PIEZOELECTRIC MEMS VALVE FOR AN ELECTRONIC DEVICE

    公开(公告)号:US20230269507A1

    公开(公告)日:2023-08-24

    申请号:US18095871

    申请日:2023-01-11

    Applicant: Apple Inc.

    CPC classification number: H04R1/10 H04R2201/003

    Abstract: A micro-electromechanical systems (MEMS) package comprising: a MEMS package comprising a substrate and a lid coupled to the substrate; a piezoelectric valve coupled to the substrate and comprising a number of movable members operable to be deformed in opposite directions upon application of a voltage to modify an acoustic resistance of an acoustic port; and a first stopper defined by the substrate and a second stopper defined by the lid, the first stopper and the second stopper being aligned with the number of movable members and operable to prevent an undesirable defection of the number of movable members.

    PIEZOELECTRIC MEMS VALVE FOR AN ELECTRONIC DEVICE

    公开(公告)号:US20230270010A1

    公开(公告)日:2023-08-24

    申请号:US18095870

    申请日:2023-01-11

    Applicant: Apple Inc.

    CPC classification number: H10N30/2042 H10N30/87 F16K31/006

    Abstract: A piezoelectric valve comprising: a fixed portion defining an opening; and a number of movable portions extending from the fixed portion over the opening and separated from one another by radially oriented slits, each movable portion of the number of movable portions comprising a first material layer and a second material layer, and at least one of the first material layer or the second material layer comprises a piezoelectric material that is operable to drive a displacement of the movable portion in a direction opposite to an adjacent movable portion sharing a same radially oriented slit upon application of a voltage.

    MEMS SPEAKER
    3.
    发明申请

    公开(公告)号:US20220014853A1

    公开(公告)日:2022-01-13

    申请号:US17177178

    申请日:2021-02-16

    Applicant: Apple Inc.

    Abstract: Aspects of the subject technology relate to electronic devices having speakers such as microelectromechanical systems (MEMS) speakers. A MEMS speaker can include an electrostatically driven, corrugated MEMS structure to move air without a magnet, coil, or traditional speaker membrane, and thus provide a low-power, compact speaker with a large acoustically active area in a small volume. Neighboring folds in the corrugated MEMS structure may form pairs of MEMS electrodes that can be pushed together and/or pulled apart to deform the MEMS structure in a breathing motion that generates pressure differentials on opposing sides of the corrugated MEMS structure to generate sound. Additional modes of operation are described.

    CYLINDRICAL MEMS STRUCTURES FOR AUDIO COMPONENTS

    公开(公告)号:US20240121559A1

    公开(公告)日:2024-04-11

    申请号:US18239114

    申请日:2023-08-28

    Applicant: Apple Inc.

    Abstract: Aspects of the subject technology relate to electronic devices having speakers such as microelectromechanical systems (MEMS) speakers. A MEMS speaker can include cylindrical corrugated MEMS structure. The cylindrical corrugated MEMS structure may include a contiguous MEMS structure with corrugations that run around an open cylindrical core that is defined, in part, by interior folds of the corrugations. The cylindrical corrugated MEMS structure may be deformed, responsive to an applied voltage, such that a portion of the cylindrical corrugated MEMS structure bends into and/or out of the open cylindrical core to push air out of and/or pull air into the open cylindrical core. In one or more implementations, a MEMS speaker may include an array of cylindrical corrugated MEMS structures.

    VENTED LIQUID-RESISTANT MICROPHONE ASSEMBLY
    5.
    发明公开

    公开(公告)号:US20240114277A1

    公开(公告)日:2024-04-04

    申请号:US18537741

    申请日:2023-12-12

    Applicant: Apple Inc.

    CPC classification number: H04R1/08 H04R1/04

    Abstract: Aspects of the subject technology relate to liquid-resistant microphone modules for electronic devices. A microphone module may include a non-porous membrane that seals the front volume of the microphone module from the external environment of the electronic device. The microphone module may also include a substrate having an opening that allows airflow between the front volume and an interior cavity within the housing of the electronic device. In various implementations, an inductive vent and/or a resistive vent may be provided over the opening in the substrate.

    MEMS SPEAKER
    7.
    发明公开
    MEMS SPEAKER 审中-公开

    公开(公告)号:US20240171915A1

    公开(公告)日:2024-05-23

    申请号:US18429342

    申请日:2024-01-31

    Applicant: Apple Inc.

    CPC classification number: H04R7/14 B81B3/0021 H04R19/02

    Abstract: Aspects of the subject technology relate to electronic devices having speakers such as microelectromechanical systems (MEMS) speakers. A MEMS speaker can include an electrostatically driven, corrugated MEMS structure to move air without a magnet, coil, or traditional speaker membrane, and thus provide a low-power, compact speaker with a large acoustically active area in a small volume. Neighboring folds in the corrugated MEMS structure may form pairs of MEMS electrodes that can be pushed together and/or pulled apart to deform the MEMS structure in a breathing motion that generates pressure differentials on opposing sides of the corrugated MEMS structure to generate sound. Additional modes of operation are described.

    VENTED LIQUID-RESISTANT MICROPHONE ASSEMBLY
    8.
    发明公开

    公开(公告)号:US20230262372A1

    公开(公告)日:2023-08-17

    申请号:US17670347

    申请日:2022-02-11

    Applicant: Apple Inc.

    CPC classification number: H04R1/08 H04R1/04

    Abstract: Aspects of the subject technology relate to liquid-resistant microphone modules for electronic devices. A microphone module may include a non-porous membrane that seals the front volume of the microphone module from the external environment of the electronic device. The microphone module may also include a substrate having an opening that allows airflow between the front volume and an interior cavity within the housing of the electronic device. In various implementations, an inductive vent and/or a resistive vent may be provided over the opening in the substrate.

    MEMS SPEAKER
    9.
    发明公开
    MEMS SPEAKER 审中-公开

    公开(公告)号:US20230179920A1

    公开(公告)日:2023-06-08

    申请号:US18102667

    申请日:2023-01-27

    Applicant: Apple Inc.

    CPC classification number: H04R7/14 B81B3/0021 H04R19/02

    Abstract: Aspects of the subject technology relate to electronic devices having speakers such as microelectromechanical systems (MEMS) speakers. A MEMS speaker can include an electrostatically driven, corrugated MEMS structure to move air without a magnet, coil, or traditional speaker membrane, and thus provide a low-power, compact speaker with a large acoustically active area in a small volume. Neighboring folds in the corrugated MEMS structure may form pairs of MEMS electrodes that can be pushed together and/or pulled apart to deform the MEMS structure in a breathing motion that generates pressure differentials on opposing sides of the corrugated MEMS structure to generate sound. Additional modes of operation are described.

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