公开(公告)号：US20060219759A1

公开(公告)日：2006-10-05

申请号：US11393055

申请日：2006-03-30

申请人： Alan Duckham ,  Jesse Newson ,  Michael Brown ,  Timothy Rude ,  Omar Knio ,  Ellen Heian ,  Jai Subramanian

发明人： Alan Duckham ,  Jesse Newson ,  Michael Brown ,  Timothy Rude ,  Omar Knio ,  Ellen Heian ,  Jai Subramanian

IPC分类号： B23K31/02 ,  B23K20/08

CPC分类号： B32B15/01 ,  B23K1/0006 ,  B23K20/00 ,  B23K20/165 ,  C06B45/12 ,  H05K3/3494 ,  Y10T156/10 ,  Y10T428/12222 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12986 ,  Y10T428/31504 ,  Y10T428/31678

摘要： A method for joining component bodies of material over bonding regions of large dimensions by disposing a plurality of substantially contiguous sheets of reactive composite materials between the bodies and adjacent sheets of fusible material. The contiguous sheets of the reactive composite material are operatively connected by an ignitable bridging material so that an igniting reaction in one sheet will cause an igniting reaction in the other. An application of uniform pressure and an ignition of one or more of the contiguous sheets of reactive composite material causes an exothermic thermal reaction to propagate through the bonding region, fusing any adjacent sheets of fusible material and forming a bond between the component bodies.

公开(公告)号：US06958536B2

公开(公告)日：2005-10-25

申请号：US10416824

申请日：2001-10-30

申请人： Jai Subramanian

发明人： Jai Subramanian

IPC分类号： H01L23/02 ,  H01L23/04 ,  H01L23/10 ,  H01L23/367 ,  H01L23/28 ,  H01L23/34

CPC分类号： H01L23/04 ,  H01L23/10 ,  H01L23/3675 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/16152 ,  Y10T29/49002 ,  Y10T29/4913 ,  H01L2224/0401

摘要： The invention encompasses microelectronic package lids, heat spreaders, and semiconductor packages comprising microelectronic lids or heat spreaders. In particular aspects of the present invention, a microelectronic lid comprises a material having a rectangular peripheral shape that defines 4 peripheral sides. Further, the lid has projecting peripheral rails along less than all of the peripheral edge. For instance, the lid can have projecting peripheral rails along only 2 of the sides. Alternatively, such microelectronic lid can be described as comprising a generally rectangular shape defining four peripheral edges, with two of the edges having a greater thickness than the other two edges.

摘要翻译： 本发明包括微电子封装盖，散热器和包括微电子盖或散热器的半导体封装。 在本发明的特定方面，微电子盖包括具有限定4个周边的矩形周边形状的材料。 此外，盖具有沿着小于所有周边边缘的突出的周边轨道。 例如，盖子可以仅沿着两侧的两侧具有突出的周边导轨。 或者，这样的微电子盖可以被描述为包括限定四个周边边缘的大致矩形形状，其中两个边缘具有比其它两个边缘更大的厚度。

公开(公告)号：US07897437B2

公开(公告)日：2011-03-01

申请号：US11961067

申请日：2007-12-20

申请人： Mark Fery ,  Jai Subramanian

发明人： Mark Fery ,  Jai Subramanian

IPC分类号： H01L21/00

CPC分类号： C25D5/18 ,  H01L23/3735 ,  H01L23/3736 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3011 ,  Y10T156/10 ,  Y10T428/12535 ,  Y10T428/12986 ,  H01L2924/00

摘要： Layered interface materials described herein include at least one pulse-plated thermally conductive material, such as an interconnect material, and at least one heat spreader component coupled to the at least one pulse-plated thermally conductive material. A plated layered interface material having a migration component is also described herein and includes at least one pulse-plated thermally conductive material; and at least one heat spreader component, wherein the migration component of the plated layered interface material is reduced by at least 51% as compared to the migration component of a reference layered interface material. Another layered interface material described herein includes: a) a thermal conductor; b) a protective layer; c) a layer of material to accept solder and prevent the formation of oxides; and d) a layer of solder material. Methods of forming layered interface materials are described herein that include: a) providing a pulse-plated thermally conductive interface material; b) providing a heat spreader component; and c) physically coupling the thermally conductive interface material and the heat spreader component. At least one additional layer, including a substrate layer, a surface, an adhesive, a compliant fibrous component or any other suitable layer or a thermal interface material, can be coupled to the layered interface material.

摘要翻译： 本文所述的层状界面材料包括至少一个脉冲镀覆的导热材料，例如互连材料，以及耦合到所述至少一个脉冲镀覆的导热材料的至少一个散热器部件。 本文还描述了具有迁移组分的镀层分层界面材料，并且包括至少一个脉冲镀导热材料; 和至少一个散热器部件，其中与参考分层界面材料的迁移组分相比，镀层的界面材料的迁移组分降低至少51％。 本文描述的另一分层界面材料包括：a）热导体; b）保护层; c）一层接受焊料并防止氧化物形成的材料; 和d）一层焊料。 本文描述了形成层状界面材料的方法，其包括：a）提供脉冲镀覆的导热界面材料; b）提供散热器部件; 以及c）物理地耦合导热界面材料和散热器部件。 包括基底层，表面，粘合剂，顺应性纤维组分或任何其它合适的层或热界面材料的至少一个附加层可以耦合到分层界面材料。

公开(公告)号：US20080176095A1

公开(公告)日：2008-07-24

申请号：US11961067

申请日：2007-12-20

申请人： Mark Fery ,  Jai Subramanian

发明人： Mark Fery ,  Jai Subramanian

IPC分类号： B32B15/04

CPC分类号： C25D5/18 ,  H01L23/3735 ,  H01L23/3736 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3011 ,  Y10T156/10 ,  Y10T428/12535 ,  Y10T428/12986 ,  H01L2924/00

摘要： Layered interface materials described herein include at least one pulse-plated thermally conductive material, such as an interconnect material, and at least one heat spreader component coupled to the at least one pulse-plated thermally conductive material. A plated layered interface material having a migration component is also described herein and includes at least one pulse-plated thermally conductive material; and at least one heat spreader component, wherein the migration component of the plated layered interface material is reduced by at least 51% as compared to the migration component of a reference layered interface material. Another layered interface material described herein includes: a) a thermal conductor; b) a protective layer; c) a layer of material to accept solder and prevent the formation of oxides; and d) a layer of solder material. Methods of forming layered interface materials are described herein that include: a) providing a pulse-plated thermally conductive interface material; b) providing a heat spreader component; and c) physically coupling the thermally conductive interface material and the heat spreader component. At least one additional layer, including a substrate layer, a surface, an adhesive, a compliant fibrous component or any other suitable layer or a thermal interface material, can be coupled to the layered interface material.

摘要翻译： 本文所述的层状界面材料包括至少一个脉冲镀覆的导热材料，例如互连材料，以及耦合到所述至少一个脉冲镀覆的导热材料的至少一个散热器部件。 本文还描述了具有迁移组分的镀层分层界面材料，并且包括至少一个脉冲镀导热材料; 和至少一个散热器部件，其中与参考分层界面材料的迁移组分相比，镀层的界面材料的迁移组分降低至少51％。 本文描述的另一分层界面材料包括：a）热导体; b）保护层; c）一层接受焊料并防止氧化物形成的材料; 和d）一层焊料。 本文描述了形成层状界面材料的方法，其包括：a）提供脉冲镀覆的导热界面材料; b）提供散热器部件; 以及c）物理地耦合导热界面材料和散热器部件。 包括基底层，表面，粘合剂，顺应性纤维组分或任何其它合适的层或热界面材料的至少一个附加层可以耦合到分层界面材料。

公开(公告)号：US07378730B2

公开(公告)日：2008-05-27

申请号：US10545597

申请日：2004-02-13

申请人： Mark Fery ,  Jai Subramanian

发明人： Mark Fery ,  Jai Subramanian

IPC分类号： H01L23/10 ,  H05K7/20

CPC分类号： C25D5/18 ,  H01L23/3735 ,  H01L23/3736 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3011 ,  Y10T156/10 ,  Y10T428/12535 ,  Y10T428/12986 ,  H01L2924/00

摘要： Layered interface materials described herein include at least one pulse-plated thermally conductive material, such as an interconnect material, and at least one heat spreader component coupled to the at least one pulse-plated thermally conductive material. A plated layered interface material having a migration component is also described herein and includes at least one pulse-plated thermally conductive material; and at least one heat spreader component, wherein the migration component of the plated layered interface material is reduced by at least 51% as compared to the migration component of a reference layered interface material. Another layered interface material described herein includes: a) a thermal conductor; b) a protective layer; c) a layer of material accept solder and prevent the formation of oxides; and d) a layer of solder material. Methods of forming layered interface materials are described herein that include: a) providing a pulse-plated thermally conductive interface material; b) providing a heat spreader component; and c) physically coupling the thermally conductive interface material and the heat spreader component. At least one additional layer, including a substrate layer, a surface, adhesive, a compliant fibrous component or any other suitable layer or a thermal interface material, can be coupled to the layered interface material.

摘要翻译： 本文所述的层状界面材料包括至少一个脉冲镀覆的导热材料，例如互连材料，以及耦合到所述至少一个脉冲镀覆的导热材料的至少一个散热器部件。 本文还描述了具有迁移组分的镀层分层界面材料，并且包括至少一个脉冲镀导热材料; 和至少一个散热器部件，其中与参考分层界面材料的迁移组分相比，镀层的界面材料的迁移组分降低至少51％。 本文描述的另一分层界面材料包括：a）热导体; b）保护层; c）一层材料接受焊料并防止氧化物的形成; 和d）一层焊料。 本文描述了形成层状界面材料的方法，其包括：a）提供脉冲镀覆的导热界面材料; b）提供散热器部件; 以及c）物理地耦合导热界面材料和散热器部件。 包括基底层，表面，粘合剂，柔顺纤维组分或任何其它合适的层或热界面材料的至少一个附加层可以耦合到分层界面材料。

公开(公告)号：US20060237838A1

公开(公告)日：2006-10-26

申请号：US10545597

申请日：2004-02-13

申请人： Mark Fery ,  Jai Subramanian

发明人： Mark Fery ,  Jai Subramanian

IPC分类号： H01L23/34

CPC分类号： C25D5/18 ,  H01L23/3735 ,  H01L23/3736 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3011 ,  Y10T156/10 ,  Y10T428/12535 ,  Y10T428/12986 ,  H01L2924/00

摘要： Layered interface materials described herein include at least one pulse-plated thermally conductive material, such as an interconnect material, and at least one heat spreader component coupled to the at least one pulse-plated thermally conductive material. A plated layered interface material having a migration component is also described herein and includes at least one pulse-plated thermally conductive material; and at least one heat spreader component, wherein the migration component of the plated layered interface material is reduced by at least 51% as compared to the migration component of a reference layered interface material. Another layered interface material described herein includes: a) a thermal conductor; b) a protective layer; c) a layer of material accept solder and prevent the formation of oxides; and d) a layer of solder material. Methods of forming layered interface materials are described herein that include: a) providing a pulse-plated thermally conductive interface material; b) providing a heat spreader component; and c) physically coupling the thermally conductive interface material and the heat spreader component. At least one additional layer, including a substrate layer, a surface, adhesive, a compliant fibrous component or any other suitable layer or a thermal interface material, can be coupled to the layered interface material.

摘要翻译： 本文所述的层状界面材料包括至少一个脉冲镀覆的导热材料，例如互连材料，以及耦合到所述至少一个脉冲镀覆的导热材料的至少一个散热器部件。 本文还描述了具有迁移组分的镀层分层界面材料，并且包括至少一个脉冲镀导热材料; 和至少一个散热器部件，其中与参考分层界面材料的迁移组分相比，镀层的界面材料的迁移组分降低至少51％。 本文描述的另一分层界面材料包括：a）热导体; b）保护层; c）一层材料接受焊料并防止氧化物的形成; 和d）一层焊料。 本文描述了形成层状界面材料的方法，其包括：a）提供脉冲镀覆的导热界面材料; b）提供散热器部件; 以及c）物理地耦合导热界面材料和散热器部件。 包括基底层，表面，粘合剂，柔顺纤维组分或任何其它合适的层或热界面材料的至少一个附加层可以耦合到分层界面材料。