive particles having a particle diameter of about 1 μm or more is adhered to the end surface of the laminate, for example, by a sandblast method or a brush polishing method. The external electrode is defined by a plating film that is formed by electroplating or electroless plating.
摘要翻译： 例如，多层电子器件包括层压体和形成在层叠体的端面上的外部电极，该多个电子器件在层叠体的端面附着有多个粒径为1μm以上的导电粒子之后， 通过喷砂法或刷子抛光法。 外部电极由通过电镀或无电镀形成的镀膜限定。
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公开(公告)号：US20100118467A1
公开(公告)日：2010-05-13
申请号：US12616844
申请日：2009-11-12
IPC分类号： H01G4/228
CPC分类号： H01G4/232 , H01G4/2325 , H01G4/30
摘要： In a laminated ceramic electronic component, external terminal electrodes include plating films directly covering exposed portions of internal electrodes on end surfaces of a ceramic element assembly. On the boundaries between the end surfaces and principal surfaces of the ceramic element assembly, substantially rounded corners are provided, and the plating films are arranged such that the ends of the plating films stop at the corners and do not project from the principal surfaces.
摘要翻译： 在层叠陶瓷电子部件中，外部端子电极包括直接覆盖陶瓷元件组件的端面上的内部电极的露出部分的电镀膜。 在陶瓷元件组件的端面和主面之间的边界上，设置大致圆角，并且镀膜被布置成使得镀膜的端部停止在角部并且不从主表面突出。
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公开(公告)号：US20090323253A1
公开(公告)日：2009-12-31
申请号：US12490471
申请日：2009-06-24
申请人： Tatsunori KOBAYASHI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA , Shunsuke TAKEUCHI , Kenichi KAWASAKI
发明人： Tatsunori KOBAYASHI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA , Shunsuke TAKEUCHI , Kenichi KAWASAKI
CPC分类号： H01G4/005 , H01G4/232 , H01G4/30 , Y10T29/435
摘要： A multilayer ceramic electronic component includes external terminal electrodes that are formed by depositing metal plating films on exposed portions of internal conductors embedded in a ceramic body, depositing a copper plating films that cover the metal plating films and make contact with the ceramic body around the metal plating films, and heat-treating the ceramic body to generate a copper liquid phase, an oxygen liquid phase, and a copper solid phase between the copper plating films and the ceramic body. The mixed phase including these phases forms a region at which a copper oxide is present in a discontinuous manner inside the copper plating film at least at the interfaces between the ceramic body and the copper plating films. The copper oxide securely attaches the copper plating films to the ceramic body and enhances the bonding force of the external terminal electrodes.
摘要翻译： 多层陶瓷电子部件包括外部端子电极，其通过在嵌入陶瓷体的内部导体的露出部分上沉积金属电镀膜而形成，沉积覆盖金属电镀膜的铜电镀膜并与金属周围的陶瓷体接触 并对该陶瓷体进行热处理，以在铜镀膜和陶瓷体之间产生铜液相，氧液相，铜固相。 包括这些相的混合相至少在陶瓷体和镀铜膜之间的界面处形成铜镀层内不连续地存在氧化铜的区域。 铜氧化物将铜电镀膜牢固地附着在陶瓷体上，提高外部端子电极的结合力。
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公开(公告)号：US20120058257A1
公开(公告)日：2012-03-08
申请号：US13295151
申请日：2011-11-14
IPC分类号： B05D5/12
CPC分类号： H01G4/008 , H01G4/005 , H01G4/2325 , Y10T29/417 , Y10T29/43 , Y10T29/435
摘要： A laminated electronic component is configured to include substrate plating films disposed on outer surfaces of an electronic component main body through direct plating such that external terminal electrodes are connected to exposed portions of internal conductors (internal electrodes), and the average particle diameter of metal particles defining the substrate plating film is at least about 1.0 μm. The external terminal electrode includes at least one layer of an upper plating film disposed on the substrate plating film. The metal particles defining the substrate plating film are Cu particles.
摘要翻译： 层叠电子部件被配置为包括通过直接电镀设置在电子部件主体的外表面上的基板镀膜，使得外部端子电极与内部导体（内部电极）的露出部分连接，金属粒子的平均粒径 限定衬底镀膜至少约1.0μm。 外部端子电极包括设置在基板镀膜上的至少一层上镀层。 限定衬底镀膜的金属颗粒是Cu颗粒。
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公开(公告)号：US20090303655A1
公开(公告)日：2009-12-10
申请号：US12405399
申请日：2009-03-17
CPC分类号： H01G4/30 , H01G4/005 , H01G4/12 , H01G4/232 , Y10T29/435
摘要： A ceramic electronic component includes a ceramic body and a plurality of external electrodes disposed at a surface of the ceramic body. The external electrodes include a plating layer containing glass particles each coated with a metal film. The plating layer is formed by co-deposition of a plating metal and the metal-coated glass particles.
摘要翻译： 陶瓷电子部件包括陶瓷体和设置在陶瓷体的表面的多个外部电极。 外部电极包括含有各自涂覆有金属膜的玻璃颗粒的镀层。 镀层通过电镀金属和金属涂覆的玻璃颗粒的共沉积形成。
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公开(公告)号：US20100328843A1
公开(公告)日：2010-12-30
申请号：US12821305
申请日：2010-06-23
申请人： Masahito SARUBAN , Makoto OGAWA , Toshiyuki IWANAGA , Seiichi MATSUMOTO , Akihiro MOTOKI , Shunsuke TAKEUCHI , Seiichi NISHIHARA , Kenichi KAWASAKI
发明人： Masahito SARUBAN , Makoto OGAWA , Toshiyuki IWANAGA , Seiichi MATSUMOTO , Akihiro MOTOKI , Shunsuke TAKEUCHI , Seiichi NISHIHARA , Kenichi KAWASAKI
CPC分类号： H01G4/2325 , H01G4/30 , H01L41/083 , H01L41/293
摘要： In a method for manufacturing a laminated ceramic electronic component, after a plating layer for an external terminal electrode is formed by applying copper plating to an end surface of a component main body at which respective ends of a plurality of internal electrodes primarily including nickel are exposed, when a heat treatment at a temperature of about 800° C. or more is applied in order to improve adhesion strength and resistance to moisture of the external terminal electrode, voids may occur in the plating layer. The step of applying a heat treatment at a temperature of about 800° C. or more to a component main body with plating layers formed thereon includes not only a step of maintaining a top temperature of about 1000° C. or more but also a step of maintaining a temperature of about 600° C. to 900° C. at least once before the step of maintaining the top temperature. These steps preliminarily diffuse copper included in the plating layers, which has a relatively high diffusion velocity, into the internal electrodes primarily including nickel, thereby reducing a difference in diffusion velocity between copper and nickel at the top temperature, which causes the occurrence of voids.
摘要翻译： 在层叠陶瓷电子部件的制造方法中，在将外部端子电极的镀覆层通过在主体的主体的多个内部电极的各端露出的部件主体的端面上进行镀铜而形成后， 为了提高外部端子电极的附着强度和耐潮湿性而在800℃以上的温度下进行热处理时，可能会在镀层中产生空隙。 在其上形成有镀层的组件主体上，在约800℃以上的温度下进行热处理的步骤不仅包括保持顶部温度为约1000℃以上的步骤，还包括步骤 在保持顶部温度的步骤之前至少保持约600℃至900℃的温度。 这些步骤将包含在具有较高扩散速度的镀层中的铜初步扩散到主要包括镍的内部电极中，从而减少了在最高温度下铜和镍之间扩散速度的差异，这导致空隙的发生。
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