公开(公告)号：US20150004312A1

公开(公告)日：2015-01-01

申请号：US14237158

申请日：2011-08-09

Applicant: APPLIED MATERIALS, INC.

Inventor： Evelyn Scheer ,  Markus Hanika ,  Ralph Lindenberg ,  Marcus Bender ,  Andreas Lopp ,  Konrad Schwanitz ,  Fabio Pieralisi ,  Jian Liu

IPC: C23C14/04 ,  C23C16/04

CPC classification number: C23C14/042 ,  C23C16/042

Abstract: An deposition apparatus for forming a deposition material layer on a substrate is described. The deposition apparatus includes a substrate support adapted for holding a substrate; and an edge (660) exclusion mask (640) for covering a periphery of the substrate (610) during layer deposition. The mask has at least one frame portion defining an aperture. The at least one frame portion of the mask is adapted for being moved (670,680) with respect to the substrate depending on the amount of deposition material deposited on the at least one frame portion of the mask. Further, a method for depositing a deposition material layer on a substrate using an edge exclusion mask is described.

Abstract translation: 描述了用于在基板上形成沉积材料层的沉积装置。 沉积设备包括适于保持衬底的衬底支撑件; 以及用于在层沉积期间覆盖衬底（610）的周边的边缘（660）排除掩模（640）。 掩模具有限定孔的至少一个框架部分。 掩模的至少一个框架部分适于相对于基板移动（670,680），这取决于沉积在掩模的至少一个框架部分上的沉积材料的量。 此外，描述了使用边缘排除掩模在基板上沉积沉积材料层的方法。

公开(公告)号：US20240301546A1

公开(公告)日：2024-09-12

申请号：US18281456

申请日：2021-04-19

Applicant: Applied Materials, Inc.

Inventor： Thomas Werner Zilbauer ,  Andreas Lopp

IPC: C23C14/35 ,  C23C14/00 ,  C23C14/08 ,  C23C14/14 ,  C23C14/34 ,  H01J37/32 ,  H01J37/34

CPC classification number: C23C14/351 ,  C23C14/0068 ,  C23C14/3407 ,  H01J37/32651 ,  H01J37/32669 ,  H01J37/3405 ,  H01J37/3452 ,  C23C14/086 ,  C23C14/14 ,  H01J2237/081 ,  H01J2237/332

Abstract: A sputter deposition source for depositing a material on a substrate is described. The sputter deposition source includes an array of magnetron sputter cathodes arranged in a row for coating the substrate in a deposition area on a front side of the array. At least one magnetron sputter cathode of the array includes a first rotary target rotatable around a first rotation axis (A1); and a first magnet assembly arranged in the first rotary target and configured to provide a closed plasma racetrack (P) on a surface of the first rotary target that extends along the first rotation axis (A1) on a first side and on a second side of the at least one magnetron sputter cathode. Further described is a magnetron sputter cathode for a sputter deposition source and a method of depositing a material on a substrate.

公开(公告)号：US12049691B2

公开(公告)日：2024-07-30

申请号：US17332822

申请日：2021-05-27

Applicant: Applied Materials, Inc.

Inventor： Andreas Lopp ,  Stefan Bangert

IPC: C23C14/54 ,  C23C14/24 ,  H01J37/32

CPC classification number: C23C14/542 ,  C23C14/24 ,  H01J37/32651

Abstract: A temperature-controlled shield for an evaporation source is described. The temperature-controlled shield is configured to provide a pre-heating zone or a post-cooling zone.

公开(公告)号：US11718904B2

公开(公告)日：2023-08-08

申请号：US16422794

申请日：2019-06-26

Applicant: Applied Materials, Inc.

Inventor： Stefan Bangert ,  Tommaso Vercesi ,  Daniele Gislon ,  Oliver Heimel ,  Andreas Lopp ,  Dieter Haas

IPC: H01L21/67 ,  C23C14/04 ,  C23C16/04 ,  C23C16/458 ,  G03F1/38 ,  C23C14/56 ,  H01L21/673 ,  H01L21/677 ,  G01F1/42 ,  H10K71/16

CPC classification number: C23C14/042 ,  C23C14/56 ,  C23C16/042 ,  C23C16/4587 ,  G03F1/38 ,  H01L21/67346 ,  H01L21/67712 ,  G01F1/42 ,  H10K71/166

Abstract: A mask arrangement for masking a substrate in a processing chamber is provided. The mask arrangement includes a mask frame having one or more frame elements and is configured to support a mask device, wherein the mask device is connectable to the mask frame; and at least one actuator connectable to at least one frame element of the one or more frame elements, wherein the at least one actuator is configured to apply a force to the at least one frame element.

公开(公告)号：US10483465B2

公开(公告)日：2019-11-19

申请号：US16300484

申请日：2016-05-10

Applicant: Applied Materials, Inc.

Inventor： Jose Manuel Dieguez-Campo ,  Stefan Bangert ,  Andreas Lopp ,  Harald Wurster ,  Dieter Haas

IPC: H01L51/00 ,  H01L51/56 ,  C23C14/12 ,  C23C14/04 ,  C23C14/24 ,  C23C14/56

Abstract: A method of operating a deposition apparatus is provided. The method comprises: Deposition of an evaporated source material on a substrate by guiding the evaporated source material from one or more outlets of an evaporation source toward the substrate, wherein part of the evaporated source material is blocked by and attaches to a shielding device arranged between the one or more outlets and the substrate, followed by a cleaning of the shielding device by at least locally heating the shielding device for releasing at least part of the attached source material from the shielding device. According to a further aspect, a deposition apparatus is provided that can be operated according to the described methods.

公开(公告)号：US08869967B2

公开(公告)日：2014-10-28

申请号：US13748271

申请日：2013-01-23

Applicant: Applied Materials, Inc.

Inventor： Wolfgang Buschbeck ,  Juergen Henrich ,  Andreas Lopp ,  Susanne Schlaefer

IPC: B23B13/00 ,  H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67739 ,  H01L21/67201

Abstract: A dynamic load lock chamber that includes a plurality of actuators positioned along its length to achieve a desired pressure gradient from an atmospheric pressure side to a processing pressure side of the chamber is provided. The chamber includes a transport belt continuously running through the chamber to transport substrates from the atmospheric pressure side to the processing pressure side of the chamber, if situated on an inlet side of a production line, and from the processing pressure side to the atmospheric pressure side of the chamber, if positioned on an outlet side of the production line. Separation mechanisms may be attached to the belt to separate discrete regions within the chamber into a plurality of discrete volumes. Substrates may be disposed between the separation mechanisms, such that separation between adjacent pressure regions within the chamber is maintained as the substrates are transported through the chamber.

Abstract translation: 提供一种动态负载锁定室，其包括沿其长度定位的多个致动器，以实现从室的大气压侧到处理压力侧的期望的压力梯度。 所述腔室包括连续运行通过所述腔室的输送带，以将衬底从所述大气压侧输送到所述腔室的处理压力侧，如果位于生产线的入口侧，以及从处理压力侧到大气压侧 如果位于生产线的出口侧。 分离机构可以附接到带上以将腔室内的离散区域分离成多个离散体积。 衬底可以设置在分离机构之间，使得当衬底被输送通过腔室时，保持室内的相邻压力区域之间的间隔。

公开(公告)号：US11905589B2

公开(公告)日：2024-02-20

申请号：US16998872

申请日：2020-08-20

Applicant: Applied Materials, Inc.

Inventor： Andreas Lopp ,  Stefan Bangert ,  Wolfgang Buschbeck

IPC: C23C14/24 ,  C23C14/56 ,  C23C14/54 ,  C23C14/26

CPC classification number: C23C14/26 ,  C23C14/24 ,  C23C14/541 ,  C23C14/562

Abstract: One or more heating assemblies for a material deposition apparatus for pre-heating a substrate before entering a material deposition area and/or for post-heating the substrate after exiting the material deposition area are described.

公开(公告)号：US11732345B2

公开(公告)日：2023-08-22

申请号：US17332845

申请日：2021-05-27

Applicant: Applied Materials, Inc.

Inventor： Stefan Bangert ,  Andreas Lopp

IPC: C23C14/24 ,  C23C14/16 ,  C23C14/54 ,  C23C14/04 ,  B05B12/16 ,  B05C21/00 ,  H01J37/32

CPC classification number: C23C14/24 ,  B05B12/16 ,  B05C21/005 ,  C23C14/042 ,  C23C14/16 ,  C23C14/54 ,  H01J37/32752

Abstract: A vapor deposition apparatus is described. The vapor deposition apparatus includes a substrate support for supporting a substrate to be coated; a vapor source with a plurality of nozzles for directing vapor toward the substrate support through a vapor propagation volume; and a heatable shield extending from the vapor source toward the substrate support. The heatable shield surrounds the vapor propagation volume at least partially and includes an edge exclusion portion for masking areas of the substrate not to be coated. The substrate support may be a rotatable drum with a curved drum surface, and the vapor deposition apparatus may be configured to move the substrate on the curved drum surface past the vapor source in a circumferential direction.