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    Multicavity pressure sensor
    1.
    发明授权
    Multicavity pressure sensor 有权

    公开(公告)号：US11248974B2

    公开(公告)日：2022-02-15

    申请号：US16806325

    申请日：2020-03-02

    Applicant: Apple Inc.

    Inventor： Jeffrey C. Chiu ,  Krishna Prasad Vummidi Murali

    IPC: G01L9/00

    Abstract: Aspects of the subject technology relate to an apparatus including multiple cavities disposed adjacent to one another in a housing structure. The apparatus further includes a number of membranes, with each membrane disposed over a cavity to seal the cavity, and a sensor that can sense a deflection of a respective membrane associated with one of the cavities in response to an applied pressure. Each membrane is operable within a respective pressure range, and the applied pressure is within an operating range of the respective membrane.

    Electronic Devices With Ultrasonic Temperature Sensors
    2.
    发明公开
    Electronic Devices With Ultrasonic Temperature Sensors 审中-公开

    公开(公告)号：US20240019318A1

    公开(公告)日：2024-01-18

    申请号：US18304197

    申请日：2023-04-20

    Applicant: Apple Inc.

    Inventor： Krishna Prasad Vummidi Murali ,  Patrick R. Gill ,  Chaitanya Mudivarthi ,  Roberto M Ribeiro ,  Mohammad Waleed Shinwari ,  Flavius Pop ,  Michael A Lehr

    IPC: G01K11/24

    CPC classification number: G01K11/24 ,  H10N30/302

    Abstract: An electronic device may include one or more ultrasonic temperature sensors. The ultrasonic temperature sensors may be formed in openings or cavities in a housing of the electronic device. The ultrasonic temperature sensors may include ultrasonic transmitters that transmit signals at different ultrasonic frequencies and ultrasonic receivers that receive the transmitted signals. Phase differences between the received ultrasonic signals may be used to determine the speed of sound of ambient air and therefore calculate the temperature of the ambient air. The ultrasonic transmitters and receivers may include piezoelectric micromachined ultrasound transducers (PMUTs). Each transmitter and receiver may be a dedicated transmitter or receiver, or may transmit and receive ultrasonic signals. Each receiver may include an array of PMUTs that receive ultrasonic signals of different frequencies. The PMUTS may be formed on complementary metal-oxide semiconductors (CMOS).

    Dual pressure sensing module with a shared electrical substrate
    4.
    发明授权
    Dual pressure sensing module with a shared electrical substrate 有权

    公开(公告)号：US10948372B2

    公开(公告)日：2021-03-16

    申请号：US16145708

    申请日：2018-09-28

    Applicant: Apple Inc.

    Inventor： Gregory B. Arndt ,  Krishna Prasad Vummidi Murali

    IPC: G01L19/14 ,  B81B7/00 ,  G01L9/00 ,  G01L19/00 ,  G01L9/06

    Abstract: A pressure sensing module for an electronic device includes a substrate and a module housing coupled to the substrate. The module housing defines a first chamber and a second chamber. The second chamber is separate from the first chamber. The first chamber is configured to connect to an environment around an electronic device. The second chamber is configured to connect to an internal volume of the housing of the electronic device. A first pressure sensing element is electrically coupled to the substrate and disposed in the first chamber and is operative to detect an external pressure around the electronic device. A second pressure sensing element is electrically coupled to the substrate and disposed in the second chamber and is operative to detect an internal pressure within the electronic device housing.

    MULTICAVITY PRESSURE SENSOR
    6.
    发明申请
    MULTICAVITY PRESSURE SENSOR 有权

    公开(公告)号：US20210270687A1

    公开(公告)日：2021-09-02

    申请号：US16806325

    申请日：2020-03-02

    Applicant: Apple Inc.

    Inventor： Jeffrey C. Chiu ,  Krishna Prasad Vummidi Murali

    IPC: G01L9/00

    Abstract: Aspects of the subject technology relate to an apparatus including multiple cavities disposed adjacent to one another in a housing structure. The apparatus further includes a number of membranes, with each membrane disposed over a cavity to seal the cavity, and a sensor that can sense a deflection of a respective membrane associated with one of the cavities in response to an applied pressure. Each membrane is operable within a respective pressure range, and the applied pressure is within an operating range of the respective membrane.

    Strain Reduction and Sensing on Package Substrates
    8.
    发明申请
    Strain Reduction and Sensing on Package Substrates 审中-公开
    封装衬底上的应变减少和感应

    公开(公告)号：US20170057810A1

    公开(公告)日：2017-03-02

    申请号：US15253711

    申请日：2016-08-31

    Applicant: Apple Inc.

    Inventor： Krishna Prasad Vummidi Murali ,  Christopher C. Painter ,  Kuan-Lin Chen

    IPC: B81B7/00 ,  B81C1/00

    CPC classification number: B81B7/0048 ,  B81B7/008 ,  B81B7/0087 ,  B81B2203/0109 ,  B81B2203/0127 ,  B81B2203/0163 ,  B81B2207/012 ,  B81B2207/096 ,  B81C1/00325 ,  B81C2203/0792

    Abstract: A strain measurement platform that comprises of a strain die that can be embedded inside a package substrate or have its own substrate with through silicon vias (TSVs) is disclosed. The strain die comprises a body and a base. The base is coupled to the body with strain enhancing structures. Strain enhancing structures are formed on the strain die to amplify the strain signals locally, while also acting as strain and vibration isolators. Strain sensors are formed on or around the strain enhancing structures at locations of maximum strain. The strain sensors can be piezo-resistors, piezo-junctions or piezo-electrics. Strain enhancing structures are implemented either as compliant springs or as a thin membrane over which the base is suspended. A package stack can be mounted on top of the strain die and electrically connected to a strain measuring platform. Some example process flows for fabricating strain die are also disclosed.

    Abstract translation: 公开了一种应变测量平台，其包括可嵌入封装衬底内的应变模具或具有通过硅通孔（TSV）的自己的衬底。 应变模具包括主体和基部。 基座通过应变增强结构与身体联接。 在应变模具上形成应变增强结构以局部放大应变信号，同时也用作应变和振动隔离器。 应变传感器形成在应变增强结构的最大应变位置处或周围。 应变传感器可以是压电电阻器，压电接头或压电电阻器。 应变增强结构可以作为柔性弹簧或作为悬挂基座的薄膜来实现。 包装堆叠可以安装在应变模具的顶部上并电连接到应变测量平台。 还公开了用于制造应变模的一些示例性工艺流程。

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