-
公开(公告)号：US12023853B2
公开(公告)日：2024-07-02
申请号：US16700062
申请日：2019-12-02
Applicant: Applied Materials, Inc.
Inventor： Kasiraman Krishnan , Daniel Redfield , Russell Edward Perry , Gregory E. Menk , Rajeev Bajaj , Fred C. Redeker , Nag B. Patibandla , Mahendra C. Orilall , Jason G. Fung
IPC: B29C64/112 , B24B37/22 , B24B37/24 , B24B37/26 , B24D11/00 , B29K105/16 , B29L31/00
CPC classification number: B29C64/112 , B24B37/22 , B24B37/24 , B24B37/26 , B24D11/001 , B29K2105/16 , B29K2995/007 , B29L2031/736
Abstract: A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.
-
Patent Agency Ranking
2.发明申请公开(公告)号：US20140261168A1
公开(公告)日：2014-09-18
申请号：US14162048
申请日：2014-01-23
Applicant: Applied Materials, Inc.
Inventor： Qiwei Liang , Ellie Y. Yieh , Juan Carlos Rocha-Alvarez , Russell Edward Perry
IPC: H01L21/67
CPC classification number: H01L21/67196 , H01L21/6719
Abstract: Embodiments of the present invention generally relate to a cluster tool for processing semiconductor substrates. In one embodiment, a cluster tool having four to six process chambers connected to a transfer chamber and each process chamber may simultaneously process two or three substrates.
Abstract translation: 本发明的实施例一般涉及用于处理半导体衬底的簇工具。 在一个实施例中，具有连接到传送室和每个处理室的四至六个处理室的簇工具可以同时处理两个或三个基板。
-
3.发明授权公开(公告)号：US10537974B2
公开(公告)日：2020-01-21
申请号：US15876436
申请日：2018-01-22
Applicant: Applied Materials, Inc.
Inventor： Rajeev Bajaj , Kasiraman Krishnan , Mahendra C. Orilall , Daniel Redfield , Fred C. Redeker , Nag B. Patibandla , Gregory E. Menk , Jason G. Fung , Russell Edward Perry , Robert E. Davenport
Abstract: Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.
-
公开(公告)号：US09776361B2
公开(公告)日：2017-10-03
申请号：US14863409
申请日：2015-09-23
Applicant: Applied Materials, Inc.
Inventor： Kasiraman Krishnan , Daniel Redfield , Russell Edward Perry , Gregory E. Menk , Rajeev Bajaj , Fred C. Redeker , Nag B. Patibandla , Mahendra C. Orilall , Jason G. Fung
IPC: B29C67/00 , B24B37/22 , B24B37/26 , B29K105/16 , B29L31/00
CPC classification number: B29C64/112 , B24B37/22 , B24B37/24 , B24B37/26 , B24D11/001 , B29K2105/16 , B29K2995/007 , B29L2031/736
Abstract: A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.
-
5.发明授权公开(公告)号：US11958162B2
公开(公告)日：2024-04-16
申请号：US16746065
申请日：2020-01-17
Applicant: Applied Materials, Inc.
Inventor： Rajeev Bajaj , Kasiraman Krishnan , Mahendra C. Orilall , Daniel Redfield , Fred C. Redeker , Nag B. Patibandla , Gregory E. Menk , Jason G. Fung , Russell Edward Perry , Robert E. Davenport
CPC classification number: B24B37/26 , B24B37/205 , B24B37/22 , B24B37/24 , B24D18/0018 , B24D18/0045 , B29C64/112 , B33Y80/00
Abstract: Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.
-
6.发明授权公开(公告)号：US09873180B2
公开(公告)日：2018-01-23
申请号：US14695299
申请日：2015-04-24
Applicant: Applied Materials, Inc.
Inventor： Rajeev Bajaj , Kasiraman Krishnan , Mahendra C. Orilall , Daniel Redfield , Fred C. Redeker , Nag B. Patibandla , Gregory E. Menk , Jason G. Fung , Russell Edward Perry , Robert E. Davenport
CPC classification number: B24B37/26 , B24B37/205 , B24B37/22 , B24B37/24 , B24D18/0045 , B29C64/112 , B33Y80/00
Abstract: Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.
-
-
-
-
-
Search Results
6
records
(took 0.012 seconds)
