公开(公告)号：US20200282506A1

公开(公告)日：2020-09-10

申请号：US16882154

申请日：2020-05-22

Applicant: Applied Materials, Inc.

Inventor： Eric LAU ,  Chih Chung CHOU ,  Charles C. GARRETSON ,  Jeonghoon OH ,  King Yi HEUNG

IPC: B24B7/22 ,  B24B13/005 ,  B24B37/07 ,  B24B49/10 ,  H01L21/3105 ,  H01L21/321

Abstract: A method is provided to minimize travel distance and time between correction locations on a substrate when polishing a local area of a substrate, such as a semiconductor wafer, using a location specific polishing module. A correction profile is determined and a recipe based on the correction profile is used to polish a substrate. A polishing pad assembly traverses between a first correction location and a second correction location using the combined motion of a substrate support chuck and a support arm coupled at a first end thereof to the polishing pad assembly. The chuck rotates about a center axis thereof. The positioning arm may sweep about a vertical axis disposed through a second end of the support arm. The combined motion of the chuck and the positioning arm causes the polishing pad assembly to form a spiral shaped polishing path on the substrate.

公开(公告)号：US20190099857A1

公开(公告)日：2019-04-04

申请号：US16149939

申请日：2018-10-02

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon OH ,  Charles C. GARRETSON ,  Eric LAU ,  Andrew NAGENGAST ,  Steven M. ZUNIGA ,  Edwin C. SUAREZ ,  Huanbo ZHANG ,  Brian J. BROWN

IPC: B24B37/32 ,  H01L21/687

Abstract: Embodiments herein relate to a retaining ring for use in a polishing process. The retaining ring includes an annular body having an upper surface and a lower surface. An inner surface is connected to the upper surface and the lower surface. The inner surface includes one or more surfaces that are used to retain a substrate during processing. The one or more surfaces have an angle relative to a central axis of the retaining ring. The inner surface also includes a plurality of facets. Channels are disposed within the retaining ring to allow passage of a polishing fluid from an inner surface to an outer surface of the retaining ring disposed opposite of the inner surface.

公开(公告)号：US20220339755A1

公开(公告)日：2022-10-27

申请号：US17851497

申请日：2022-06-28

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon OH ,  Charles C. GARRETSON ,  Eric LAU ,  Andrew NAGENGAST ,  Steven M. ZUNIGA ,  Edwin C. SUAREZ ,  Huanbo ZHANG ,  Brian J. BROWN

IPC: B24B37/32 ,  H01L21/687

Abstract: Embodiments herein relate to a retaining ring for use in a polishing process. The retaining ring includes an annular body having an upper surface and a lower surface. An inner surface is connected to the upper surface and the lower surface. The inner surface includes one or more surfaces that are used to retain a substrate during processing. The one or more surfaces have an angle relative to a central axis of the retaining ring. The inner surface also includes a plurality of facets. Channels are disposed within the retaining ring to allow passage of a polishing fluid from an inner surface to an outer surface of the retaining ring disposed opposite of the inner surface.

公开(公告)号：US20180250788A1

公开(公告)日：2018-09-06

申请号：US15891722

申请日：2018-02-08

Applicant: Applied Materials, Inc.

Inventor： Eric LAU ,  Chih Chung CHOU ,  Charles C. GARRETSON ,  Jeonghoon OH ,  King Yi HEUNG

IPC: B24B7/22 ,  B24B13/005 ,  B24B49/10 ,  B24B37/07

CPC classification number: B24B7/228 ,  B24B13/005 ,  B24B37/07 ,  B24B49/10 ,  H01L21/304 ,  H01L21/30625 ,  H01L21/31053 ,  H01L21/3212 ,  H01L22/20

Abstract: A method is provided to minimize travel distance and time between correction locations on a substrate when polishing a local area of a substrate, such as a semiconductor wafer, using a location specific polishing module. A correction profile is determined and a recipe based on the correction profile is used to polish a substrate. A polishing pad assembly traverses between a first correction location and a second correction location using the combined motion of a substrate support chuck and a support arm coupled at a first end thereof to the polishing pad assembly. The chuck rotates about a center axis thereof. The positioning arm may sweep about a vertical axis disposed through a second end of the support arm. The combined motion of the chuck and the positioning arm causes the polishing pad assembly to form a spiral shaped polishing path on the substrate.

公开(公告)号：US20180005842A1

公开(公告)日：2018-01-04

申请号：US15621638

申请日：2017-06-13

Applicant: Applied Materials, Inc.

Inventor： Eric LAU ,  King Yi HEUNG ,  Charles C. GARRETSON ,  Jun QIAN ,  Thomas H. OSTERHELD ,  Shuchivrat DATAR ,  David CHUI

IPC: H01L21/321 ,  H01L21/304 ,  G01B11/06 ,  H01L21/3105 ,  G01B11/03

CPC classification number: H01L21/3212 ,  G01B11/03 ,  G01B11/06 ,  H01L21/304 ,  H01L21/31053 ,  H01L22/00

Abstract: A method for polishing dies locations on a substrate with a polishing module. A thickness at selected locations on the substrate is premeasured at a metrology station, each location corresponding to a location of a single die. The thickness obtained by the metrology station for the selected locations of the substrate is provided to a controller of a polishing module. The thickness corrections for each selected location on the substrate are determined. A polishing step in a polishing recipe is formed from the thickness correction for each selected location. A polishing parameter for each die location is calculated for the recipe.

公开(公告)号：US20170274497A1

公开(公告)日：2017-09-28

申请号：US15456320

申请日：2017-03-10

Applicant: Applied Materials, Inc.

Inventor： Eric LAU ,  Hui CHEN ,  King Yi HEUNG ,  Wei-Cheng LEE ,  Chih Chung CHOU ,  Edwin C. SUAREZ ,  Garrett Ho Yee SIN ,  Charles C. GARRETSON ,  Jeonghoon OH

IPC: B24B37/26 ,  B24B37/30

CPC classification number: B24B37/26 ,  B24B37/30

Abstract: A polishing module including a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in one or more of a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.

公开(公告)号：US20240253183A1

公开(公告)日：2024-08-01

申请号：US18401306

申请日：2023-12-29

Applicant: Applied Materials, Inc.

Inventor： Priscilla Michelle Diep LAROSA ,  Haosheng WU ,  Jimin ZHANG ,  Taketo SEKINE ,  Chen-Wei CHANG ,  Jianshe TANG ,  Brian J. BROWN ,  Wei LU ,  Ekaterina A. MIKHAYLICHENKO ,  Huanbo ZHANG ,  Jeonghoon OH ,  Eric LAU ,  Andrew NAGENGAST ,  Takashi FUJIKAWA ,  Thomas H. OSTERHELD ,  Steven M. ZUNIGA

IPC: B24B57/02 ,  B24B37/015 ,  B24B53/017

CPC classification number: B24B57/02 ,  B24B37/015 ,  B24B53/017

Abstract: A method and apparatus for dispensing polishing fluids and onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP system with a first fluid delivery arm and a second fluid delivery arm disposed over the polishing pad to dispense fluid, such as a polishing fluid or water, and/or provide a vacuum pressure. The second fluid delivery arm is configured to dispense a fluid or vacuum pressure onto the polishing pad to effect the polishing rate at the edge of the substrate.

公开(公告)号：US20220379428A1

公开(公告)日：2022-12-01

申请号：US17335868

申请日：2021-06-01

Applicant: Applied Materials, Inc.

Inventor： Jimin ZHANG ,  Brian J. BROWN ,  Eric LAU ,  Ekaterina MIKHAYLICHENKO ,  Jeonghoon OH ,  Gerald J. ALONZO

IPC: B24B37/10 ,  B24B37/04 ,  H01L21/306

Abstract: Certain aspects of the present disclosure provide techniques for a method of removing material on a substrate. An exemplary method includes rotating a substrate about a first axis in a first direction and urging a surface of the substrate against a polishing surface of a polishing pad while rotating the substrate, wherein rotating the substrate about the first axis includes rotating the substrate a first angle at a first rotation rate, and then rotating the substrate a second angle at a second rotation rate, and the first rotation rate is different from the second rotation rate.

公开(公告)号：US20170274495A1

公开(公告)日：2017-09-28

申请号：US15456413

申请日：2017-03-10

Applicant: Applied Materials, Inc.

Inventor： Eric LAU ,  Hui CHEN ,  King Yi HEUNG ,  Chih Chung CHOU ,  Edwin C. SUAREZ ,  Garrett Ho Yee SIN ,  Charles C. GARRETSON ,  Jeonghoon OH

IPC: B24B37/10 ,  H01L21/687 ,  H01L21/67 ,  B24B37/20 ,  B24B57/02

CPC classification number: B24B37/10 ,  B24B37/20 ,  B24B57/02 ,  H01L21/67092 ,  H01L21/68785

Abstract: A polishing module includes a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.