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公开(公告)号：US20100328843A1
公开(公告)日：2010-12-30
申请号：US12821305
申请日：2010-06-23
申请人： Masahito SARUBAN , Makoto OGAWA , Toshiyuki IWANAGA , Seiichi MATSUMOTO , Akihiro MOTOKI , Shunsuke TAKEUCHI , Seiichi NISHIHARA , Kenichi KAWASAKI
发明人： Masahito SARUBAN , Makoto OGAWA , Toshiyuki IWANAGA , Seiichi MATSUMOTO , Akihiro MOTOKI , Shunsuke TAKEUCHI , Seiichi NISHIHARA , Kenichi KAWASAKI
CPC分类号： H01G4/2325 , H01G4/30 , H01L41/083 , H01L41/293
摘要： In a method for manufacturing a laminated ceramic electronic component, after a plating layer for an external terminal electrode is formed by applying copper plating to an end surface of a component main body at which respective ends of a plurality of internal electrodes primarily including nickel are exposed, when a heat treatment at a temperature of about 800° C. or more is applied in order to improve adhesion strength and resistance to moisture of the external terminal electrode, voids may occur in the plating layer. The step of applying a heat treatment at a temperature of about 800° C. or more to a component main body with plating layers formed thereon includes not only a step of maintaining a top temperature of about 1000° C. or more but also a step of maintaining a temperature of about 600° C. to 900° C. at least once before the step of maintaining the top temperature. These steps preliminarily diffuse copper included in the plating layers, which has a relatively high diffusion velocity, into the internal electrodes primarily including nickel, thereby reducing a difference in diffusion velocity between copper and nickel at the top temperature, which causes the occurrence of voids.
摘要翻译： 在层叠陶瓷电子部件的制造方法中，在将外部端子电极的镀覆层通过在主体的主体的多个内部电极的各端露出的部件主体的端面上进行镀铜而形成后， 为了提高外部端子电极的附着强度和耐潮湿性而在800℃以上的温度下进行热处理时，可能会在镀层中产生空隙。 在其上形成有镀层的组件主体上，在约800℃以上的温度下进行热处理的步骤不仅包括保持顶部温度为约1000℃以上的步骤，还包括步骤 在保持顶部温度的步骤之前至少保持约600℃至900℃的温度。 这些步骤将包含在具有较高扩散速度的镀层中的铜初步扩散到主要包括镍的内部电极中，从而减少了在最高温度下铜和镍之间扩散速度的差异，这导致空隙的发生。
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公开(公告)号：US20100149724A1
公开(公告)日：2010-06-17
申请号：US12631924
申请日：2009-12-07
CPC分类号： H01G4/00 , C23C18/1632 , C23C18/1657 , C23C18/31 , C25D1/00 , C25D1/10 , H01G4/232 , H01G4/30 , H01G13/006 , Y10T29/43
摘要： A method for producing a laminated ceramic capacitor allows a surface of at least a portion of a ceramic element body chip to be brought into contact with a plated layer formed in advance in a mold member, and performs heat processing on the ceramic element body chip in that contact state, thereby to form an external conductor layer made of the plated layer on the surface of at least the portion of the ceramic element body chip. Thus, a method and an apparatus for producing a ceramic electronic component accurately and precisely controls the thickness of the external conductor layer to be small, and easily controls the length of the external conductor layer.
摘要翻译： 陶瓷电容器的制造方法使陶瓷元件体芯片的至少一部分的表面与预先形成在模具部件中的镀层接触，并对陶瓷元件体芯片进行热处理 从而在陶瓷元件主体芯片的至少一部分的表面上形成由镀层形成的外部导体层。 因此，陶瓷电子部件的制造方法和装置精确而精确地控制外部导体层的厚度小，并且容易控制外部导体层的长度。
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公开(公告)号：US20100157507A1
公开(公告)日：2010-06-24
申请号：US12632823
申请日：2009-12-08
摘要： A region where a plating film constituting an external electrode is formed can be accurately controlled in an electronic component in which the external electrode is formed by directly plating a particular region in a surface of a component body. In a component body, a bump is provided in a position in which a region where an external electrode should be formed is partitioned. In a plating process, growth of the plating film constituting the external electrode is substantially stopped or delayed in the bump. As a result, a termination point of the growth of the plating film constituting the external electrode can be accurately controlled in the position of the bump.
摘要翻译： 在形成外部电极的电子部件中，通过直接对构成体的表面的特定区域进行电镀，能够精确地控制形成有构成外部电极的镀膜的区域。 在构成体中，在形成有外部电极的区域被分隔的位置设置凸块。 在电镀工艺中，构成外部电极的镀膜的生长在凸块中基本上停止或延迟。 结果，可以在凸块的位置上精确地控制构成外部电极的镀膜的生长终止点。
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公开(公告)号：US20110290542A1
公开(公告)日：2011-12-01
申请号：US13115243
申请日：2011-05-25
申请人： Yasuhiro NISHISAKA , Yukio SANADA , Koji SATO , Seiichi MATSUMOTO
发明人： Yasuhiro NISHISAKA , Yukio SANADA , Koji SATO , Seiichi MATSUMOTO
CPC分类号： H05K1/182 , H01C7/008 , H01F27/28 , H01F27/2804 , H01G4/008 , H01G4/12 , H01G4/232 , H01G4/30 , H01L41/083 , H01L41/1876
摘要： A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.
摘要翻译： 陶瓷电子部件包括陶瓷元件组件和外部电极。 外部电极设置在陶瓷元件组件上。 外部电极包括下面的电极层和第一个Cu镀膜。 底层电极层设置在陶瓷元件组件上。 第一Cu镀膜设置在下面的电极层上。 底层电极层包括可在Cu中扩散的金属和陶瓷接合材料。 在Cu中可扩散的金属在第一Cu镀膜的下面的电极层侧的至少一个表面层中扩散。
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公开(公告)号：US20120247211A1
公开(公告)日：2012-10-04
申请号：US13431022
申请日：2012-03-27
IPC分类号： G01N29/00
CPC分类号： G01N29/30 , G01B17/025 , G01N29/024 , G01N29/028 , G01N2291/0237 , G01N2291/02854
摘要： An ultrasonic measuring method and an ultrasonic measuring system use or include at least one actual-measurement ultrasonic sensor set each consisting of a first ultrasonic sensor and a second ultrasonic sensor, for measuring the basis weight of an electrode paste, and a calibration ultrasonic sensor set consisting of a pair of first calibration ultrasonic sensor and second calibration ultrasonic sensor. The calibration ultrasonic sensor set performs calibration during measurement of the thickness of the electrode paste, and the actual-measurement ultrasonic sensor set calculates the basis weight of the electrode paste, using a measurement condition value obtained by the calibration ultrasonic sensor set.
摘要翻译： 超声波测量方法和超声波测量系统使用或包括至少一个由第一超声波传感器和第二超声波传感器组成的实际测量超声波传感器组，用于测量电极浆料的基重，以及校准超声波传感器组 由一对第一校准超声波传感器和第二校准超声波传感器组成。 校准超声波传感器组在测量电极糊的厚度期间执行校准，并且实际测量超声波传感器组使用由校准超声波传感器组获得的测量条件值来计算电极糊的基重。
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公开(公告)号：US20120186348A1
公开(公告)日：2012-07-26
申请号：US13356908
申请日：2012-01-24
IPC分类号： G01N29/024
CPC分类号： G01B17/025 , G01B2210/44
摘要： In an ultrasonic measuring method for measuring the thickness of a coating material applied by coating to one surface or both surfaces of a substrate made of a metal so as to provide a coated product, a pair of first ultrasonic sensor and second ultrasonic sensor are provided such that the first ultrasonic sensor is placed on one side of the coated product, as viewed in its thickness direction, via an air layer, while the second ultrasonic sensor is placed on the other side of the coated product, via an air layer, and the thickness of the coating material is measured by transmitting ultrasonic waves between the first and the second ultrasonic sensors. A flat-type transmitting sensor that permits propagation of unfocused ultrasonic waves is used as the first ultrasonic sensor, and a flat-type receiving sensor that permits propagation of unfocused ultrasonic waves is used as the second ultrasonic sensor.
摘要翻译： 在用于测量通过涂覆在由金属制成的基底的一个表面或两个表面上涂覆的涂层材料的厚度以提供涂覆产品的超声波测量方法中，提供一对第一超声波传感器和第二超声波传感器， 通过空气层将第一超声波传感器放置在涂覆产品的沿其厚度方向观察的一侧上，而第二超声波传感器经由空气层放置在涂覆产品的另一侧上，并且 通过在第一和第二超声波传感器之间传输超声波来测量涂层材料的厚度。 作为第一超声波传感器，使用允许未聚焦的超声波的传播的平面型发送传感器，作为允许未聚焦的超声波的传播的平面型接收传感器被用作第二超声波传感器。
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