公开(公告)号：US20240186118A1

公开(公告)日：2024-06-06

申请号：US18419389

申请日：2024-01-22

Applicant: Applied Materials, Inc.

Inventor： JAMES CARDUCCI ,  RICHARD C. FOVELL ,  LARRY D. ELIZAGA ,  SILVERST RODRIGUES ,  VLADIMIR KNYAZIK ,  PHILIP ALLAN KRAUS ,  THAI CHENG CHUA

IPC: H01J37/32 ,  C23C16/455 ,  C23C16/511

CPC classification number: H01J37/3244 ,  C23C16/45559 ,  C23C16/45561 ,  C23C16/511 ,  H01J2237/3321 ,  H01J2237/334 ,  H01J2237/335

Abstract: Embodiments disclosed herein include a housing for a source array. In an embodiment, the housing comprises a conductive body, where the conductive body comprises a first surface and a second surface opposite from the first surface. In an embodiment a plurality of openings are formed through the conductive body and a channel is disposed into the second surface of the conductive body. In an embodiment, a cover is over the channel, and the cover comprises first holes that pass through a thickness of the cover. In an embodiment, the housing further comprises a second hole through a thickness of the conductive body. In an embodiment, the second hole intersects with the channel.