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公开(公告)号：US07482683B2
公开(公告)日：2009-01-27
申请号：US11383038
申请日：2006-05-12
申请人： Antonio B. Dimaano, Jr. , Erick Dahilig , Sheila Marie L. Alvarez , Robinson Quiazon , Jose Alvin Caparas
发明人： Antonio B. Dimaano, Jr. , Erick Dahilig , Sheila Marie L. Alvarez , Robinson Quiazon , Jose Alvin Caparas
CPC分类号： H01L23/49541 , H01L21/565 , H01L23/49548 , H01L24/97 , H01L2224/16245 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： An integrated circuit encapsulation system with vent is provided including providing a sheet material, forming a leadframe array on the sheet material, forming a leadframe air vent on the leadframe array, attaching an integrated circuit to the leadframe array, mounting the leadframe array in a mold and encapsulating the integrated circuit and the leadframe array.
摘要翻译： 提供具有通气孔的集成电路封装系统，包括提供片材，在片材上形成引线框架阵列，在引线框阵列上形成引线框架通气孔，将集成电路连接到引线框架阵列，将引线框阵列安装在模具中 并封装集成电路和引线框阵列。
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公开(公告)号：US07443015B2
公开(公告)日：2008-10-28
申请号：US11381734
申请日：2006-05-04
IPC分类号： H01L21/00
CPC分类号： H01L23/49548 , H01L23/49503 , H01L23/4951 , H01L24/16 , H01L24/81 , H01L2224/10175 , H01L2224/13099 , H01L2224/16245 , H01L2224/8121 , H01L2224/81815 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/18301 , H01L2924/00
摘要： An integrated circuit package system includes an integrated circuit package having a downset terminal lead, a planar recessed lead surface of the downset terminal lead, and an attached integrated circuit over the planar recessed lead surface.
摘要翻译： 集成电路封装系统包括集成电路封装，其具有开路端子引线，开路端子引线的平面凹陷引线表面和平面凹陷引线表面上的附接集成电路。
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公开(公告)号：US07250685B2
公开(公告)日：2007-07-31
申请号：US11307384
申请日：2006-02-04
IPC分类号： H01L23/48
CPC分类号： H01L23/3107 , H01L21/4828 , H01L23/49548 , H01L23/49568 , H01L24/17 , H01L2224/13099 , H01L2224/16245 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/00
摘要： The present invention provides an etched leadframe flipchip package system comprising forming a leadframe comprises forming contact leads and etching a plurality of multiple dotted grooves on the contact leads, and attaching a flipchip integrated circuit having solder interconnects on the contact leads between each of the plurality of the multiple dotted grooves.
摘要翻译： 本发明提供了一种蚀刻引线框倒装芯片封装系统，包括形成引线框架，包括形成接触引线并在接触引线上蚀刻多个多点状沟槽，以及将具有焊料互连的倒装芯片集成电路连接在多个 多点划线。
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4.发明申请SEMICONDUCTOR FLIP CHIP PACKAGE HAVING SUBSTANTIALLY NON-COLLAPSIBLE SPACER AND METHOD OF MANUFACTURE THEREOF 有权具有主要不可剥离间隔件的半导体片状芯片包及其制造方法公开(公告)号：US20110108970A1
公开(公告)日：2011-05-12
申请号：US13006697
申请日：2011-01-14
申请人： Jae Soo Lee , Geun Sik Kim , Sheila Marie L. Alvarez , Robinson Quiazon , Hin Hwa Goh , Frederick Dahilig
发明人： Jae Soo Lee , Geun Sik Kim , Sheila Marie L. Alvarez , Robinson Quiazon , Hin Hwa Goh , Frederick Dahilig
IPC分类号： H01L23/495 , H01L23/48 , H01L21/50
CPC分类号： H01L23/49513 , H01L23/16 , H01L23/3107 , H01L23/4952 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/0401 , H01L2224/0603 , H01L2224/06505 , H01L2224/10165 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13144 , H01L2224/136 , H01L2224/1403 , H01L2224/14505 , H01L2224/16 , H01L2224/16245 , H01L2224/81136 , H01L2224/8114 , H01L2224/81193 , H01L2224/81801 , H01L2924/01027 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A flip chip lead frame package includes a die and a lead frame having a die paddle and leads, and has a spacer to maintain a separation between the die and the die paddle. Also, methods for making the package are disclosed.
摘要翻译： 倒装芯片引线框架封装包括管芯和具有管芯焊盘和引线的引线框架，并且具有间隔件以保持管芯和管芯焊盘之间的间隔。 此外，公开了制造包装的方法。
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公开(公告)号：US07414318B2
公开(公告)日：2008-08-19
申请号：US11766095
申请日：2007-06-20
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , H01L21/4828 , H01L23/49548 , H01L23/49568 , H01L24/17 , H01L2224/13099 , H01L2224/16245 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/00
摘要： The present invention provides an etched leadframe flipchip package system comprising forming a leadframe comprises forming contact leads and etching a plurality of multiple dotted grooves on the contact leads, and attaching a flipchip integrated circuit having solder interconnects on the contact leads between each of the plurality of the multiple dotted grooves.
摘要翻译： 本发明提供了一种蚀刻引线框倒装芯片封装系统，包括形成引线框架，包括形成接触引线并在接触引线上蚀刻多个多点状沟槽，以及将具有焊料互连的倒装芯片集成电路连接在多个 多点划线。
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6.发明授权Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof 有权具有基本上不可折叠间隔物的半导体倒装芯片封装及其制造方法公开(公告)号：US08405230B2
公开(公告)日：2013-03-26
申请号：US13006697
申请日：2011-01-14
申请人： Jae Soo Lee , Geun Sik Kim , Sheila Marie L. Alvarez , Robinson Quiazon , Hin Hwa Goh , Frederick Rodriguez Dahilig
发明人： Jae Soo Lee , Geun Sik Kim , Sheila Marie L. Alvarez , Robinson Quiazon , Hin Hwa Goh , Frederick Rodriguez Dahilig
IPC分类号： H01L23/495 , H01L23/48 , H01L21/50
CPC分类号： H01L23/49513 , H01L23/16 , H01L23/3107 , H01L23/4952 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/0401 , H01L2224/0603 , H01L2224/06505 , H01L2224/10165 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13144 , H01L2224/136 , H01L2224/1403 , H01L2224/14505 , H01L2224/16 , H01L2224/16245 , H01L2224/81136 , H01L2224/8114 , H01L2224/81193 , H01L2224/81801 , H01L2924/01027 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A flip chip lead frame package includes a die and a lead frame having a die paddle and leads, and has a spacer to maintain a separation between the die and the die paddle. Also, methods for making the package are disclosed.
摘要翻译： 倒装芯片引线框架封装包括管芯和具有管芯焊盘和引线的引线框架，并且具有间隔件以保持管芯和管芯焊盘之间的间隔。 此外，公开了制造包装的方法。
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公开(公告)号：US20070262423A1
公开(公告)日：2007-11-15
申请号：US11383038
申请日：2006-05-12
IPC分类号： H01L23/495
CPC分类号： H01L23/49541 , H01L21/565 , H01L23/49548 , H01L24/97 , H01L2224/16245 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： An integrated circuit encapsulation system with vent is provided including providing a sheet material, forming a leadframe array on the sheet material, forming a leadframe air vent on the leadframe array, attaching an integrated circuit to the leadframe array, mounting the leadframe array in a mold and encapsulating the integrated circuit and the leadframe array.
摘要翻译： 提供具有通气孔的集成电路封装系统，包括提供片材，在片材上形成引线框架阵列，在引线框阵列上形成引线框架通气孔，将集成电路连接到引线框架阵列，将引线框阵列安装在模具中 并封装集成电路和引线框阵列。
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公开(公告)号：US20070108565A1
公开(公告)日：2007-05-17
申请号：US11307384
申请日：2006-02-04
IPC分类号： H01L23/495 , H01L21/00
CPC分类号： H01L23/3107 , H01L21/4828 , H01L23/49548 , H01L23/49568 , H01L24/17 , H01L2224/13099 , H01L2224/16245 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/00
摘要： The present invention provides an etched leadframe flipchip package system comprising forming a leadframe comprises forming contact leads and etching a plurality of multiple dotted grooves on the contact leads, and attaching a flipchip integrated circuit having solder interconnects on the contact leads between each of the plurality of the multiple dotted grooves.
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9.发明授权Semiconductor flip chip package having substantially non-collapsible spacer 有权具有基本上不可折叠间隔件的半导体倒装芯片封装公开(公告)号：US07880313B2
公开(公告)日：2011-02-01
申请号：US11282293
申请日：2005-11-17
申请人： Jae Soo Lee , Geun Sik Kim , Sheila Alvarez , Robinson Quiazon , Hin Hwa Goh , Frederick Dahilig
发明人： Jae Soo Lee , Geun Sik Kim , Sheila Alvarez , Robinson Quiazon , Hin Hwa Goh , Frederick Dahilig
IPC分类号： H01L23/495
CPC分类号： H01L23/49513 , H01L23/16 , H01L23/3107 , H01L23/4952 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/0401 , H01L2224/0603 , H01L2224/06505 , H01L2224/10165 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13144 , H01L2224/136 , H01L2224/1403 , H01L2224/14505 , H01L2224/16 , H01L2224/16245 , H01L2224/81136 , H01L2224/8114 , H01L2224/81193 , H01L2224/81801 , H01L2924/01027 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A flip chip lead frame package includes a die and a lead frame having a die paddle and leads, and has a spacer to maintain a separation between the die and the die paddle. Also, methods for making the package are disclosed.
摘要翻译： 倒装芯片引线框架封装包括管芯和具有管芯焊盘和引线的引线框架，并且具有间隔件以保持管芯和管芯焊盘之间的间隔。 此外，公开了制造包装的方法。
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公开(公告)号：US20070241432A1
公开(公告)日：2007-10-18
申请号：US11766095
申请日：2007-06-20
申请人： Il Kwon Shim , Sheila Alvarez , Hin Hwa Goh , Robinson Quiazon
发明人： Il Kwon Shim , Sheila Alvarez , Hin Hwa Goh , Robinson Quiazon
IPC分类号： H01L23/495 , H01L21/00
CPC分类号： H01L23/3107 , H01L21/4828 , H01L23/49548 , H01L23/49568 , H01L24/17 , H01L2224/13099 , H01L2224/16245 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/00
摘要： The present invention provides an etched leadframe flipchip package system comprising forming a leadframe comprises forming contact leads and etching a plurality of multiple dotted grooves on the contact leads, and attaching a flipchip integrated circuit having solder interconnects on the contact leads between each of the plurality of the multiple dotted grooves.
摘要翻译： 本发明提供了一种蚀刻引线框倒装芯片封装系统，包括形成引线框架，包括形成接触引线并在接触引线上蚀刻多个多点状沟槽，以及将具有焊料互连的倒装芯片集成电路连接在多个 多点划线。
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