摘要:
An apparatus which includes a nozzle unit, a guide unit, a first winding assemblage and a second winding assemblage, operates such that the first winding assemblage forms a first winding (e.g., a deflection coil on a deflection yoke for use with a cathode ray tube) by moving the wire material from the nozzle unit in a three-dimensional direction after binding the wire material to the workpiece through the guide unit cooperating with the nozzle unit and the second winding assemblage forms a second winding (e.g., a leakage magnetic field shielding coil) different from the first winding by moving the nozzle unit in directions parallel and normal to the axis of the workpiece, respectively. Unlike the conventional apparatus, it is possible to wind a wire material in a variety of ways in different directions while keeping the position of the workpiece in a certain posture.
摘要:
A winding apparatus capable of improving productivity includes a plurality of sets of winding devices each comprising a nozzle unit and a guide unit, and a plurality of holder for holding a plurality of bobbins in a predetermined posture so that the bobbins are wound with wires parallelly and simultaneously. Further, the nozzle units and the guide units of the plurality of winding devices are arranged on the same guide rails and the supply and winding of the wires are synchronized with the rotation of the holders. Moreover, each of the bobbins used in the winding apparatus is substantially funnel-shaped with the formation of a tapered outer peripheral surface having a projection so that the holders can securely hold the bobbin while positioning the bobbin through this projection. This winding apparatus is suitable for obtaining a saddlelike coil by winding a wire on a deflection yoke bobbin.
摘要:
An IC module includes a lead frame having terminals that are to be connected to an antenna coil of an IC card, and an IC chip and multilayer chip capacitors for tuning mounted on the lead frame and encapsulated by a resin. The multilayer chip capacitors are mounted in grooves on the lead frame.
摘要:
An IC module includes a lead frame having terminals that are to be connected to an antenna coil of an IC card, and an IC chip and multilayer chip capacitors for tuning mounted on the lead frame and encapsulated by a resin. The multilayer chip capacitors are mounted in grooves on the lead frame.
摘要:
An IC module includes a lead frame having terminals that are to be connected to an antenna coil of an IC card, and an IC chip and multilayer chip capacitors for tuning mounted on the lead frame and encapsulated by a resin. The multilayer chip capacitors are mounted in grooves on the lead frame.