公开(公告)号：US20050014388A1

公开(公告)日：2005-01-20

申请号：US10484840

申请日：2002-07-22

申请人： Akio Takahashi ,  Yuichi Satsu ,  Harakazu Nakai ,  Yoshiko Nakai ,  Igor Kardash ,  Andrei Pebalk ,  Sergei Chvalun ,  Karen Mailyan

发明人： Akio Takahashi ,  Yuichi Satsu ,  Harakazu Nakai ,  Yoshiko Nakai ,  Igor Kardash ,  Andrei Pebalk ,  Sergei Chvalun ,  Karen Mailyan

IPC分类号： C08G61/02 ,  C08J5/18 ,  C08L65/04 ,  H01L21/312 ,  H01L21/76 ,  H01L21/768 ,  H01L49/02 ,  H05K1/00 ,  H01L21/31 ,  H01L21/469

CPC分类号： C08J5/18 ,  C08G61/02 ,  C08J2365/04 ,  C08L65/04 ,  H01L21/02118 ,  H01L21/0212 ,  H01L21/02203 ,  H01L21/02271 ,  H01L21/312 ,  H01L21/3127 ,  H01L21/7682 ,  H05K3/4676 ,  Y10T428/31913

摘要： An organic polymer film of low dielectric constant and high heating resistance which is applicable as an insulating layer of a semiconductor devices is provided, as well as a manufacturing method for the film and a semiconductor device incorporating the film.

公开(公告)号：US20050156287A1

公开(公告)日：2005-07-21

申请号：US10484893

申请日：2002-07-22

申请人： Akio Takahashi ,  Yuichi Satsu ,  Harukazu Nakai ,  Yoshiko Nakai ,  Igor Kardash ,  Andrei Pebalk ,  Sergei Chvalun ,  Kearen Mailyan

发明人： Akio Takahashi ,  Yuichi Satsu ,  Harukazu Nakai ,  Yoshiko Nakai ,  Igor Kardash ,  Andrei Pebalk ,  Sergei Chvalun ,  Kearen Mailyan

IPC分类号： C08G61/02 ,  C08J5/18 ,  H01L21/312 ,  H01L21/76 ,  H01L49/02 ,  H01L21/302 ,  H01L23/48

CPC分类号： H01L21/3127 ,  C08G61/02 ,  C08J5/18 ,  C08J2365/04 ,  H01L21/0212 ,  H01L21/02271 ,  H01L2924/0002 ,  H01L2924/00

摘要： An organic polymer film of low dielectric constant and high heating resistance which is applicable as insulating layers of semiconductor devices, a method of manufacturing the organic polymer film, and a semiconductor device using the organic polymer film.

摘要翻译： 适用于半导体器件的绝缘层的低介电常数和高耐热性的有机聚合物膜，有机聚合物膜的制造方法和使用有机聚合物膜的半导体器件。