公开(公告)号：US20030032380A1

公开(公告)日：2003-02-13

申请号：US10262164

申请日：2002-10-01

Applicant: Applied Materials, Inc.

Inventor： Phillip R. Sommer ,  Paul D. Butterfield

IPC: B24B023/00

CPC classification number: B24B37/26 ,  B24B37/20 ,  H01L21/30625 ,  Y10S451/921

Abstract: A polishing apparatus that employs a polishing media retention arrangement to prevent slippage or wrinkles in the polishing media during polishing. The polishing media is drawn against a support surface by a vacuum applied between the polishing media and the support surface. Also, a porous layer may be placed between the polishing media and the support surface to form dimples in the polishing media upon the application of vacuum. An alternative arrangement draws the polishing media against a carrier and the substrate to be polished.

公开(公告)号：US20030171069A1

公开(公告)日：2003-09-11

申请号：US10408032

申请日：2003-04-03

Applicant: Applied Materials, Inc.

Inventor： John M. White ,  Phillip R. Sommer ,  Sasson Somekh

IPC: B24B007/22

CPC classification number: B24B37/16 ,  B24B21/004 ,  B24B21/008 ,  B24B21/20

Abstract: Generally, a method and system for lifting a web of polishing material is provided. In one embodiment, the system includes a platen that has a first lift member disposed adjacent to a first side and a second lift member disposed adjacent to a second side. The platen is adapted to support the web of polishing media that is disposed between the first and the second lift members. A method includes supporting a web of polishing media on a platen between a first lift member and a second lift member and moving at least the first lift member or the second lift member to an extended position relative the platen that places the web in a spaced-apart relation with the platen.

公开(公告)号：US20030209320A1

公开(公告)日：2003-11-13

申请号：US10411750

申请日：2003-04-10

Applicant: Applied Materials, Inc.

Inventor： Phillip R. Sommer

IPC: H01L021/306

CPC classification number: H01L21/67161 ,  B24B37/345 ,  B24B41/005 ,  H01L21/67219 ,  H01L21/67751 ,  H01L21/67766

Abstract: A chemical mechanical planarization system and method for planarizing wafers is provided. The system generally includes a transfer corridor, at least one corridor robot, one or more polishing modules and at least one loading device. The corridor robot is disposed in the transfer corridor and is positionable between a first end and a second end of the transfer corridor. The loading device is adapted to transfer workpieces between the transfer corridor and the polishing modules. Generally, the loading device includes at least one load cup. The one or more polishing modules each include one or more polishing heads for holding workpieces during processing.

Abstract translation: 提供了用于平坦化晶片的化学机械平面化系统和方法。 该系统通常包括转移走廊，至少一个走廊机器人，一个或多个抛光模块和至少一个装载装置。 走廊机器人设置在转移走廊中并且可定位在转移走廊的第一端和第二端之间。 装载装置适于在转移走廊和抛光模块之间传送工件。 通常，装载装置包括至少一个装载杯。 一个或多个抛光模块各自包括用于在加工期间保持工件的一个或多个抛光头。