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公开(公告)号：US06646248B2
公开(公告)日：2003-11-11
申请号：US09841279
申请日：2001-04-24
申请人： Paul A. Hosier , Jagdish C. Tandon , Josef E. Jedlicka , Gaurav Sharma , Alain E. Perregaux , Robert P. Herloski
发明人： Paul A. Hosier , Jagdish C. Tandon , Josef E. Jedlicka , Gaurav Sharma , Alain E. Perregaux , Robert P. Herloski
IPC分类号： H01L2700
CPC分类号： H01L27/14645 , H01L27/14621
摘要： A photosensitive imaging device for recording images across the entire visible spectrum includes a set of photosensors which have a peak response around the orange part of the spectrum, about 600 nm. The peak response is obtained by combining responses of, in one case, photosensors associated with a filter which admits red or infrared wavelengths and longer and photosensors associated with a filter which admits orange wavelengths and longer. In another case, the photosensor is structured to attenuate longer wavelengths, which, in combination with a filter which admits orange and longer wavelengths, can simulate a peak behavior around the orange part of the spectrum.
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公开(公告)号：US4814296A
公开(公告)日：1989-03-21
申请号：US90827
申请日：1987-08-28
IPC分类号： B28D5/00 , B27G19/10 , F28D5/00 , H01L21/301 , H01L21/304 , H01L21/306 , H01L27/148
CPC分类号： B27G19/10 , H01L21/3043 , Y10S148/028
摘要： A process for forming individual dies having faces that allow the dies to be assembled against other like dies to form one and/or two dimensional scanning arrays wherein the active side of a wafer is etched to form small V-shaped grooves defining the die faces, relatively wide grooves are cut in the inactive side of the wafer opposite each V-shaped groove, and the wafer cut by sawing along the V-shaped grooves, the saw being located so that the side of the saw blade facing the die is aligned with the bottom of the V-shaped groove so that there is retained intact one side of the V-shaped groove to intercept and prevent cracks and chipping caused by sawing from damaging the die active surface and any circuits thereon.
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公开(公告)号：US06927381B2
公开(公告)日：2005-08-09
申请号：US10656622
申请日：2003-09-05
申请人： Paul A. Hosier , Jagdish C. Tandon , Josef E. Jedlicka , Gaurav Sharma , Alain E. Perregaux , Robert P. Herloski
发明人： Paul A. Hosier , Jagdish C. Tandon , Josef E. Jedlicka , Gaurav Sharma , Alain E. Perregaux , Robert P. Herloski
CPC分类号： H01L27/14645 , H01L27/14621
摘要： A photosensitive imaging device for recording images across the entire visible spectrum includes a set of photosensors which have a peak response around the orange part of the spectrum, about 600 nm. The peak response is obtained by combining responses of, in one case, photosensors associated with a filter which admits red or infrared wavelengths and longer and photosensors associated with a filter which admits orange wavelengths and longer. In another case, the photosensor is structured to attenuate longer wavelengths, which, in combination with a filter which admits orange and longer wavelengths, can simulate a peak behavior around the orange part of the spectrum.
摘要翻译： 用于在整个可见光谱上记录图像的光敏成像装置包括一组光敏元件，其在约600nm处具有围绕光谱的橙色部分的峰值响应。 峰响应通过组合响应，在一种情况下，与允许红色或红外波长的滤波器相关联的光电传感器以及与允许橙色波长和更长的滤波器相关联的光电传感器的响应。 在另一种情况下，光电传感器被构造为衰减更长的波长，其与允许橙色和较长波长的滤波器组合可以模拟在光谱的橙色部分周围的峰值行为。
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公开(公告)号：US06316284B1
公开(公告)日：2001-11-13
申请号：US09656879
申请日：2000-09-07
IPC分类号： H01L2100
CPC分类号： H01L27/14643 , H01L27/14685
摘要： The present invention generally relates to a digital scanner for scanning images. More specifically, the present invention is directed to a method and apparatus for enhancing the quality of scanned images obtained by filtering out the infrared component of digital data to provide enhanced digital images.
摘要翻译： 本发明一般涉及用于扫描图像的数字扫描仪。 更具体地，本发明涉及一种用于增强通过滤出数字数据的红外分量而获得的扫描图像的质量以提供增强的数字图像的方法和装置。
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5.发明授权Use of a U-groove as an alternative to using a V-groove for protection against dicing induced damage in silicon 失效使用U形槽作为使用V形槽的替代方案来防止在硅中切割引起的损坏公开(公告)号：US06955989B2
公开(公告)日：2005-10-18
申请号：US09996681
申请日：2001-11-30
申请人： Alain E. Perregaux , Paul A. Hosier , Josef E. Jedlicka , Nicholas J. Salatino , Jagdish C. Tandon
发明人： Alain E. Perregaux , Paul A. Hosier , Josef E. Jedlicka , Nicholas J. Salatino , Jagdish C. Tandon
IPC分类号： B28D5/02 , H01L21/301 , H01L21/3065 , H01L21/302
摘要： The present disclosure relates that by modifying chip die dicing methodology to a U-groove profile from a V-groove profile by modifying the second etch step to be a dry etch instead of a wet etch results in a direct cost savings by eliminating a more expensive process step, as well as the need for stripping the developed photoresist layer. Furthermore, going to a U-groove profile accomplishes additional indirect and greater cost savings resulting from increased process throughput, improved yield, and reduced metal layer defects.
摘要翻译： 本公开内容涉及通过将第二蚀刻步骤通过将第二蚀刻步骤修改为干蚀刻而不是湿蚀刻将芯片芯片切割方法修改为U形沟槽轮廓导致通过消除更昂贵的直接成本节省 工艺步骤，以及剥离显影的光致抗蚀剂层的需要。 此外，进入U形凹槽轮廓可实现额外的间接和更大的成本节省，这是由于加工量增加，产量提高和金属层缺陷减少。
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公开(公告)号：US06768565B1
公开(公告)日：2004-07-27
申请号：US09657342
申请日：2000-09-07
IPC分类号： H01L2700
CPC分类号： H04N1/031 , H01L27/14621 , H04N2201/02493
摘要： The present invention generally relates to a digital scanner for scanning images. More specifically, the present invention is directed to a method and apparatus for enhancing the quality of scanned images obtained by filtering out the infrared component of digital data to provide enhanced digital images.
摘要翻译： 本发明一般涉及用于扫描图像的数字扫描仪。 更具体地，本发明涉及一种用于增强通过滤出数字数据的红外分量而获得的扫描图像的质量以提供增强的数字图像的方法和装置。
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公开(公告)号：US5119181A
公开(公告)日：1992-06-02
申请号：US681809
申请日：1991-04-08
IPC分类号： H04N1/48
CPC分类号： H04N1/486
摘要： A color chip construction especially adapted for use in fabricating full width arrays in which the individual chip photosites consisting of a blue, green, and red photodiode shaped and positioned to provide a rectangular photosite with square sides that enhance butting of the color chip with other like color chips to form full width color arrays.
摘要翻译： 特别适用于制造全宽阵列的彩色芯片结构，其中由蓝色，绿色和红色光电二极管组成的单个芯片光电二极管形成并定位成提供具有方形侧面的矩形光泽，以增强与其他类似物的颜色芯片对接 彩色芯片组成全彩色阵列。
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公开(公告)号：US5031032A
公开(公告)日：1991-07-09
申请号：US501584
申请日：1990-03-30
CPC分类号： H04N1/486
摘要： A color chip construction especially adapted for use in fabricating full width arrays in which the individual chip photosites consisting of a blue, green, and red photodiode shaped and positioned to provide a rectangular photosite with square sides that enhance butting of the color chip with other like color chips to form full width color arrays.
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9.发明授权公开(公告)号：US06271535B1
公开(公告)日：2001-08-07
申请号：US09141456
申请日：1998-08-27
申请人： Ned J. Seachman , Joseph P. Taillie , Kevin M. Carolan , Leroy A. Baldwin , Robert Brutovski , Alain E. Perregaux , John D. Hower, Jr.
发明人： Ned J. Seachman , Joseph P. Taillie , Kevin M. Carolan , Leroy A. Baldwin , Robert Brutovski , Alain E. Perregaux , John D. Hower, Jr.
IPC分类号： G01R2302
CPC分类号： G03G15/65 , B65H43/08 , B65H2511/514 , G01B11/028 , G01D5/342 , G03G2215/00616 , G03G2215/00721
摘要： A system and method electronically determines an edge of a copy substrate to be printed on. A copy substrate is inserted between a linear light source array and a linear sensor array and a light segment of the linear light source array is illuminated. An edge location of a shadow created by the copy substrate intersecting a light path between the illuminated light segment and the linear sensor array is measured, and a location of the edge of the copy substrate is calculated based on the measured shadow location. A second light segment of the linear light source on an opposite side of an expected copy substrate edge position of the light segment can also be illuminated, and a second edge location of a shadow created by the copy substrate intersecting a light path between the illuminated second light segment and the linear sensor array can be measured wherein this second measurement can be used with the first to calculate a location of the edge of the copy substrate. Alternatively, the calculated location can be used to determine a light segment of the linear light source which corresponds to the calculated location. This determined light source is illuminated and the shadow measured. The new measurement is used to calculate the edge of the copy substrate.
摘要翻译： 系统和方法以电子方式确定要印刷的复印基板的边缘。 将复制基板插入在线性光源阵列和线性传感器阵列之间，并且照亮线性光源阵列的光段。 测量由与照明光段和线性传感器阵列之间的光路相交的复制衬底产生的阴影的边缘位置，并且基于所测量的阴影位置来计算复制衬底的边缘的位置。 在光段的期望的复制基板边缘位置的相对侧的线性光源的第二光段也可以被照亮，并且由复制基板产生的阴影的第二边缘位置与照明的第二 可以测量光段和线性传感器阵列，其中该第二测量可以与第一测量一起使用以计算复制衬底的边缘的位置。 或者，所计算的位置可以用于确定对应于所计算的位置的线性光源的光段。 该确定的光源被照亮并且测量了阴影。 新的测量用于计算复印底物的边缘。
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公开(公告)号：US4837097A
公开(公告)日：1989-06-06
申请号：US134334
申请日：1987-12-17
IPC分类号： G02F1/1335
CPC分类号： G02F1/133509
摘要： An optical shield for a liquid crystal dot shutter image bar and fabrication process therefor. In one embodiment, a layer of dye-in-photoresist is formed on the interior surface of one of the glass substrates and over the one or more electrodes thereon. The photoresist layer is exposed through a mask and developed to form an optical shield having the desired configuration of optical apertures and a thickness of 2 to 3 micrometers. Alternate embodiments use two separate dye loaded layers that do not react with each other or dissolve in similar solvents. The first layer is dye loaded PMMA layer covered by a dye-in-photoresist. The dye can be selected to filter any desired spectral region.
摘要翻译： 一种用于液晶点阵快门图像棒的光学屏蔽及其制造方法。 在一个实施例中，在一个玻璃基板的内表面上和其上的一个或多个电极上形成一层光致抗蚀剂染料。 光致抗蚀剂层通过掩模曝光并显影以形成具有所需构造的光学孔径和2至3微米厚度的光学屏蔽。 替代实施方案使用两个不相互反应或溶解在类似溶剂中的分开的染料负载层。 第一层是由染料在光致抗蚀剂中覆盖的染料负载的PMMA层。 可以选择染料来过滤任何所需的光谱区域。
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