公开(公告)号：US20150364253A1

公开(公告)日：2015-12-17

申请号：US14500794

申请日：2014-09-29

Applicant: Apple Inc.

Inventor： Shawn X. Arnold ,  Dennis R. Pyper ,  Gang Ning ,  Meng Chi Lee ,  Sascha Tietz ,  Sury N. Darbha ,  Zhong-Qing Gong

IPC: H01G2/06 ,  G10K11/16 ,  H01G4/12 ,  H05K3/34 ,  H05K1/18

CPC classification number: H01G2/065 ,  G10K11/16 ,  H01G4/232 ,  H01G4/30 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/094 ,  H05K2201/09427 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: Apparatus and methods are described for coupling a circuit component having piezoelectric properties, such as a ceramic capacitor, to a printed circuit board (PCB) by forming a first solder heel fillet and a second solder heel fillet that fixedly couple the circuit component to the PCB, where the first and second solder heel fillets have a height z that is less than a height h of the circuit component to reduce acoustic noise at the PCB caused by coupling the circuit component to the PCB. In various configurations, the first solder heel fillet and the second solder heel fillet can each fixedly coupled to: a bottom surface of the circuit component, a top surface of the PCB at a first solder pad and a second solder pad thereof, and a lower portion of each of a multiple side surfaces of the circuit component.

Abstract translation: 描述了用于将具有压电特性的电路部件（例如陶瓷电容器）耦合到印刷电路板（PCB）的装置和方法，该方法通过形成将电路部件固定地耦合到PCB的第一焊脚跟内圆角和第二焊脚跟内圆角 其中第一和第二焊脚后视角具有低于电路部件的高度h的高度z，以减小由于将电路部件耦合到PCB而导致的PCB处的声学噪声。 在各种配置中，第一焊脚跟内圆角和第二焊脚跟内圆角可以各自固定地连接到：电路部件的底表面，PCB的顶表面处于第一焊盘和第二焊垫，下部 电路部件的多个侧表面中的每一个的部分。