公开(公告)号：US20220013380A1

公开(公告)日：2022-01-13

申请号：US17345258

申请日：2021-06-11

Applicant: Apple Inc.

Inventor： Hyeun-Su Kim ,  Dariusz Golda ,  Chae Hyuck Ahn ,  Kevin T. Huang ,  Eric B. Newton

IPC: H01L21/67 ,  H01L25/075 ,  H01L33/62 ,  B65G47/90

Abstract: Mass transfer tools and methods for high density transfer of arrays of micro devices are described. In an embodiment, a mass transfer tool includes a micro pick up array with an array of transfer heads arranged in clusters. The clusters of transfer heads can be used to pick up a high density group of micro devices followed by sequential placement onto a receiving substrate.

公开(公告)号：US12057331B2

公开(公告)日：2024-08-06

申请号：US17345258

申请日：2021-06-11

Applicant: Apple Inc.

Inventor： Hyeun-Su Kim ,  Dariusz Golda ,  Chae Hyuck Ahn ,  Kevin T. Huang ,  Eric B. Newton

IPC: H01L21/00 ,  B65G47/90 ,  H01L21/67 ,  H01L25/075 ,  H01L33/62 ,  B41F16/00

CPC classification number: H01L21/67144 ,  B65G47/90 ,  H01L25/0753 ,  H01L33/62 ,  B41F16/00 ,  H01L2933/0066

Abstract: Mass transfer tools and methods for high density transfer of arrays of micro devices are described. In an embodiment, a mass transfer tool includes a micro pick up array with an array of transfer heads arranged in clusters. The clusters of transfer heads can be used to pick up a high density group of micro devices followed by sequential placement onto a receiving substrate.