公开(公告)号：US20230313405A1

公开(公告)日：2023-10-05

申请号：US18129999

申请日：2023-04-03

Applicant: Applied Materials, Inc.

Inventor： Paul R. McHugh ,  Gregory J. Wilson ,  Kwan Wook Roh ,  Kyle M. Hanson ,  Forrest G. Reinhart ,  David J. Reis ,  James E. Brown ,  Nolan L. Zimmerman

IPC: C25D17/00 ,  C25D3/38 ,  C25D21/04 ,  C25D21/02

CPC classification number: C25D17/002 ,  C25D3/38 ,  C25D21/04 ,  C25D21/02

Abstract: Embodiments of the present technology include electroplating methods that include providing a first portion of an electrolyte feedstock to a first compartment of an electrochemical cell. The first portion of an electrolyte feedstock may be characterized by an initial metal ion concentration and an initial acid concentration. The methods may include providing a second portion of an electrolyte feedstock to a second compartment of the electrochemical cell. The second compartment and first compartment may be separated by a first membrane. The methods may include providing an acidic solution to a third compartment of the electrochemical cell. The third compartment and second compartment may be separated by a second membrane. The acidic solution may be characterized by an initial acid concentration. The methods may include applying a current to an anode of the electrochemical cell. The anode of the electrochemical cell may be disposed proximate the first compartment and across from the first membrane.

公开(公告)号：US20230235474A1

公开(公告)日：2023-07-27

申请号：US18160109

申请日：2023-01-26

Applicant: Applied Materials, Inc.

Inventor： Joel L. Cannone ,  Gregory J. Wilson ,  Douglas William Carr ,  James E. Brown

IPC: C25D17/00 ,  C25D7/12 ,  C25D17/02 ,  C25D21/14

CPC classification number: C25D17/001 ,  C25D7/12 ,  C25D17/002 ,  C25D17/02 ,  C25D21/14

Abstract: Exemplary methods of semiconductor processing may include performing an electroplating operation on a semiconductor substrate in an electroplating bath within a vessel of an electroplating system. The methods may include removing the semiconductor substrate from the electroplating bath. The methods may include closing a valve associated with a first drain from the electroplating system. The methods may include increasing flow to a second drain from the electroplating system. The second drain may be associated with a drain channel from the vessel of the electroplating system.

公开(公告)号：US11241718B2

公开(公告)日：2022-02-08

申请号：US16386646

申请日：2019-04-17

Applicant: Applied Materials, Inc.

Inventor： Joseph Antony Jonathan ,  Kyle M. Hanson ,  Jason A. Rye ,  James E. Brown ,  Gregory J. Wilson ,  Eric J. Bergman ,  Tricia A. Youngbull ,  Timothy G. Stolt

IPC: C25D21/08 ,  B08B1/00 ,  C25D17/00

Abstract: Systems for cleaning electroplating system components may include a seal cleaning assembly incorporated with an electroplating system. The seal cleaning assembly may include an arm pivotable between a first position and a second position. The arm may be rotatable about a central axis of the arm. The seal cleaning assembly may include a cleaning head coupled with a distal portion of the arm. The cleaning head may include a bracket having a faceplate coupled with the arm, and a housing extending from the faceplate. The housing may define one or more arcuate channels extending through the housing to a front surface of the bracket. The cleaning head may also include a rotatable cartridge extending from the housing of the bracket. The cartridge may include a mount cylinder defining one or more apertures configured to deliver a cleaning solution to a pad coupled about the mount cylinder.

公开(公告)号：US20230313406A1

公开(公告)日：2023-10-05

申请号：US18130004

申请日：2023-04-03

Applicant: Applied Materials, Inc.

Inventor： Paul R. McHugh ,  Forrest G. Reinhart ,  Gregory J. Wilson ,  Kwan Wook Roh ,  Kyle M. Hanson ,  James E. Brown ,  David J. Reis

IPC: C25D17/00 ,  C25D3/38 ,  C25D21/04 ,  C25D21/02

CPC classification number: C25D17/002 ,  C25D3/38 ,  C25D21/04 ,  C25D21/02

Abstract: Electroplating methods may include providing an electrolyte feedstock comprising copper to a first compartment of an electrochemical cell. The methods may include providing an acidic solution to a second compartment of the electrochemical cell. The first compartment and second compartment may be separated by a membrane. The methods may include applying a current to an anode of the electrochemical cell. The anode of the electrochemical cell may be disposed proximate the first compartment and across from the membrane. The methods may include forming an anolyte and catholyte precursor.