公开(公告)号：US07045035B1

公开(公告)日：2006-05-16

申请号：US11101028

申请日：2005-04-06

申请人： Nikhil Kelkar ,  Ken Pham ,  Jaime A. Bayan ,  Cheol Hyun Han

发明人： Nikhil Kelkar ,  Ken Pham ,  Jaime A. Bayan ,  Cheol Hyun Han

IPC分类号： B32B35/00

CPC分类号： H01L21/67132 ,  H01L2221/68322 ,  Y10S156/941 ,  Y10T156/1179 ,  Y10T156/19

摘要： A post singulation, die separation assembly for bulk separation of a plurality of dice in a singulated wafer from the adhesive backing of wafer saw tape. The die separation assembly includes a support base having a support surface. A feed tray includes a collection end positioned adjacent the base such that an elongated, substantially tin gap is formed between the tray collection end and at least a portion of the base. A flexible platform is movably supported atop the base support surface for movement along the base. Upon movement of the flexible platform down the down-ramped portion of the support base, a portion of the wafer saw tape thereat is peeled away from the respective die. The tape is the separated from the dice, releasing the respective dice onto the collection end of the feed tray in a manner substantially maintaining their forward alignment orientation of thereof.

摘要翻译： 用于将单片晶片中的多个骰子从晶片锯带的粘合剂背衬批量分离的后分离模头分离组件。 模具分离组件包括具有支撑表面的支撑基座。 馈送托盘包括邻近基部定位的收集端，使得在托盘收集端和基部的至少一部分之间形成细长的基本上锡的间隙。 柔性平台可移动地支撑在基座支撑表面上方，以便沿底座移动。 当柔性平台沿着支撑基座的向下倾斜的部分移动时，其中的晶片锯带的一部分从相应的模具剥离。 胶带与骰子分离，以相当大的方式保持它们的向前定向取向的方式将相应的骰子释放到进料盘的收集端上。

公开(公告)号：US06932136B1

公开(公告)日：2005-08-23

申请号：US10821824

申请日：2004-04-08

申请人： Nikhil Kelkar ,  Ken Pham ,  Jaime A. Bayan ,  Cheol Hyun Han

发明人： Nikhil Kelkar ,  Ken Pham ,  Jaime A. Bayan ,  Cheol Hyun Han

IPC分类号： H01L21/00 ,  B32B35/00

CPC分类号： H01L21/67132 ,  H01L2221/68322 ,  Y10S156/941 ,  Y10T156/1179 ,  Y10T156/19

摘要： A post singulation, die separation assembly for bulk separation of a plurality of dice in a singulated wafer from the adhesive backing of wafer saw tape. The die separation assembly includes a support base having a support surface, a first portion and an opposite second portion thereof. The second portion includes a down-ramped portion thereof skewed downwardly at a first acute angle from the support surface. A feed tray includes a collection end positioned adjacent the base second portion such that an elongated, substantially thin gap is formed between the tray collection end and at least a portion of the base second portion. A flexible platform is movably supported atop the base support surface for movement from the first portion to the second portion thereof. At the second portion, the platform passes downward through the gap formed between the tray collection end and the at least a portion of the base second portion. The platform defines an upward facing surface upon each die of the singulated wafer is adhered thereto, via the saw tape, in a forward aligned manner. Upon movement of the flexible platform down the down-ramped portion of the support base, a portion of the wafer saw tape thereat is peeled away from the respective die. The tape is the separated from the dice, releasing the respective dice onto the collection end of the feed tray in a manner substantially maintaining their forward alignment orientation of thereof.

摘要翻译： 用于将单片晶片中的多个骰子从晶片锯带的粘合剂背衬批量分离的后分离模头分离组件。 模具分离组件包括具有支撑表面的支撑基座，第一部分和相对的第二部分。 第二部分包括从支撑表面以第一锐角向下倾斜的向下倾斜的部分。 馈送托盘包括收集端，邻近基部第二部分定位，使得在托盘收集端和基部第二部分的至少一部分之间形成细长的基本上较薄的间隙。 柔性平台可移动地支撑在基座支撑表面上方，用于从第一部分移动到第二部分。 在第二部分，平台向下通过形成在托盘收集端和基部第二部分的至少一部分之间的间隙。 平台通过锯带以正向对齐的方式限定了单面晶片的每个管芯上的面向上的表面。 当柔性平台沿着支撑基座的向下倾斜的部分移动时，其中的晶片锯带的一部分从相应的模具剥离。 胶带与骰子分离，以相当大的方式保持它们的向前定向取向的方式将相应的骰子释放到进料盘的收集端上。

公开(公告)号：US6001723A

公开(公告)日：1999-12-14

申请号：US998442

申请日：1997-12-24

申请人： Nikhil Kelkar ,  Jaime A. Bayan

发明人： Nikhil Kelkar ,  Jaime A. Bayan

IPC分类号： H01L21/48 ,  H01L23/498 ,  H01L21/44

CPC分类号： H01L24/97 ,  H01L21/4853 ,  H01L23/49811 ,  H01L2224/05554 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14

摘要： A method of forming an interconnection contact for integrated circuit package components includes providing an integrated circuit package component having a contact pad on which the interconnecting contact is to be formed. The interconnecting contact is formed by forming at least a portion of a bonding wire loop connected to the contact pad. A first end of a bonding wire is connected to the contact pad. The bonding wire loop includes a wire portion extending outwardly from the contact pad. The portion of the bonding wire loop forms the interconnection contact for electrically connecting the integrated circuit package component to other electrical devices. In one embodiment, a second end of the bonding wire loop is connected to the same contact pad that the first end of the bonding wire loop is connected to. In another embodiment, a second end of the bonding wire loop is connected to another contact pad. The integrated circuit package component may be an integrated circuit die or an interconnecting device such as an interconnecting substrate for interconnecting other integrated circuit package components or for connecting the integrated circuit package to other electrical elements. An encapsulating material may be used to encapsulate the particular surface of the integrated circuit package component, the contact pad, and portions of the bonding wire loop.

摘要翻译： 形成用于集成电路封装部件的互连触点的方法包括提供具有接触焊盘的集成电路封装部件，其上将形成互连触点。 通过形成连接到接触垫的接合线环的至少一部分来形成互连接触。 接合线的第一端连接到接触垫。 接合线环包括从接触垫向外延伸的线部分。 接合线环的部分形成用于将集成电路封装部件电连接到其它电气装置的互连触点。 在一个实施例中，接合线环路的第二端连接到接合线环路的第一端连接到的相同接触焊盘。 在另一个实施例中，接合线环的第二端连接到另一个接触垫。 集成电路封装部件可以是集成电路管芯或诸如用于互连其它集成电路封装部件的互连衬底或用于将集成电路封装连接到其它电气元件的互连器件的互连器件。 封装材料可用于封装集成电路封装部件，接触焊盘和接合线环的部分的特定表面。

公开(公告)号：US07253078B1

公开(公告)日：2007-08-07

申请号：US10224291

申请日：2002-08-19

申请人： Luu T. Nguyen ,  Hau T. Nguyen ,  Viraj A. Patwardhan ,  Nikhil Kelkar ,  Shahram Mostafazadeh

发明人： Luu T. Nguyen ,  Hau T. Nguyen ,  Viraj A. Patwardhan ,  Nikhil Kelkar ,  Shahram Mostafazadeh

IPC分类号： H01L21/44

CPC分类号： H01L24/29 ,  H01L21/563 ,  H01L24/11 ,  H01L24/27 ,  H01L24/73 ,  H01L24/92 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/05568 ,  H01L2224/1131 ,  H01L2224/1141 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/11849 ,  H01L2224/13007 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/2732 ,  H01L2224/274 ,  H01L2224/2747 ,  H01L2224/27515 ,  H01L2224/27849 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29388 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10155 ,  H01L2924/10157 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/01031 ,  H01L2924/3512 ,  H01L2224/05552 ,  H01L2224/27 ,  H01L2224/11

摘要： An apparatus and method for forming a layer of underfill adhesive on an integrated circuit in wafer form is described. In one embodiment, the layer of underfill adhesive is disposed and partially cured on the active surface of the wafer. Once the underfill adhesive has partially cured, the wafer is singulated. The individual integrated circuits or die are then mounted onto a substrate such as a printed circuit board. When the solder balls of the integrated circuit are reflowed to form joints with corresponding contact pads on the substrate, the underfill adhesive reflows and is completely cured. In an alternative embodiment, the underfill adhesive is fully cured after it is disposed onto the active surface of the wafer.

摘要翻译： 描述了一种在晶片形式的集成电路上形成底层填料层的装置和方法。 在一个实施例中，底层填充粘合剂层被设置并部分地固化在晶片的活性表面上。 一旦底部填充粘合剂已部分固化，则晶片被切割。 然后将各个集成电路或管芯安装到诸如印刷电路板的基板上。 当集成电路的焊球回流以形成与基板上的相应接触焊盘的接头时，底部填充粘合剂回流并完全固化。 在替代实施例中，底部填充粘合剂在其被设置在晶片的有效表面之后被完全固化。

公开(公告)号：US06468892B1

公开(公告)日：2002-10-22

申请号：US09616475

申请日：2000-07-14

申请人： Mark Harrison Baker ,  Nikhil Kelkar

发明人： Mark Harrison Baker ,  Nikhil Kelkar

IPC分类号： H01L2144

CPC分类号： H01L24/11 ,  H01L24/02 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/05552 ,  H01L2924/00

摘要： Flip chips with improved solder bump strength are provided. A solder mask layer is placed and patterned on a front side of a wafer of semiconductor chips with semiconductor devices and bond pads. The solder mask is patterned to expose the bond pads. Solder bumps are electrically connected to the bond pads. The solder mask is thick enough to extend up to at least a quarter of the solder bumps and is in contact with the solder bumps. The wafer is then cut into individual chips. The chips may be sold to customers, who may mount the chip on a substrate without underfill.

摘要翻译： 提供了具有改善的焊料凸块强度的翻转芯片。 在具有半导体器件和接合焊盘的半导体芯片的晶片的正面上放置并图案化焊接掩模层。 图案化焊接掩模以暴露接合焊盘。 焊接凸块电连接到接合焊盘。 焊接掩模厚度足以延伸至至少四分之一的焊料凸块并与焊料凸块接触。 然后将晶片切成单独的芯片。 这些芯片可能会被销售给客户，他们可以将芯片安装在基板上，而不需要底部填充。

公开(公告)号：US06238949B1

公开(公告)日：2001-05-29

申请号：US09336037

申请日：1999-06-18

申请人： Luu Nguyen ,  Ashok Prabhu ,  Nikhil Kelkar ,  Hem P. Takiar

发明人： Luu Nguyen ,  Ashok Prabhu ,  Nikhil Kelkar ,  Hem P. Takiar

IPC分类号： H01L2144

CPC分类号： H01L24/17 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49575 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/92127 ,  H01L2224/92225 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method and an apparatus for forming a plastic chip on chip module is disclosed. The plastic chip on chip module is formed by placing a stacked chip set into a molding chamber suitably arranged to receive encapsulant. The stacked chip set includes a daughter chip that is electrically and mechanically coupled to a mother chip where the daughter chip is directly aligned to and separated from the mother chip by a standoff gap. Encapsulant is then passed into the molding chamber filling the standoff gap substantially simultaneously with surrounding the chip set to form the plastic chip on chip module.

摘要翻译： 公开了一种用于形成芯片上的塑料芯片模块的方法和装置。 通过将堆叠的芯片组放置在适当地布置成接收密封剂的模制室中来形成芯片上的塑料芯片模块。 堆叠的芯片组包括电子和机械耦合到母芯片的子芯片，其中子芯片通过间隙与母芯片直接对准并与母芯片分离。 然后将封装剂填充到填充间隙的模制室中，同时围绕芯片组以形成芯片上的塑料芯片模块。

公开(公告)号：US08206836B2

公开(公告)日：2012-06-26

申请号：US12699811

申请日：2010-02-03

申请人： Loyde M. Carpenter, Jr. ,  Randolph Cruz ,  Nikhil Kelkar

发明人： Loyde M. Carpenter, Jr. ,  Randolph Cruz ,  Nikhil Kelkar

IPC分类号： H01L23/495 ,  H05K13/04

CPC分类号： H01L23/49562 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/37 ,  H01L24/38 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/38 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/13091 ,  H01L2924/14 ,  Y10T428/12188 ,  Y10T428/12354 ,  H01L2924/00014

摘要： A conductive clip having a riser or post formed along a side thereof includes a notch or opening formed in the riser or post to create a first riser or post section and second riser or post section separated by the notch or opening through which a tiebar extends. The conductive clip organization is will suited for formation as elongated strips of such conductive clips for automated machine assembly of the conductive clips in an integrated circuit package context.

摘要翻译： 具有沿着其侧面形成的提升管或柱的导电夹具包括形成在提升管或柱中的切口或开口，以形成第一提升管或后部段，以及由连接杆延伸通过的切口或开口分开的第二提升管或后部段。 导电夹具组织将适合于形成为用于在集成电路封装环境中的导电夹子的自动化机器组装的这种导电夹的细长条带。

公开(公告)号：US20120098090A1

公开(公告)日：2012-04-26

申请号：US13069789

申请日：2011-03-23

申请人： Francois Hebert ,  Shea Petricek ,  Nikhil Kelkar

发明人： Francois Hebert ,  Shea Petricek ,  Nikhil Kelkar

IPC分类号： H01L29/92 ,  H01L21/56

CPC分类号： H01L23/49589 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/16 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/16265 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/3718 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48265 ,  H01L2224/4912 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01056 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power converter device comprises a substrate, a power die mounted on the substrate, and a capacitor die mounted over the power die in a stacked configuration. The capacitor die is electrically coupled to the power die. A packaging material encapsulates the power die and the capacitor die. An integrated circuit die can also be mounted to the substrate and electrically coupled to the power die to receive power signals from the power die, with the packaging material also encapsulating the integrated circuit die.

摘要翻译： 功率转换器装置包括衬底，安装在衬底上的功率管芯和以堆叠构造安装在功率管芯上的电容器管芯。 电容器管芯电耦合到功率管芯。 封装材料封装了电源管芯和电容器管芯。 集成电路管芯也可以安装到衬底上并且电耦合到功率管芯以从功率管芯接收功率信号，封装材料也封装集成电路管芯。

公开(公告)号：US20100259766A1

公开(公告)日：2010-10-14

申请号：US12499693

申请日：2009-07-08

申请人： Lynn K. Wiese ,  Nikhil Kelkar ,  Viraj Patwardhan

发明人： Lynn K. Wiese ,  Nikhil Kelkar ,  Viraj Patwardhan

IPC分类号： G01B11/14 ,  B23K26/38

CPC分类号： H01L25/167 ,  H01L33/58 ,  H01L2224/49171

摘要： Provided herein are optical sensor devices, methods for making the same, and systems including the same. An optical sensor device, according to an embodiment, includes a light detector die and a light source die attached to the same or different die attachment substrates so that there is a space between the light source die and the light detector die. A light transmissive material covers the light detector die, the light source die and at least a portion of the space between the light detector die and the light source die. A groove is formed (e.g., saw, blade or laser cut, or cast) in the light transmissive material between the light detector die and the light source die, and an opaque material is put within the groove to provide a light barrier between the light detector die and the light source die.

摘要翻译： 本文提供了光学传感器装置及其制造方法，以及包括该传感器装置的系统。 根据实施例的光学传感器装置包括光检测器管芯和附接到相同或不同的管芯附接衬底的光源管芯，使得在光源管芯和光检测器管芯之间存在空间。 透光材料覆盖光检测器管芯，光源管芯和光检测器管芯与光源管芯之间的至少一部分空间。 在光检测器管芯和光源管芯之间的透光材料中形成凹槽（例如，锯，刀片或激光切割或铸造），并且将不透明材料放置在凹槽内以在光线之间提供光屏障 检测器管芯和光源管芯。

公开(公告)号：US07923300B2

公开(公告)日：2011-04-12

申请号：US12477818

申请日：2009-06-03

申请人： David B. Bell ,  Francois Hebert ,  Nikhil Kelkar

发明人： David B. Bell ,  Francois Hebert ,  Nikhil Kelkar

IPC分类号： H01L21/00

CPC分类号： H01L27/088 ,  H01L21/26513 ,  H01L21/823437 ,  H01L21/823487 ,  H01L23/535 ,  H01L23/62 ,  H01L29/0619 ,  H01L29/0692 ,  H01L29/0696 ,  H01L29/1083 ,  H01L29/1095 ,  H01L29/402 ,  H01L29/4175 ,  H01L29/41766 ,  H01L29/41775 ,  H01L29/456 ,  H01L29/66659 ,  H01L29/66681 ,  H01L29/66696 ,  H01L29/66712 ,  H01L29/66734 ,  H01L29/7802 ,  H01L29/7806 ,  H01L29/7811 ,  H01L29/7813 ,  H01L29/7816 ,  H01L29/7835 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/30107 ,  H01L2924/3025 ,  H02M7/003 ,  H01L2924/00

摘要： A power converter can include an output circuit having a high-side device and a low-side device which can be formed on a single die (a “PowerDie”). The power converter can further include a controller integrated circuit (IC) formed on a different die which can be electrically coupled to, and co-packaged with, the PowerDie. The PowerDie can be attached to a die pad of a leadframe, and the controller IC die can be attached to an active surface of the first die such that the first die is interposed between the controller IC die and the die pad.

摘要翻译： 功率转换器可以包括具有可形成在单个管芯（“PowerDie”）上的高侧器件和低侧器件的输出电路。 功率转换器还可以包括形成在不同管芯上的控制器集成电路（IC），其可以与PowerDie电耦合并与其一体化。 PowerDie可以附接到引线框架的管芯焊盘，并且控制器IC管芯可以附接到第一管芯的有源表面，使得第一管芯插在控制器IC管芯和管芯焊盘之间。