公开(公告)号：US09966260B1

公开(公告)日：2018-05-08

申请号：US15232738

申请日：2016-08-09

Applicant: Apple Inc.

Inventor： Clayton Ka Tsun Chan ,  Ion Bita ,  Ranjith Samuel E. John ,  Alfred F. Renaldo ,  Jie Fu ,  Sudirukkuge T. Jinasundera ,  An-Chun Tien

IPC: B32B38/10 ,  H01L21/033 ,  H01L29/861 ,  H01L29/66 ,  H01L21/683 ,  H01L21/268 ,  B29C71/04 ,  B29D11/00

CPC classification number: H01L21/0331 ,  B23K26/0006 ,  B23K26/122 ,  B23K26/18 ,  B23K26/50 ,  B23K2101/40 ,  B23K2103/172 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/54 ,  B29C71/04 ,  B29D11/0073 ,  B29D11/0074 ,  H01L21/268 ,  H01L21/6835 ,  H01L21/7813 ,  H01L29/66136 ,  H01L29/861 ,  H01L33/00 ,  H01L2221/6835 ,  H01L2221/68381

Abstract: Laser lift-off methods are described in which optical flatness is provided on the back side of a temporary substrate using either an optical layer or optical liquid. A laser is directed through the optical layer or optical liquid and a back side of the temporary substrate to decompose a portion of a process layer supported on a front side of the temporary substrate, followed by separation of the process layer and the temporary substrate.