SUBSTRATE RINSING SYSTEMS AND METHODS
    1.
    发明申请
    SUBSTRATE RINSING SYSTEMS AND METHODS 有权
    基板冲压系统和方法

    公开(公告)号:US20160175857A1

    公开(公告)日:2016-06-23

    申请号:US14626903

    申请日:2015-02-19

    CPC classification number: H01L21/67051 B05B1/046 H01L21/02052 H01L21/67057

    Abstract: An example waterfall apparatus includes (1) a first portion of a first width having (a) a first plenum, a second plenum, and a restricted fluid path therebetween; (b) a first coupling surface; and (c) an inlet opening that creates a fluid path between the first coupling surface and the first plenum; and (2) a second portion of a second width larger than the first width and having (a) a second coupling surface; and (b) an inlet aligned with the first portion inlet opening. The first and second coupling surfaces form a slot that extends along at least a portion of a length of the waterfall apparatus and that connects to the second plenum. Fluid introduced into the second portion inlet fills the first plenum, travels through the restricted fluid path to the second plenum, and exits the slot between the first and second portions to form a rinsing fluid waterfall.

    Abstract translation: 示例性瀑布装置包括(1)第一宽度的第一部分,其具有(a)第一增压室,第二增压室和它们之间的限制流体路径; (b)第一耦合表面; 和(c)入口开口,其在所述第一联接表面和所述第一增压室之间产生流体路径; 和(2)第二宽度大于第一宽度的第二部分,并且具有(a)第二联接表面; 和(b)与第一部分入口开口对准的入口。 第一和第二联接表面形成沿着瀑布装置的长度的至少一部分延伸并连接到第二增压室的槽。 引入第二部分入口的流体填充第一集气室,穿过受限制的流体路径到达第二集气室,并且离开第一和第二部分之间的槽,以形成冲洗流体瀑布。

    Substrate rinsing systems and methods

    公开(公告)号:US09859135B2

    公开(公告)日:2018-01-02

    申请号:US14626903

    申请日:2015-02-19

    CPC classification number: H01L21/67051 B05B1/046 H01L21/02052 H01L21/67057

    Abstract: An example waterfall apparatus includes (1) a first portion of a first width having (a) a first plenum, a second plenum, and a restricted fluid path therebetween; (b) a first coupling surface; and (c) an inlet opening that creates a fluid path between the first coupling surface and the first plenum; and (2) a second portion of a second width larger than the first width and having (a) a second coupling surface; and (b) an inlet aligned with the first portion inlet opening. The first and second coupling surfaces form a slot that extends along at least a portion of a length of the waterfall apparatus and that connects to the second plenum. Fluid introduced into the second portion inlet fills the first plenum, travels through the restricted fluid path to the second plenum, and exits the slot between the first and second portions to form a rinsing fluid waterfall.

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