公开(公告)号：US20020004352A1

公开(公告)日：2002-01-10

申请号：US09826718

申请日：2001-04-04

Applicant: AlliedSignal, Inc.

Inventor： David Haas ,  Chengzeng Xu ,  Mavyn McAuliffe ,  Scott Zimmerman ,  Laura Miller ,  Meifang Qin ,  Baopei Xu ,  Richard Pommer

IPC: B32B027/12 ,  B32B009/00 ,  B32B033/00 ,  B32B027/02

CPC classification number: H05K3/4626 ,  B29C70/885 ,  B32B7/06 ,  B32B15/08 ,  B32B17/04 ,  H05K3/0032 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0195 ,  H05K2201/0212 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/10378 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T428/1476 ,  Y10T428/24917 ,  Y10T428/2839 ,  Y10T442/2861 ,  Y10T442/2992 ,  Y10T442/60 ,  Y10T442/615 ,  Y10T442/616 ,  Y10T442/623 ,  Y10T442/674 ,  Y10T442/697

Abstract: This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.

Abstract translation: 本发明涉及包括非织造增强材料和至少一种树脂材料的可激光粘合层材料。 本发明还包括使用本发明的粘合层来制造高密度多层印刷线路板的方法。