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    Photosensitive polyimide resin composition
    5.
    发明授权
    Photosensitive polyimide resin composition 有权
    感光聚酰亚胺树脂组合物

    公开(公告)号：US6160081A

    公开(公告)日：2000-12-12

    申请号：US183124

    申请日：1998-10-30

    申请人： Akira Tanaka ,  Kei Sakamoto ,  Kenichi Ito ,  Yasuhiro Yoneda ,  Kishio Yokouchi ,  Yasuo Naganuma

    发明人： Akira Tanaka ,  Kei Sakamoto ,  Kenichi Ito ,  Yasuhiro Yoneda ,  Kishio Yokouchi ,  Yasuo Naganuma

    IPC分类号： C08G73/10 ,  G03F7/037 ,  H05K1/00 ,  H05K1/03 ,  C08G69/26

    CPC分类号： G03F7/037 ,  C08G73/1025 ,  H05K1/0346 ,  H05K3/4676

    摘要： The invention relates to a photosensitive polyimide resin composition comprising (A) a polyamic acid having, in its main chain, repeating units formed from a polycondensation product of at least one tetracarboxylic acid or tetracarboxylic anhydride thereof with at least one diamine compound, and having actinic ray-sensitive functional groups at both terminals thereof; (B) a photosensitive auxiliary having a photopolymerizable functional group; (C) a photopolymerization initiator; and (D) a solvent, wherein 1 the polyamic acid is such that when the repeating unit represented by the formula (1) is defined as a unit molecular weight, a unit molecular weight per carboxyl group (unit molecular weight/COOH) falls within a range of from 200 to 300, and 2 the photosensitive resin composition permits the formation of a polyimide film having a residual stress of 40 MPa or lower and a coefficient of thermal expansion of 30 ppm/.degree. C. or lower on a substrate, and to said polyamic acid, a polyimide film having excellent film properties, and a pattern forming process using the photosensitive polyimide resin composition.

    摘要翻译： 本发明涉及一种感光性聚酰亚胺树脂组合物，其包含（A）在其主链中具有由至少一种四羧酸或其四羧酸酐与至少一种二胺化合物的缩聚产物形成的并具有光化性的重复单元的聚酰胺酸 两端的光敏功能基团; （B）具有可光聚合官能团的光敏助剂; （C）光聚合引发剂; 和（D）溶剂，其中+ E，crc 1 + EE聚酰胺酸使得当由式（1）表示的重复单元定义为单位分子量时，每个羧基的单位分子量（单位分子量 重量/ COOH）在200〜300的范围内，并且+ E，crc 2 + EE，感光性树脂组合物能够形成残留应力为40MPa以下，聚酰亚胺膜的热膨胀系数为30 ppm /℃以下，以及所述聚酰胺酸，具有优异膜特性的聚酰亚胺膜和使用感光性聚酰亚胺树脂组合物的图案形成方法。

    Developer for photosensitive polyimide resin composition
    6.
    发明授权
    Developer for photosensitive polyimide resin composition 失效
    光敏聚酰亚胺树脂组合物显影剂

    公开(公告)号：US06403289B1

    公开(公告)日：2002-06-11

    申请号：US09183341

    申请日：1998-10-30

    申请人： Akira Tanaka ,  Kei Sakamoto ,  Yasuhiro Yoneda ,  Kishio Yokouchi

    发明人： Akira Tanaka ,  Kei Sakamoto ,  Yasuhiro Yoneda ,  Kishio Yokouchi

    IPC分类号： G03F732

    CPC分类号： G03F7/322 ,  G03F7/037

    摘要： The invention relates to a developer for photosensitive polyimide resin compositions, comprising an alkaline aqueous solution containing a basic compound (A) represented by a formula (1): wherein X+ is N+ or P+, R is an alkyl group having 1 to 20 carbon atoms or an aryl group having 6 to 10 ring forming carbon atoms, Y− is a monovalent anion, m is 0 or 1, n is 3 or 4, and m+n is 4, with the proviso that when m is 0, n is 4, and R is an alkyl group, the total number of carbon atoms of 4 alkyl groups is at least 13, or when m is 1, n is 3, and R is an alkyl group, the total number of carbon atoms of 3 alkyl groups is at least 6.

    摘要翻译： 本发明涉及用于光敏聚酰亚胺树脂组合物的显影剂，其包含含有由式（1）表示的碱性化合物（A）的碱性水溶液：其中X +为N +或P +，R为具有1至20个碳原子的烷基 或具有6〜10个形成碳原子的芳基，Y-为一价阴离子，m为0或1，n为3或4，m + n为4，条件是当m为0时，n为 4，R为烷基，4个烷基的碳原子数为13个以上，或者m为1时，n为3，R为烷基，3个烷基的碳原子总数 团体至少6人。