公开(公告)号：US10379450B2

公开(公告)日：2019-08-13

申请号：US15867369

申请日：2018-01-10

Applicant: Applied Materials, Inc.

Inventor： Benjamin M. Johnston ,  Thomas L. Laidig ,  Jang Fung Chen ,  John White

IPC: G03B27/42 ,  G03F7/20 ,  G01B11/14

Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for performing photolithography processes. In one embodiment, a system including multiple interferometers for accurately measuring the location of a substrate during operation is provided. The system may include two chucks, and the two chucks are aligned in a first direction. The interferometers are placed along the first direction to measure the location of the substrate with respect to the first direction. The reduced distance between the interferometers and the chuck improves the accuracy of the measurement of the location of the substrate. In another embodiment, mask pattern data is provided to the system, and the mask pattern data is modified based on location and position information of the substrate. By controlling the mask pattern data with the location and position information of the substrate, less positional errors of the pattern formed on the substrate can be achieved.

公开(公告)号：US10036966B2

公开(公告)日：2018-07-31

申请号：US15364748

申请日：2016-11-30

Applicant: Applied Materials, Inc.

Inventor： Benjamin M. Johnston ,  John White ,  Thomas Laidig

IPC: G03F9/00 ,  G03F7/20

CPC classification number: G03F7/70808 ,  G03F7/70775 ,  G03F7/708 ,  G03F7/70858 ,  G03F7/70866 ,  G03F7/70933 ,  G03F9/00 ,  G03F9/70 ,  G03F9/7049 ,  G03F9/7057 ,  G03F2009/005

Abstract: Embodiments of the present disclosure generally relate to systems and methods for performing photolithography processes. In one embodiment, laminar gas flow is provided inside a photolithography system during operation. With laminar gas flow instead of turbulent gas flow inside the system, accuracy of the measurement of the location of a substrate disposed inside the system is improved due to the improved signal integrity of interferometers.

公开(公告)号：US09927723B2

公开(公告)日：2018-03-27

申请号：US15080473

申请日：2016-03-24

Applicant: Applied Materials, Inc.

Inventor： Benjamin M. Johnston ,  Thomas L. Laidig ,  Jang Fung Chen ,  John White

IPC: G03B27/52 ,  G03B27/42 ,  G03F7/20 ,  G01B11/14

CPC classification number: G03F7/70775 ,  G01B11/14 ,  G03F7/70275 ,  G03F7/70733

Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for performing photolithography processes. In one embodiment, a system including multiple interferometers for accurately measuring the location of a substrate during operation is provided. The system may include two chucks, and the two chucks are aligned in a first direction. The interferometers are placed along the first direction to measure the location of the substrate with respect to the first direction. The reduced distance between the interferometers and the chuck improves the accuracy of the measurement of the location of the substrate. In another embodiment, mask pattern data is provided to the system, and the mask pattern data is modified based on location and position information of the substrate. By controlling the mask pattern data with the location and position information of the substrate, less positional errors of the pattern formed on the substrate can be achieved.