SEALED COMPONENTS FOR HEAT MANAGEMENT AND GROUNDING

    公开(公告)号:US20250004501A1

    公开(公告)日:2025-01-02

    申请号:US18693140

    申请日:2022-09-16

    Applicant: Apple Inc.

    Abstract: A head-mountable device (100) can include electronic circuits, such as cameras (150, 350, 450), sensors (170), and input/output devices. The head-mountable device can secure such electronic circuits with an assembly that also provides thermal dissipation, electrical grounding, and a sealed chamber (312, 412) to isolate the electronic circuit from ingress of debris. The assembly can provide a degree of mobility, where desired. Accordingly, the electronic circuit can operate more optimally and with lower risk of degradation and interference with other components of the head-mountable device.

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