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    Method for reducing aliasing in TDI based imaging
    1.
    发明授权
    Method for reducing aliasing in TDI based imaging 有权
    降低TDI成像中混叠的方法

    公开(公告)号：US08947521B1

    公开(公告)日：2015-02-03

    申请号：US13569607

    申请日：2012-08-08

    申请人： Andrew V. Hill ,  David W. Shortt

    发明人： Andrew V. Hill ,  David W. Shortt

    IPC分类号： H04N3/14 ,  H04N5/335 ,  G01N21/00 ,  G06K9/00 ,  H04N7/18

    CPC分类号： G01N21/8851 ,  G01N21/8803 ,  G01N21/9501 ,  G01N2021/8887 ,  G06T7/0004 ,  G06T2207/30148 ,  H04N5/217 ,  H04N5/23296 ,  H04N5/357 ,  H04N5/37206

    摘要： The invention may be embodied in a time delay integration (TDI) based sensor wafer inspection system that introduces controlled blur into the sampled image to suppress high spectral frequencies and thereby mitigate the occurrence of aliasing in the sampled image. Image blur may be introduced in the scan direction by desynchronizing the image motion (scan rate) from the charge transfer rate within the TDI sensor (sample clock rate). The scan rate may be desynchronized from the TDI sample clock rate by altering the speed of wafer movement, the sample clock rate, or the magnification of the imaging optics. Image blur may be introduced in the cross-scan direction by imparting a small alignment difference between the direction of image motion (image scan direction) and the direction that charges transfer within the TDI sensor (sensor direction).

    摘要翻译： 本发明可以体现在基于时间延迟积分（TDI）的传感器晶片检查系统中，该系统将受控模糊引入采样图像中以抑制高频谱频率，从而减轻采样图像中混叠的出现。 通过从TDI传感器内的电荷传输速率（采样时钟速率）中取消同步图像运动（扫描速率）可以在扫描方向上引入图像模糊。 通过改变晶片移动的速度，采样时钟速率或成像光学器件的放大倍数，扫描速率可以从TDI采样时钟速率去同步。 可以通过在图像运动方向（图像扫描方向）和TDI传感器（传感器方向）内传送的方向之间施加小的对准差来在横扫方向上引入图像模糊。

    System and method for conducting adaptive fourier filtering to detect defects in dense logic areas of an inspection surface
    2.
    发明授权
    System and method for conducting adaptive fourier filtering to detect defects in dense logic areas of an inspection surface 有权
    用于进行自适应傅立叶滤波以检测检查表面的密集逻辑区域中的缺陷的系统和方法

    公开(公告)号：US07505619B2

    公开(公告)日：2009-03-17

    申请号：US11314779

    申请日：2005-12-20

    申请人： Evan R. Mapoles ,  Grace H. Chen ,  Christopher F. Bevis ,  David W. Shortt

    发明人： Evan R. Mapoles ,  Grace H. Chen ,  Christopher F. Bevis ,  David W. Shortt

    IPC分类号： G06K9/00

    CPC分类号： G01N21/95607 ,  G01N21/47 ,  G01N21/95623 ,  G01N2021/8822

    摘要： A dark field surface inspection tool and system are disclosed herein. The tool includes an illumination source capable of scanning a light beam onto an inspection surface. Light scattered by each inspection point is captured as image data by a photo detector array arranged at a fourier plane. The images captured are adaptively filtered to remove a portion of the bright pixels from the images to generate filtered images. The filtered images are then analyzed to detect defects in the inspection surface. Methods of the invention include using die-to-die comparison to identify bright portions of scattering patterns and generate unique image filters associated with those patterns. The associated images are then filtered to generate filtered images which are then used to detect defects. Also, data models of light scattering behavior can be used to generate filters.

    摘要翻译： 本文公开了一种暗场表面检查工具和系统。 该工具包括能够将光束扫描到检查表面上的照明源。 由每个检查点散射的光通过布置在傅立叶平面上的光检测器阵列捕获为图像数据。 捕获的图像被自适应地滤波以从图像中去除一部分亮像素以产生滤波图像。 然后分析滤波图像以检测检查表面中的缺陷。 本发明的方法包括使用管芯到管芯的比较来识别散射图案的亮部分并且生成与这些图案相关联的独特的图像滤波器。 然后将相关联的图像过滤以产生滤波图像，然后将其用于检测缺陷。 此外，可以使用光散射行为的数据模型来生成滤波器。

    Defect detection
    3.
    发明授权
    Defect detection 有权
    缺陷检测

    公开(公告)号：US07796805B1

    公开(公告)日：2010-09-14

    申请号：US11234974

    申请日：2005-09-26

    申请人： Michael D. Kirk ,  Stephen A. Biellak ,  David W. Shortt

    发明人： Michael D. Kirk ,  Stephen A. Biellak ,  David W. Shortt

    IPC分类号： G06K9/00

    CPC分类号： G01N21/9501 ,  G01N21/94 ,  G01N21/956

    摘要： A wafer having improved inspection sensitivity to foreign matter on a top-most surface of the wafer, as detected with a surface scanning optical inspection system that uses an inspection wavelength. The wafer includes a substantially homogenous first layer at the top-most surface of the wafer, the first layer having a first thickness. The first layer is at least partially transparent to the inspection wavelength. A substantially homogenous second layer immediately underlies the first layer, the second layer having a second thickness. The second layer is at least partially transparent to the inspection wavelength. A substrate immediately underlies the second layer. The first thickness and the second thickness are set in a combination that produces a local minimum of an electric field at the top-most surface and a local maximum of an electric field within one hundred nanometers above the top-most surface.

    摘要翻译： 如使用检查波长的表面扫描光学检查系统检测到的，具有对晶片最顶面上的杂质的检查灵敏度提高的晶片。 晶片在晶片的最顶表面包括基本均匀的第一层，第一层具有第一厚度。 第一层对于检测波长至少部分透明。 基本均匀的第二层紧邻第一层，第二层具有第二厚度。 第二层对于检查波长至少部分透明。 底物紧靠第二层。 第一厚度和第二厚度被设置为组合，其产生最顶面处的电场的局部最小值，以及最高表面之上的百纳米以内的电场的局部最大值。

    Darkfield inspection system having a programmable light selection array
    5.
    发明授权
    Darkfield inspection system having a programmable light selection array 有权
    具有可编程光选择阵列的暗场检查系统

    公开(公告)号：US07199874B2

    公开(公告)日：2007-04-03

    申请号：US11297028

    申请日：2005-12-07

    申请人： Christopher F. Bevis ,  Paul J. Sullivan ,  David W. Shortt ,  George J. Kren

    发明人： Christopher F. Bevis ,  Paul J. Sullivan ,  David W. Shortt ,  George J. Kren

    IPC分类号： G01N21/88

    CPC分类号： G01N21/4738 ,  G01N21/8806 ,  G01N2021/8822

    摘要： An inspection tool embodiment includes an illumination source for directing a light beam onto a workpiece to generate scattered light that includes the ordinary scattering pattern of the workpiece as well as light scattered from defects of the workpiece. The embodiment includes a programmable light selection array that receives light scattered from the workpiece and selectively directs the light scattered from defects onto a photosensor which detects the defect signal. Processing circuitry receives the defect signal and conducts surface analysis of the workpiece that can include the characterizing of defects of the workpiece. The programmable light selection arrays can include, but are not limited to, reflector arrays and filter arrays. The invention also includes associated surface inspection methods.

    摘要翻译： 检查工具实施例包括用于将光束引导到工件上以产生散射光的照明源，其包括工件的普通散射图案以及从工件的缺陷散射的光。 该实施例包括可编程光选择阵列，其接收从工件散射的光并选择性地将从缺陷散射的光引导到检测缺陷信号的光电传感器上。 处理电路接收缺陷信号并进行可能包括工件缺陷表征的工件的表面分析。 可编程光选择阵列可以包括但不限于反射器阵列和滤波器阵列。 本发明还包括相关的表面检查方法。

    Darkfield inspection system having photodetector array
    6.
    发明授权
    Darkfield inspection system having photodetector array 有权
    具有光电检测器阵列的暗场检查系统

    公开(公告)号：US07061598B1

    公开(公告)日：2006-06-13

    申请号：US10315340

    申请日：2002-12-09

    申请人： Christopher F. Bevis ,  David W. Shortt

    发明人： Christopher F. Bevis ,  David W. Shortt

    IPC分类号： G01N21/00

    CPC分类号： G01N21/47 ,  G01N21/9501 ,  G01N2021/8822

    摘要： A darkfield surface inspection tool of the invention includes an illumination source for illuminating a workpiece and generating a light scattering pattern. The light scattering pattern being configured such that the positions of the light beams of the scattering pattern are uniquely related to the scattering angles of the light beams as they are scattered from the workpiece. The tool also includes a photodetector array positioned at a detector surface to detect the light scattering pattern as it reaches the detector surface. The photodetector array produces an electrical signal that is received by signal processing electronics of the tool and can be used to characterize defects on the workpiece. The invention also includes darkfield surface inspection methods.

    摘要翻译： 本发明的暗视场表面检查工具包括用于照亮工件并产生光散射图案的照明源。 光散射图案被配置为使得散射图案的光束的位置与从工件散射的光束的散射角唯一相关。 该工具还包括位于检测器表面处的光电检测器阵列，以便在其到达检测器表面时检测光散射图案。 光电检测器阵列产生由工具的信号处理电路接收的电信号，并且可用于表征工件上的缺陷。 本发明还包括暗场表面检查方法。

    Darkfield inspection system having a programmable light selection array
    7.
    发明授权
    Darkfield inspection system having a programmable light selection array 有权
    具有可编程光选择阵列的暗场检查系统

    公开(公告)号：US07002677B2

    公开(公告)日：2006-02-21

    申请号：US10714257

    申请日：2003-11-14

    申请人： Christopher F. Bevis ,  Paul J. Sullivan ,  David W. Shortt ,  George J. Kren

    发明人： Christopher F. Bevis ,  Paul J. Sullivan ,  David W. Shortt ,  George J. Kren

    IPC分类号： G01N21/88

    CPC分类号： G01N21/4738 ,  G01N21/8806 ,  G01N2021/8822

    摘要： An inspection tool embodiment includes an illumination source for directing a light beam onto a workpiece to generate scattered light that includes the ordinary scattering pattern of the workpiece as well as light scattered from defects of the workpiece. The embodiment includes a programmable light selection array that receives light scattered from the workpiece and selectively directs the light scattered from defects onto a photosensor which detects the defect signal. Processing circuitry receives the defect signal and conducts surface analysis of the workpiece that can include the characterizing of defects of the workpiece. The programmable light selection arrays can include, but are not limited to, reflector arrays and filter arrays. The invention also includes associated surface inspection methods.

    摘要翻译： 检查工具实施例包括用于将光束引导到工件上以产生散射光的照明源，其包括工件的普通散射图案以及从工件的缺陷散射的光。 该实施例包括可编程光选择阵列，其接收从工件散射的光并选择性地将从缺陷散射的光引导到检测缺陷信号的光电传感器上。 处理电路接收缺陷信号并进行可能包括工件缺陷表征的工件的表面分析。 可编程光选择阵列可以包括但不限于反射器阵列和滤波器阵列。 本发明还包括相关的表面检查方法。

    Process for identifying defects in a substrate having non-uniform surface properties
    9.
    发明授权
    Process for identifying defects in a substrate having non-uniform surface properties 有权
    用于识别具有不均匀表面性质的基底中的缺陷的方法

    公开(公告)号：US06781688B2

    公开(公告)日：2004-08-24

    申请号：US10327484

    申请日：2002-12-20

    申请人： George J. Kren ,  Mehdi Vaez-Iravani ,  David W. Shortt

    发明人： George J. Kren ,  Mehdi Vaez-Iravani ,  David W. Shortt

    IPC分类号： G01N2100

    CPC分类号： G01N21/9501

    摘要： A surface inspection method of the invention includes scanning an inspection surface taking surface measurements. Determinations of various noise levels in the surface are made based on variations in the surface measurements. A dynamic threshold is then determined. The dynamic threshold adapts to the noise levels in the inspection surface to provide a varying threshold that can provide areas of high and low defect sensitivity on the same inspection surface. Defects are then identified by comparing surface measurements with the dynamic threshold. Additionally, the invention includes a surface inspection method that uses signal-to-noise ratios to identify defects. Such a method scans an inspection surface to obtain surface measurements. Noise levels associated with the inspection surface are then determined. Signal-to-noise ratios are determined for the surface measurements. The signal-to-noise ratios are compared with a signal-to-noise ratio threshold value. Defects are identified based on the comparisons of the signal-to-noise ratio of the surface measurements with the signal-to-noise ratio threshold value.

    摘要翻译： 本发明的表面检查方法包括扫描检查表面进行表面测量。 基于表面测量的变化确定表面中各种噪声水平。 然后确定动态阈值。 动态阈值适应于检查表面中的噪声水平，以提供可在同一检查表面上提供高和低缺陷灵敏度区域的变化阈值。 然后通过将表面测量与动态阈值进行比较来识别缺陷。 此外，本发明包括使用信噪比来识别缺陷的表面检查方法。 这种方法扫描检查表面以获得表面测量。 然后确定与检查表面相关联的噪声水平。 确定表面测量的信噪比。 将信噪比与信噪比阈值进行比较。 基于表面测量的信噪比与信噪比阈值的比较来识别缺陷。