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公开(公告)号：US20130329352A1
公开(公告)日：2013-12-12
申请号：US13683955
申请日：2012-11-21
Applicant: APPLE INC.
Inventor： Jay S. Nigen , Ron A. Hopkinson , Derek J. Yap , Eric A. Knopf , William F. Leggett , Richard H. Tan
CPC classification number: H01L23/3735 , F28F21/00 , G06F1/20 , H01L21/4882 , H01L23/3737 , H01L23/552 , H01L2924/0002 , H05K1/0201 , H05K1/141 , H05K3/0061 , H05K7/20436 , H05K7/205 , H05K2201/042 , H05K2201/10159 , H01L2924/00
Abstract: The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.
Abstract translation: 所公开的实施例涉及一种促进系统中的热传导的系统，该系统包括具有诸如固态驱动器的集成电路的电路板的模块。 使用电路板一侧和相邻基板之间的热耦合材料来增加电路板和基板之间的热传导。 此外，模块可以包括在基板和壳体之间的另外的热耦合材料，其至少部分地围绕电路板，从而增加基板和壳体之间的热传导。 以这些方式，底板和/或壳体可以用作传热表面或散热器，其减少与集成电路的操作相关联的热点。
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Patent Agency Ranking
公开(公告)号：US20130329910A1
公开(公告)日：2013-12-12
申请号：US13833636
申请日：2013-03-15
Applicant: Apple Inc.
Inventor： Justin D. Crosby , Derek J. Yap , William F. Leggett
CPC classification number: H04R3/00 , H04R5/02 , H04R31/00 , H04R2209/022 , H04R2499/15 , Y10T29/49005
Abstract: Systems and methods for reducing the effects of stray magnetic flux are provided. For example, an electronic device can employ the system and can include a first audio component configured to have a first acoustic phase and a first magnetic phase. The electronic device can also include a second audio component configured to have the first acoustic phase and a second magnetic phase that is opposite the first magnetic phase. The first audio component can be positioned with respect to the second audio component, such that any stray magnetic flux from the first audio component enters the second audio component during operation of the first and second audio components.
Abstract translation: 提供了减少杂散磁通效应的系统和方法。 例如，电子设备可以使用该系统并且可以包括被配置为具有第一声相和第一磁相的第一音频组件。 电子设备还可以包括被配置为具有第一声相和与第一磁相相对的第二磁相的第二音频分量。 可以相对于第二音频分量定位第一音频分量，使得来自第一音频分量的任何杂散磁通在第一和第二音频分量的操作期间进入第二音频分量。
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公开(公告)号：US09904333B2
公开(公告)日：2018-02-27
申请号：US13866922
申请日：2013-04-19
Applicant: Apple Inc.
Inventor： Eric A. Knopf , Bartley K. Andre , Matthew P. Casebolt , Houtan R. Farahani , William F. Leggett , Gavin J. Reid , Mikael M. Silvanto , Derek J. Yap
CPC classification number: G06F1/203 , G06F1/1658 , G06F1/187 , G06F1/20 , G11B33/08 , G11B33/124
Abstract: A removable assembly for quickly inserting and removing a mass storage device from a compartment situated on the case of a portable computing device is described. The removable assembly is made of a mass storage device, a bracket which serves as a carrier for the mass storage device, and a metal plate. In some embodiments, the mass storage device is a solid state drive (SSD) card. The bracket is a single-piece plastic structure that is deflected for snap insertion into the compartment and snap removal from the compartment. The metal plate conducts heat from the solid state drive (SSD) card to prevent the SSD from overheating.
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公开(公告)号：US09408328B2
公开(公告)日：2016-08-02
申请号：US13683955
申请日：2012-11-21
Applicant: Apple Inc.
Inventor： Jay S. Nigen , Ron A. Hopkinson , Derek J. Yap , Eric A. Knopf , William F. Leggett , Richard H. Tan
CPC classification number: H01L23/3735 , F28F21/00 , G06F1/20 , H01L21/4882 , H01L23/3737 , H01L23/552 , H01L2924/0002 , H05K1/0201 , H05K1/141 , H05K3/0061 , H05K7/20436 , H05K7/205 , H05K2201/042 , H05K2201/10159 , H01L2924/00
Abstract: The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.
Abstract translation: 所公开的实施例涉及一种促进系统中的热传导的系统，该系统包括具有诸如固态驱动器的集成电路的电路板的模块。 使用电路板一侧和相邻基板之间的热耦合材料来增加电路板和基板之间的热传导。 此外，模块可以包括在基板和壳体之间的另外的热耦合材料，其至少部分地围绕电路板，从而增加基板和壳体之间的热传导。 以这些方式，底板和/或壳体可以用作传热表面或散热器，其减少与集成电路的操作相关联的热点。
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公开(公告)号：US09232306B2
公开(公告)日：2016-01-05
申请号：US13833636
申请日：2013-03-15
Applicant: Apple Inc.
Inventor： Justin D. Crosby , Derek J. Yap , William F. Leggett
CPC classification number: H04R3/00 , H04R5/02 , H04R31/00 , H04R2209/022 , H04R2499/15 , Y10T29/49005
Abstract: Systems and methods for reducing the effects of stray magnetic flux are provided. For example, an electronic device can employ the system and can include a first audio component configured to have a first acoustic phase and a first magnetic phase. The electronic device can also include a second audio component configured to have the first acoustic phase and a second magnetic phase that is opposite the first magnetic phase. The first audio component can be positioned with respect to the second audio component, such that any stray magnetic flux from the first audio component enters the second audio component during operation of the first and second audio components.
Abstract translation: 提供了减少杂散磁通效应的系统和方法。 例如，电子设备可以使用该系统并且可以包括被配置为具有第一声相和第一磁相的第一音频组件。 电子设备还可以包括被配置为具有第一声相和与第一磁相相对的第二磁相的第二音频分量。 可以相对于第二音频分量定位第一音频分量，使得来自第一音频分量的任何杂散磁通在第一和第二音频分量的操作期间进入第二音频分量。
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公开(公告)号：US20140111933A1
公开(公告)日：2014-04-24
申请号：US13866922
申请日：2013-04-19
Applicant: APPLE INC.
Inventor： Eric A. Knopf , Bartley K. Andre , Matthew P. Casebolt , Houtan R. Farahani , William F. Leggett , Gavin J. Reid , Mikael M. Silvanto , Derek J. Yap
CPC classification number: G06F1/203 , G06F1/1658 , G06F1/187 , G06F1/20 , G11B33/08 , G11B33/124
Abstract: A removable assembly for quickly inserting and removing a mass storage device from a compartment situated on the case of a portable computing device is described. The removable assembly is made of a mass storage device, a bracket which serves as a carrier for the mass storage device, and a metal plate. The mass storage device can be a solid state drive (SSD) card. The bracket is a single-piece plastic structure that can be deflected for snap insertion into the compartment and snap removal from the compartment. The metal plate conducts heat from the solid state drive (SSD) card to prevent it from overheating.
Abstract translation: 描述了一种用于从位于便携式计算设备的壳体上的隔室快速插入和移除大容量存储设备的可拆卸组件。 可移动组件由大容量存储装置，用作大容量存储装置的载体的支架和金属板制成。 大容量存储设备可以是固态驱动器（SSD）卡。 支架是一个单件塑料结构，可以偏转，以便卡扣插入隔间并从隔间中快速移除。 金属板从固态驱动器（SSD）卡传导热量，以防止其过热。
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