公开(公告)号：US20190189330A1

公开(公告)日：2019-06-20

申请号：US15848856

申请日：2017-12-20

Applicant: APPLIED MATERIALS, INC.

Inventor： RICHARD C. FOVELL ,  KARTIK RAMASWAMY ,  LARRY D. ELIZAGA

IPC: H01F27/08 ,  H01F27/28 ,  H01L21/67 ,  H01J37/32

CPC classification number: H01F27/08 ,  H01F27/28 ,  H01J37/321 ,  H01J37/3244 ,  H01J2237/334 ,  H01L21/67069

Abstract: A coil assembly for controlling a magnetic field in a plasma chamber is provided herein. In some embodiments, the coil assembly may include a mandrel including an annular body that includes at least one upper body coolant channel and at least one lower body coolant channel, and a plurality of cooling fins disposed circumferentially about an outer diameter of the body and radially outward from the outer diameter, an inner electromagnetic cosine-theta (cos θ) coil ring including a first set of inner coils wrapped around the plurality of cooling fins in the body and configured to generate a magnetic field in a first direction, an outer electromagnetic cosine-theta (cos θ) coil ring including a second set of outer coils wrapped around the plurality of cooling fins and configured to generate a magnetic field in a second direction orthogonal to the first direction.

公开(公告)号：US20240186118A1

公开(公告)日：2024-06-06

申请号：US18419389

申请日：2024-01-22

Applicant: Applied Materials, Inc.

Inventor： JAMES CARDUCCI ,  RICHARD C. FOVELL ,  LARRY D. ELIZAGA ,  SILVERST RODRIGUES ,  VLADIMIR KNYAZIK ,  PHILIP ALLAN KRAUS ,  THAI CHENG CHUA

IPC: H01J37/32 ,  C23C16/455 ,  C23C16/511

CPC classification number: H01J37/3244 ,  C23C16/45559 ,  C23C16/45561 ,  C23C16/511 ,  H01J2237/3321 ,  H01J2237/334 ,  H01J2237/335

Abstract: Embodiments disclosed herein include a housing for a source array. In an embodiment, the housing comprises a conductive body, where the conductive body comprises a first surface and a second surface opposite from the first surface. In an embodiment a plurality of openings are formed through the conductive body and a channel is disposed into the second surface of the conductive body. In an embodiment, a cover is over the channel, and the cover comprises first holes that pass through a thickness of the cover. In an embodiment, the housing further comprises a second hole through a thickness of the conductive body. In an embodiment, the second hole intersects with the channel.