公开(公告)号：US20170082509A1

公开(公告)日：2017-03-23

申请号：US15238450

申请日：2016-08-16

Applicant: Apple Inc.

Inventor： Tyler S. BUSHNELL ,  William C. LUKENS ,  Brad G. BOOZER ,  Jason C. SAUERS

IPC: G01L5/00 ,  H05K5/03 ,  H05K5/06

CPC classification number: G06F1/1626 ,  G01L1/142 ,  G06F1/1637 ,  G06F1/1656 ,  G06F1/1684 ,  G06F2200/1633

Abstract: An electronic device is disclosed. The electronic device may include a sealing element between a protective cover and a housing of the electronic device. The sealing element may provide a seal between the protective cover and the enclosure, as well as monitor or detect a force to the protective cover. Also, one or more support members may surround the sealing element to provide protection against a material (such as liquid) entering an opening between the protective cover and the enclosure. Alternatively, or in combination, the sealing element may include several openings, each of which may include a restraining element to limit movement of the sealing element. Also, a blocking element may be placed at or near an edge of the enclosure to provide additional reinforcement if the sealing element is laterally displaced. The blocking element may include an operational component of the electronic device, such as an antenna.

公开(公告)号：US20240389285A1

公开(公告)日：2024-11-21

申请号：US18689837

申请日：2022-09-16

Applicant: Apple Inc.

Inventor： Laura M. CAMPO ,  Samuel A. RESNICK ,  Dragos MOROIANU ,  Sivesh SELVAKUMAR ,  Jason C. SAUERS ,  Phil M. HOBSON

IPC: H05K7/20 ,  H05K5/02

Abstract: An electronic device is provided that includes a heatsink, an electrical circuit mounted on the heatsink, and a chassis. A plurality of heat-insulating connectors mounting the heatsink to the chassis at a first plurality of mount points, and a plurality of heat-conducting connectors mounting the heatsink to the chassis at a second plurality of mount points. The first plurality of mount points are located closer to the electrical circuit mounted on the heatsink than the second plurality of mount points.

公开(公告)号：US20230208079A1

公开(公告)日：2023-06-29

申请号：US17992795

申请日：2022-11-22

Applicant: Apple Inc.

Inventor： Noell G. JOHNSON ,  David R. CRAMER ,  Sina BIGDELI ,  Edward S. HUO ,  Jeremy C. FRANKLIN ,  Jason C. SAUERS

IPC: H01R13/639 ,  H01R12/77 ,  H05K1/18

CPC classification number: H01R13/639 ,  H01R12/771 ,  H05K1/18 ,  H01R12/79

Abstract: Cowlings described herein for board-to-board connectors can provide high stiffness, low weight, and low total cost. Such cowlings can provide ribs with increased thickness for targeted stiffness to resist bowing in a given direction. The layers of the cowlings can include carbon fiber extending in directions parallel to the ribs in some layers and transverse to the ribs in other layers. The layers can be formed together within a mold tool that shapes the fibers into the ribs.

公开(公告)号：US20170084395A1

公开(公告)日：2017-03-23

申请号：US15086813

申请日：2016-03-31

Applicant: Apple Inc.

Inventor： Paul A. MARTINEZ ,  Jason C. SAUERS ,  Shawn X. ARNOLD

IPC: H01G4/30 ,  H05K1/18 ,  G06F1/18 ,  H01G4/12

CPC classification number: A62C31/22 ,  A62C31/02 ,  A62C33/04 ,  E06B5/16 ,  E06B5/162 ,  F16L5/04 ,  H01G4/012 ,  H01G4/1218 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38 ,  H05K1/18 ,  H05K2201/10015

Abstract: This application relates to capacitors that resist deformation because of the configuration of their conductive and dielectric layers. The capacitors are multilayer capacitors that include multiple dielectric and conductive layers. The dielectric layers can be arranged in a way that creates a rigid barrier or dead zone, which can resist mechanical deformation when the multilayer capacitor is charged. In some embodiments, two or more multilayer capacitors are stacked together in an arrangement that causes each of the multilayer capacitors to cancel any deformations of the other when the multilayer capacitors are charged. In this way, noise exhibited by the multilayer capacitors can be reduced.

公开(公告)号：US20240329411A1

公开(公告)日：2024-10-03

申请号：US18579294

申请日：2022-07-12

Applicant: Apple Inc.

Inventor： Paul X. WANG ,  Jason C. SAUERS

IPC: G02B27/01

CPC classification number: G02B27/0176

Abstract: Head-mountable devices can include connection and engagement mechanisms that facilitate operation of a head-mountable device with an accessory device. Such connections can provide both mechanical engagement and operable communication between the connected devices. A variable lock of the head-mountable device can distinguish between low-impulse and high-impulse forces applied to one or more connection regions. In the event of a low-impulse force, the variable lock can secure segments of a head engager together so the head-mountable device can remain on the head of the user. Optionally, the accessory device can be disconnected from the head-mountable device. In the event of a high-impulse force, the variable lock can allow segments of the head engager to separate so the head-mountable device can be released from the head of the user.

公开(公告)号：US20240068484A1

公开(公告)日：2024-02-29

申请号：US18225043

申请日：2023-07-21

Applicant: Apple Inc.

Inventor： Jesse T. DYBENKO ,  Arash NAGHIB LAHOUTI ,  Jason C. SAUERS ,  Jeffrey R. KAPPER ,  Sivesh SELVAKUMAR ,  David J. DUNSMOOR

IPC: F04D29/28 ,  F04D29/42 ,  F04D29/62 ,  F04D29/70

CPC classification number: F04D29/281 ,  F04D29/4226 ,  F04D29/626 ,  F04D29/703

Abstract: A head-mountable device can include a fan that effectively manages heat while also mitigating the intrusion of particles and other debris. Fans can include a protrusion that creates a tortuous pathway to direct incoming particles away from sensitive regions. Fans can include openings to allow particles to exit the fan enclosure and avoid interaction with the impeller. Fans can include a variable spacing between the impeller and the base plate to avoid collection of particles. Fans can include an adhesive pad that collects and retains particles at a location that does not interfere with rotation of the impeller.