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公开(公告)号：US12009347B1
公开(公告)日：2024-06-11
申请号：US17345272
申请日：2021-06-11
Applicant: Apple Inc.
Inventor： Andreas Bibl , Dariusz Golda , Chae Hyuck Ahn , Clayton K Chan , Hyeun-Su Kim
IPC: H01L25/075 , H01L33/48
CPC classification number: H01L25/0753 , H01L33/486 , H01L2933/0066
Abstract: Donor substrate micro device stabilization structures and display structures are described. In an embodiment, a patterned electrically conductive layer is used to stabilize an array of micro devices on donor substrate with a plurality of tethers, which can be broken during a transfer sequence to transfer the array of micro devices from the donor substrate.
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公开(公告)号：US20220013380A1
公开(公告)日：2022-01-13
申请号：US17345258
申请日：2021-06-11
Applicant: Apple Inc.
Inventor： Hyeun-Su Kim , Dariusz Golda , Chae Hyuck Ahn , Kevin T. Huang , Eric B. Newton
IPC: H01L21/67 , H01L25/075 , H01L33/62 , B65G47/90
Abstract: Mass transfer tools and methods for high density transfer of arrays of micro devices are described. In an embodiment, a mass transfer tool includes a micro pick up array with an array of transfer heads arranged in clusters. The clusters of transfer heads can be used to pick up a high density group of micro devices followed by sequential placement onto a receiving substrate.
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公开(公告)号：US12057331B2
公开(公告)日：2024-08-06
申请号：US17345258
申请日：2021-06-11
Applicant: Apple Inc.
Inventor： Hyeun-Su Kim , Dariusz Golda , Chae Hyuck Ahn , Kevin T. Huang , Eric B. Newton
CPC classification number: H01L21/67144 , B65G47/90 , H01L25/0753 , H01L33/62 , B41F16/00 , H01L2933/0066
Abstract: Mass transfer tools and methods for high density transfer of arrays of micro devices are described. In an embodiment, a mass transfer tool includes a micro pick up array with an array of transfer heads arranged in clusters. The clusters of transfer heads can be used to pick up a high density group of micro devices followed by sequential placement onto a receiving substrate.
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