公开(公告)号：US11718904B2

公开(公告)日：2023-08-08

申请号：US16422794

申请日：2019-06-26

Applicant: Applied Materials, Inc.

Inventor： Stefan Bangert ,  Tommaso Vercesi ,  Daniele Gislon ,  Oliver Heimel ,  Andreas Lopp ,  Dieter Haas

IPC: H01L21/67 ,  C23C14/04 ,  C23C16/04 ,  C23C16/458 ,  G03F1/38 ,  C23C14/56 ,  H01L21/673 ,  H01L21/677 ,  G01F1/42 ,  H10K71/16

CPC classification number: C23C14/042 ,  C23C14/56 ,  C23C16/042 ,  C23C16/4587 ,  G03F1/38 ,  H01L21/67346 ,  H01L21/67712 ,  G01F1/42 ,  H10K71/166

Abstract: A mask arrangement for masking a substrate in a processing chamber is provided. The mask arrangement includes a mask frame having one or more frame elements and is configured to support a mask device, wherein the mask device is connectable to the mask frame; and at least one actuator connectable to at least one frame element of the one or more frame elements, wherein the at least one actuator is configured to apply a force to the at least one frame element.