摘要:
One aspect of the present invention provides a semiconductor light-emitting device improved in luminance, and also provides a process for production thereof. The process comprises a procedure of forming a relief structure on the light-extraction surface of the device by use of a self-assembled film. In that procedure, the light-extraction surface is partly covered with a protective film so as to protect an area for an electrode to be formed therein. The electrode is then finally formed there after the procedure. The process thus reduces the area incapable, due to thickness of the electrode, of being provided with the relief structure. Between the electrode and the light-extraction surface, a contact layer is formed so as to establish ohmic contact between them.
摘要:
One aspect of the present invention provides a semiconductor light-emitting device improved in luminance, and also provides a process for production thereof. The process comprises a procedure of forming a relief structure on the light-extraction surface of the device by use of a self-assembled film. In that procedure, the light-extraction surface is partly covered with a protective film so as to protect an area for an electrode to be formed therein. The electrode is then finally formed there after the procedure. The process thus reduces the area incapable, due to thickness of the electrode, of being provided with the relief structure. Between the electrode and the light-extraction surface, a contact layer is formed so as to establish ohmic contact between them.
摘要:
One aspect of the present invention provides a semiconductor light-emitting device improved in luminance, and also provides a process for production thereof. The process comprises a procedure of forming a relief structure on the light-extraction surface of the device by use of a self-assembled film. In that procedure, the light-extraction surface is partly covered with a protective film so as to protect an area for an electrode to be formed therein. The electrode is then finally formed there after the procedure. The process thus reduces the area incapable, due to thickness of the electrode, of being provided with the relief structure. Between the electrode and the light-extraction surface, a contact layer is formed so as to establish ohmic contact between them.
摘要:
One aspect of the present invention provides a semiconductor light-emitting device improved in luminance, and also provides a process for production thereof. The process comprises a procedure of forming a relief structure on the light-extraction surface of the device by use of a self-assembled film. In that procedure, the light-extraction surface is partly covered with a protective film so as to protect an area for an electrode to be formed therein. The electrode is then finally formed there after the procedure. The process thus reduces the area incapable, due to thickness of the electrode, of being provided with the relief structure. Between the electrode and the light-extraction surface, a contact layer is formed so as to establish ohmic contact between them.
摘要:
A semiconductor light emitting device including: a substrate; an electrode layer; and a semiconductor multilayer film disposed between the substrate and the electrode layer, the semiconductor multilayer film including: an n-type semiconductor layer; a p-type semiconductor layer; and an active layer disposed between the n-type semiconductor layer and the p-type semiconductor layer, wherein the semiconductor multilayer film has a light extraction surface from which a light emitted in the semiconductor multilayer film is extracted, the light extraction surface being formed with a relief structure having nano-scaled convex portions, wherein the relief structure is formed to have variation in equivalent circular diameters of the convex portions, and wherein 90% or more of the convex portions in the relief structure are configured to have circularity coefficient of (4π×(area)/(circumferential length)2) being equal to or larger than 0.7.
摘要:
A semiconductor light emitting device including: a substrate; an electrode layer; and a semiconductor multilayer film disposed between the substrate and the electrode layer, the semiconductor multilayer film including: an n-type semiconductor layer; a p-type semiconductor layer; and an active layer disposed between the n-type semiconductor layer and the p-type semiconductor layer, wherein the semiconductor multilayer film has a light extraction surface from which a light emitted in the semiconductor multilayer film is extracted, the light extraction surface being formed with a relief structure having nano-scaled convex portions, wherein the relief structure is formed to have variation in equivalent circular diameters of the convex portions, and wherein 90% or more of the convex portions in the relief structure are configured to have circularity coefficient of (4π×(area)/(circumferential length)2) being equal to or larger than 0.7.
摘要:
The present invention provides a reinforced electrolyte membrane for fuel cell comprising a porous substrate impregnated with a polyelectrolyte liquid dispersion, wherein either the maximum tensile strength in the machine direction (for sheet processing) (MD) or the maximum tensile strength in the transverse direction (TD; vertical to the MD direction) for the electrolyte membrane is 70 N/mm2 or more at 23° C. at a relative humidity of 50% or 40 N/mm2 or more at 80° C. at a relative humidity of 90%. This reinforced electrolyte membrane for fuel cell, in which the amount of fluorine ions eluted as a result of deterioration of electrolyte membrane components in particular is reduced, has excellent durability.
摘要翻译:本发明提供一种用于燃料电池的增强电解质膜,其包括浸渍有聚电解质液体分散体的多孔基材,其中在纵向(用于片材加工)(MD)或在横向上的最大拉伸强度 在相对湿度90%的相对湿度为50%或40N / mm 2以上的情况下,电解质膜的电阻率为70N / mm 2以上,相对湿度90% 。 这种用于燃料电池的增强电解质膜特别是由于电解质膜组分的劣化而洗脱的氟离子的量减少,具有优异的耐久性。
摘要:
An on-vehicle emergency call apparatus includes: a camera capturing an image of an interior of a vehicle; a capturing controller controlling the camera; and a transmitter transmitting an image capturing result obtained by the capturing camera to an emergency information center. The capturing controller controls the camera so as to capture images while switching alternately between an instant capturing shutter speed for capturing an instant image of a subject and a translocation capturing shutter speed for capturing a translocation image of the subject, in which instant capturing shutter speed and the translocation capturing shutter speed are different from each other. An image superimposer can superimpose the instant image and the translocation image to produce the image capturing result. An incident detector can detect an incident involving the vehicle whereupon the image superimposer superimposes the instant image and the translocation image to produce the image capturing result when the incident detector detects an incident involving the vehicle.
摘要:
An on-vehicle emergency call apparatus includes: a camera capturing an image of an interior of a vehicle; a capturing controller controlling the camera; and a transmitter transmitting an image capturing result obtained by the capturing camera to an emergency information center. The capturing controller controls the camera so as to capture images while switching alternately between an instant capturing shutter speed for capturing an instant image of a subject and a translocation capturing shutter speed for capturing a translocation image of the subject, in which instant capturing shutter speed and the translocation capturing shutter speed are different from each other. An image superimposer can superimpose the instant image and the translocation image to produce the image capturing result. An incident detector can detect an incident involving the vehicle whereupon the image superimposer superimposes the instant image and the translocation image to produce the image capturing result when the incident detector detects an incident involving the vehicle.
摘要:
A semiconductor device carrier comprising; a carrier housing having a housing portion for accommodating a semiconductor device; an electrode sheet disposed in the carrier housing, having a front surface wiring conductively arranged on a front surface of an insulation substrate, a rear surface wiring conductively arranged on a rear surface of the insulation substrate, a rear surface bump contact placement wiring, and a bump contact disposed in a contact placement portion and an elastic sheet disposed in the carrier housing to be in contact with the bottom of the electrode sheet; wherein a width of the rear surface bump contact placement wiring in correspondence to a bump contact to be in contact with an extreme electrode section of the semiconductor device is smaller than a width of the front surface bump contact placement wiring on which a bump contact to be in contact with the extreme electrode section is arranged.