SEMICONDUCTOR DEVICES HAVING MODULATED NANOWIRE COUNTS
    2.
    发明申请
    SEMICONDUCTOR DEVICES HAVING MODULATED NANOWIRE COUNTS 审中-公开
    具有调制纳米级数的半导体器件

    公开(公告)号:US20130313513A1

    公开(公告)日:2013-11-28

    申请号:US13996505

    申请日:2011-12-23

    摘要: Semiconductor devices having modulated nanowire counts and methods to form such devices are described. For example, a semiconductor structure includes a first semiconductor device having a plurality of nanowires disposed above a substrate and stacked in a first vertical plane with a first uppermost nanowire. A second semiconductor device has one or more nanowires disposed above the substrate and stacked in a second vertical plane with a second uppermost nanowire. The second semiconductor device includes one or more fewer nanowires than the first semiconductor device. The first and second uppermost nanowires are disposed in a same plane orthogonal to the first and second vertical planes.

    摘要翻译: 描述了具有调制纳米线计数的半导体器件和形成这种器件的方法。 例如,半导体结构包括具有多个纳米线的第一半导体器件,该多个纳米线设置在衬底上并且堆叠在具有第一最上层纳米线的第一垂直平面中。 第二半导体器件具有设置在衬底上方的一个或多个纳米线并且堆叠在具有第二最上层纳米线的第二垂直平面中。 第二半导体器件包括比第一半导体器件少的一个或多个纳米线。 第一和第二最上层的纳米线设置在与第一和第二垂直平面正交的同一平面中。

    SEMICONDUCTOR DEVICES HAVING THREE-DIMENSIONAL BODIES WITH MODULATED HEIGHTS
    10.
    发明申请
    SEMICONDUCTOR DEVICES HAVING THREE-DIMENSIONAL BODIES WITH MODULATED HEIGHTS 有权
    具有调制高度的三维体的半导体器件

    公开(公告)号:US20130320448A1

    公开(公告)日:2013-12-05

    申请号:US13995467

    申请日:2011-12-21

    IPC分类号: H01L29/78 H01L29/66

    摘要: Semiconductor devices having three-dimensional bodies with modulated heights and methods to form such devices are described. For example, a semiconductor structure includes a first semiconductor device having a first semiconductor body disposed above a substrate. The first semiconductor body has a first height and an uppermost surface with a first horizontal plane. The semiconductor structure also includes a second semiconductor device having a second semiconductor body disposed above the substrate. The second semiconductor body has a second height and an uppermost surface with a second horizontal plane. The first and second horizontal planes are co-planar and the first and second heights are different.

    摘要翻译: 描述具有调制高度的三维体的半导体器件和形成这种器件的方法。 例如,半导体结构包括具有设置在基板上方的第一半导体本体的第一半导体器件。 第一半导体本体具有第一高度和具有第一水平面的最上表面。 半导体结构还包括具有设置在衬底上方的第二半导体本体的第二半导体器件。 第二半导体本体具有第二高度和具有第二水平面的最上表面。 第一和第二水平面是共面的,第一和第二高度是不同的。