公开(公告)号：US11598000B2

公开(公告)日：2023-03-07

申请号：US16137797

申请日：2018-09-21

Applicant: Applied Materials, Inc.

Inventor： Ranga Rao Arnepalli ,  Colin Costano Neikirk ,  Yuriy Melnik ,  Suresh Chand Seth ,  Pravin K. Narwankar ,  Sukti Chatterjee ,  Lance A. Scudder

IPC: C23C14/02 ,  C23C16/02 ,  C23C16/50 ,  C23C16/455 ,  C23C16/56 ,  C23C16/40

Abstract: Methods of removing native oxide layers and depositing dielectric layers having a controlled number of active sites on MEMS devices for biological applications are disclosed. In one aspect, a method includes removing a native oxide layer from a surface of the substrate by exposing the substrate to one or more ligands in vapor phase to volatize the native oxide layer and then thermally desorbing or otherwise etching the volatized native oxide layer. In another aspect, a method includes depositing a dielectric layer selected to provide a controlled number of active sites on the surface of the substrate. In yet another aspect, a method includes both removing a native oxide layer from a surface of the substrate by exposing the substrate to one or more ligands and depositing a dielectric layer selected to provide a controlled number of active sites on the surface of the substrate.

公开(公告)号：US10211072B2

公开(公告)日：2019-02-19

申请号：US15840900

申请日：2017-12-13

Applicant: Applied Materials, Inc.

Inventor： Han-Wen Chen ,  Steven Verhaverbeke ,  Roman Gouk ,  Guan Huei See ,  Yu Gu ,  Arvind Sundarrajan ,  Kyuil Cho ,  Colin Costano Neikirk ,  Boyi Fu

IPC: H01L21/50 ,  H01L21/56 ,  H01L23/31

Abstract: Embodiments of the present disclosure generally describe methods for minimizing the occurrence and the extent of die shift during the formation of a reconstituted substrate in fan-out wafer level packaging processes. Die shift is a process defect that occurs when a die (device) moves from its intended position within a reconstituted substrate during the formation thereof. Generally, the methods disclosed herein include depositing a device immobilization layer and/or a plurality of device immobilization beads over and/or adjacent to a plurality of singular devices (individual dies), and the carrier substrate they are positioned on, before forming a reconstituted substrate with an epoxy molding compound. The device immobilization layer and/or the plurality of device immobilization beads immobilize the plurality of singular devices and prevents them from shifting on the carrier substrate during the molding process.