公开(公告)号：US11866821B2

公开(公告)日：2024-01-09

申请号：US16806656

申请日：2020-03-02

Applicant: Applied Materials, Inc.

Inventor： Shuran Sheng ,  Lin Zhang ,  Jiyong Huang ,  Joseph C. Werner ,  Stanley Wu ,  Mahesh Adinath Kanawade ,  Yikai Chen ,  Yixing Lin ,  Ying Ma

IPC: C23C16/44 ,  C01F17/265 ,  C23C16/458 ,  C01F17/229 ,  C01F17/218

CPC classification number: C23C16/4404 ,  C01F17/265 ,  C23C16/4405 ,  C23C16/4581 ,  C23C16/4585 ,  C01F17/218 ,  C01F17/229

Abstract: Embodiments of the present disclosure generally relate to an apparatus and a method for cleaning a processing chamber. In one embodiment, a substrate support cover includes a bulk member coated with a fluoride coating. The substrate support cover is placed on a substrate support disposed in the processing chamber during a cleaning process. The fluoride coating does not react with the cleaning species. The substrate support cover protects the substrate support from reacting with the cleaning species, leading to reduced condensation formed on chamber components, which in turn leads to reduced contamination of the substrate in subsequent processes.

公开(公告)号：US20220037126A1

公开(公告)日：2022-02-03

申请号：US16983164

申请日：2020-08-03

Applicant: Applied Materials, Inc.

Inventor： Jennifer Y. Sun ,  Ren-Guan Duan ,  Gayatri Natu ,  Tae Won Kim ,  Jiyong Huang ,  Nitin Deepak ,  Paul Brillhart ,  Lin Zhang ,  Yikai Chen ,  Sanni Sinikka Seppälä ,  Ganesh Balasubramanian ,  JuanCarlos Rocha ,  Shankar Venkataraman ,  Katherine Elizabeth Woo

IPC: H01J37/32 ,  C23C16/30 ,  C23C16/455 ,  C23C16/44

Abstract: Embodiments of the disclosure relate to articles, coated chamber components and methods of coating chamber components with a protective coating that includes at least one metal fluoride having a formula selected from the group consisting of M1xFw, M1xM2yFw and M1xM2yM3zFw, where at least one of M1, M2, or M3 is magnesium or lanthanum. The protective coating can be deposited by atomic layer deposition, chemical vapor deposition, electron beam ion assisted deposition, or physical vapor deposition.

公开(公告)号：US11837448B2

公开(公告)日：2023-12-05

申请号：US17242059

申请日：2021-04-27

Applicant: Applied Materials, Inc.

Inventor： Shuran Sheng ,  Lin Zhang ,  Jiyong Huang ,  Jang Seok Oh ,  Joseph C. Werner ,  Nitin Khurana ,  Ganesh Balasubramanian ,  Jennifer Y. Sun ,  Xinhai Han ,  Zhijun Jiang

IPC: H01J37/32 ,  C23C16/44 ,  B08B7/00

CPC classification number: H01J37/32862 ,  B08B7/0035 ,  C23C16/4405 ,  H01J37/32449 ,  H01J37/32724 ,  H01J2237/335 ,  H01J2237/3321

Abstract: Examples disclosed herein relate to a method and apparatus for cleaning and repairing a substrate support having a heater disposed therein. A method includes (a) cleaning a surface of a substrate support having a bulk layer, the substrate support is disposed in a processing environment configured to process substrates. The cleaning process includes forming a plasma at a high temperature from a cleaning gas mixture having a fluorine containing gas and oxygen. The method includes (b) removing oxygen radicals from the processing environment with a treatment plasma formed from a treatment gas mixture. The treatment gas mixture includes the fluorine containing gas. The method further includes (c) repairing an interface of the substrate support and the bulk layer with a post-treatment plasma. The post-treatment plasma is formed from a post-treatment gas mixture including a nitrogen containing gas. The high temperature is greater than or equal to about 500 degrees Celsius.