公开(公告)号：US10759656B2

公开(公告)日：2020-09-01

申请号：US15721643

申请日：2017-09-29

Applicant: Apple Inc.

Inventor： Christopher C. Painter ,  Te Hsi Lee

IPC: G01P15/125 ,  G01P15/08 ,  B81B3/00

Abstract: A MEMS sensor is disclosed that includes dual pendulous proof masses comprised of sections of different thickness to allow simultaneous suppression of vertical and lateral thermal gradient-induced offsets in a MEMS sensor while still allowing for the normal operation of the accelerometer. In an embodiment, the structure and different sections of the MEMS sensor is realized using multiple polysilicon layers. In other embodiments, the structure and different thickness sections may be realized with other materials and processes. For example, plating, etching, or silicon-on-nothing (SON) processing.

公开(公告)号：US20190100426A1

公开(公告)日：2019-04-04

申请号：US15721643

申请日：2017-09-29

Applicant: Apple Inc.

Inventor： Christopher C. Painter ,  Te Hsi Lee

IPC: B81B3/00

CPC classification number: B81B3/0086 ,  B81B3/0097 ,  B81B2201/0235 ,  B81B2203/01 ,  B81B2203/0181 ,  B81B2203/04 ,  G01P15/125 ,  G01P2015/0831

Abstract: A MEMS sensor is disclosed that includes dual pendulous proof masses comprised of sections of different thickness to allow simultaneous suppression of vertical and lateral thermal gradient-induced offsets in a MEMS sensor while still allowing for the normal operation of the accelerometer. In an embodiment, the structure and different sections of the MEMS sensor is realized using multiple polysilicon layers. In other embodiments, the structure and different thickness sections may be realized with other materials and processes. For example, plating, etching, or silicon-on-nothing (SON) processing.