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12 条记录 (耗时 0.087 秒)

    Near Zero TCR Resistor Configurations
    5.
    发明申请
    Near Zero TCR Resistor Configurations 失效
    近零TCR电阻器配置

    公开(公告)号：US20110273263A1

    公开(公告)日：2011-11-10

    申请号：US12774294

    申请日：2010-05-05

    申请人： Amitabh Das ,  Robert J. Hufnagel ,  Christopher R. Grabbe

    发明人： Amitabh Das ,  Robert J. Hufnagel ,  Christopher R. Grabbe

    IPC分类号： H01C7/06

    CPC分类号： H01C7/06 ,  H01C7/02 ,  H01C7/04

    摘要： A microchip resistor device is disclosed in which first and second resistive elements are formed on a substrate. The first resistive element has a first resistance value and a positive temperature coefficient of resistance (TCR) over a selected temperature range. The second resistive element has a second resistance value and a negative TCR over the selected temperature range. The first and second resistive elements do not overlap each other. The first and second resistive elements are operatively connected with one or more conductors to provide a current path between the two elements. The product of the first resistance value and the positive temperature coefficient of resistance is substantially equal in magnitude to the product of the second resistance value and the negative temperature coefficient of resistance.

    摘要翻译： 公开了一种微芯片电阻器件，其中第一和第二电阻元件形成在衬底上。 第一电阻元件在选定的温度范围内具有第一电阻值和正温度系数（TCR）。 第二电阻元件在所选温度范围内具有第二电阻值和负TCR。 第一和第二电阻元件彼此不重叠。 第一和第二电阻元件与一个或多个导体可操作地连接以提供两个元件之间的电流路径。 第一电阻值和正电阻温度系数的乘积在大小上与第二电阻值和负温度系数的乘积基本相等。

    Filter-Attenuator Chip Device
    6.
    发明申请
    Filter-Attenuator Chip Device 失效
    滤波衰减器芯片器件

    公开(公告)号：US20090231068A1

    公开(公告)日：2009-09-17

    申请号：US12046861

    申请日：2008-03-12

    申请人： Amitabh Das ,  Robert J. Hufnagel

    发明人： Amitabh Das ,  Robert J. Hufnagel

    IPC分类号： H01P1/22 ,  H01C17/00

    CPC分类号： H01P1/227 ,  H01P1/2039 ,  Y10T29/49082

    摘要： A microchip device is disclosed that combines a signal attenuator and a frequency filter. An embodiment of the device includes an input contact, an output contact, and a ground contact formed on the surface of a substrate. Resistive elements formed on the substrate interconnect the contacts. At least the input contact includes a gap pattern formed therein that is dimensioned and arranged such that the input contact provides a reactive impedance characteristic. The combination of the resistance of the resistive elements and the reactive impedance characteristic of the input contact are selected to provide attenuation and frequency filtering of a high frequency signal input to the microchip device. A method of manufacturing the filter-attenuator microchip device is also described.

    摘要翻译： 公开了一种组合信号衰减器和频率滤波器的微芯片器件。 器件的一个实施例包括形成在衬底表面上的输入触点，输出触点和接地触点。 形成在衬底上的电阻元件互连触点。 至少输入触点包括其中形成的间隙图案，其尺寸和布置使得输入触点提供无功阻抗特性。 选择电阻元件的电阻和输入触点的无功阻抗特性的组合，以提供输入到微芯片器件的高频信号的衰减和频率滤波。 还描述了制造滤波衰减器微芯片器件的方法。

    Preparation of wear-resistant laminates using mineral pigment composites
    7.
    发明授权
    Preparation of wear-resistant laminates using mineral pigment composites 失效
    使用矿物颜料复合材料制备耐磨层压板

    公开(公告)号：US06287681B1

    公开(公告)日：2001-09-11

    申请号：US09357473

    申请日：1999-07-20

    申请人： Mahendra Mehta ,  Amitabh Das ,  John Rourke

    发明人： Mahendra Mehta ,  Amitabh Das ,  John Rourke

    IPC分类号： B32B516

    CPC分类号： D21H27/28 ,  B44C5/0476 ,  Y10T428/25 ,  Y10T428/258 ,  Y10T428/259 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2998 ,  Y10T442/3919 ,  Y10T442/699

    摘要： Wear resistant overlays for use in decorative laminates and laminates prepared therefrom comprising a web of cellulosic fibers having deposited on the surface thereof a layer of mineral pigment composite particles wherein said composite particles comprise mineral pigment particles embedded in a cured carrier material are disclosed. A process for forming an abrasion resistant overlay sheet which comprises forming a web of cellulosic fibers on a papermaking machine and applying a slurry including mineral pigment composite particles to the upper surface of the web on the papermaking machine wherein said mineral pigment composite particles comprise mineral pigment particles embedded in a cured carrier material is also disclosed.

    摘要翻译： 公开了用于装饰层压材料和由其制备的层压材料的耐磨覆层，其包括在其表面上沉积有一层矿物颜料复合颗粒的纤维素纤维网，其中所述复合颗粒包含嵌入固化的载体材料中的矿物颜料颗粒。 一种用于形成耐磨覆盖片的方法，其包括在造纸机上形成纤维素纤维网，并在造纸机上将包含矿物颜料复合颗粒的浆料施加到幅材的上表面，其中所述矿物颜料复合颗粒包含矿物颜料 还公开了嵌入固化的载体材料中的颗粒。

    Semiconductor electrical heater and method for making same
    8.
    发明授权
    Semiconductor electrical heater and method for making same 失效
    半导体电加热器及其制作方法

    公开(公告)号：US5498850A

    公开(公告)日：1996-03-12

    申请号：US73539

    申请日：1993-06-08

    申请人： Amitabh Das

    发明人： Amitabh Das

    IPC分类号： H05B3/03 ,  A24F47/00 ,  B23K26/22 ,  B23K35/00 ,  B23K35/30 ,  H01L21/768 ,  H05B3/02 ,  H05B3/06 ,  H05B3/14 ,  B23K26/00 ,  B23K26/02

    CPC分类号： A24F47/008 ,  B23K26/22 ,  B23K35/007 ,  B23K35/302 ,  B23K2035/008 ,  B23K2201/40 ,  H01L2924/0002

    摘要： A method is disclosed for mechanically and electrically bonding metallic materials and semiconductor materials. The method according to the invention may be used, for example, in forming a semiconductor electrical heater, particularly for use in electrical smoking articles. A metallic element, such as a copper alloy power supply tab, is laser welded to a semiconductor element, such as a doped silicon resistive heater element. A laser beam is directed through a hole in the copper alloy tab to melt some silicon material, which flows into the hole in the copper tab, reacts and intermixes with the copper and solidifies to form a slug containing copper silicide. A protective material such as nickel may be applied to protect the copper silicide from oxidation if desired. An ohmic, low resistance contact and high strength bond is provided between the parts.

    摘要翻译： 公开了用于机械地和电接合金属材料和半导体材料的方法。 根据本发明的方法可以用于例如形成半导体电加热器，特别是用于电吸烟制品。 诸如铜合金电源接头的金属元件被激光焊接到半导体元件，例如掺杂的硅电阻加热器元件。 激光束被引导通过铜合金接头中的孔，以熔化流入铜片中的孔中的一些硅材料，与铜反应并与之混合并固化以形成含有硅化铜的块状物。 如果需要，可以施加诸如镍的保护材料以保护硅化铜免于氧化。 部件之间提供欧姆，低电阻接触和高强度接合。

    Filter-attenuator chip device
    9.
    发明授权
    Filter-attenuator chip device 失效
    滤波衰减器芯片器件

    公开(公告)号：US07852171B2

    公开(公告)日：2010-12-14

    申请号：US12046861

    申请日：2008-03-12

    申请人： Amitabh Das ,  Robert J. Hufnagel

    发明人： Amitabh Das ,  Robert J. Hufnagel

    IPC分类号： H01P1/22

    CPC分类号： H01P1/227 ,  H01P1/2039 ,  Y10T29/49082

    摘要： A microchip device is disclosed that combines a signal attenuator and a frequency filter. An embodiment of the device includes an input contact, an output contact, and a ground contact formed on the surface of a substrate. Resistive elements formed on the substrate interconnect the contacts. At least the input contact includes a gap pattern formed therein that is dimensioned and arranged such that the input contact provides a reactive impedance characteristic. The combination of the resistance of the resistive elements and the reactive impedance characteristic of the input contact are selected to provide attenuation and frequency filtering of a high frequency signal input to the microchip device. A method of manufacturing the filter-attenuator microchip device is also described.

    摘要翻译： 公开了一种组合信号衰减器和频率滤波器的微芯片器件。 器件的一个实施例包括形成在衬底表面上的输入触点，输出触点和接地触点。 形成在衬底上的电阻元件互连触点。 至少输入触点包括其中形成的间隙图案，其尺寸和布置使得输入触点提供无功阻抗特性。 选择电阻元件的电阻和输入触点的无功阻抗特性的组合，以提供输入到微芯片器件的高频信号的衰减和频率滤波。 还描述了制造滤波衰减器微芯片器件的方法。

    Semiconductor electrical heater and method for making same
    10.
    发明授权
    Semiconductor electrical heater and method for making same 失效
    半导体电加热器及其制作方法

    公开(公告)号：US5659656A

    公开(公告)日：1997-08-19

    申请号：US614076

    申请日：1996-03-12

    申请人： Amitabh Das

    发明人： Amitabh Das

    IPC分类号： H05B3/03 ,  A24F47/00 ,  B23K26/22 ,  B23K35/00 ,  B23K35/30 ,  H01L21/768 ,  H05B3/02 ,  H05B3/06 ,  H05B3/14 ,  B23K26/02 ,  B23K26/00

    CPC分类号： A24F47/008 ,  B23K26/22 ,  B23K35/007 ,  B23K35/302 ,  B23K2035/008 ,  B23K2201/40 ,  H01L2924/0002

    摘要： A method is disclosed for mechanically and electrically bonding metallic materials and semiconductor materials. The method according to the invention may be used, for example, in forming a semiconductor electrical heater, particularly for use in electrical smoking articles. A metallic element, such as a copper alloy power supply tab, is laser welded to a semiconductor element, such as a doped silicon resistive heater element. A laser beam is directed through a hole in the copper alloy tab to melt some silicon material, which flows into the hole in the copper tab, reacts and intermixes with the copper and solidifies to form a slug containing copper silicide. A protective material such as nickel may be applied to protect the copper silicide from oxidation if desired. An ohmic, low resistance contact and high strength bond is provided between the parts.

    摘要翻译： 公开了用于机械地和电接合金属材料和半导体材料的方法。 根据本发明的方法可以用于例如形成半导体电加热器，特别是用于电吸烟制品。 诸如铜合金电源接头的金属元件被激光焊接到半导体元件，例如掺杂的硅电阻加热器元件。 激光束被引导通过铜合金接头中的孔，以熔化流入铜片中的孔中的一些硅材料，与铜反应并与之混合并固化以形成含有硅化铜的块状物。 如果需要，可以施加诸如镍的保护材料以保护硅化铜免于氧化。 部件之间提供欧姆，低电阻接触和高强度接合。