公开(公告)号：US20130098395A1

公开(公告)日：2013-04-25

申请号：US13646670

申请日：2012-10-06

Applicant: APPLIED MATERIALS, Inc.

Inventor： Yunshuang Ding ,  Sen-Hou Ko

IPC: B08B1/00 ,  A47L1/02

CPC classification number: H01L21/02074 ,  H01L21/67028 ,  H01L21/67046

Abstract: Methods, apparatus, and systems for cleaning a substrate are provided. In one aspect, a substrate is scrubbed using an acidic cleaning solution in a first scrubber, transferred to a second scrubber after scrubbing the substrate using the acidic cleaning solution, followed by scrubbing the substrate in the second scrubber using a basic cleaning solution. Numerous additional aspects are disclosed.

Abstract translation: 提供了用于清洁基底的方法，装置和系统。 在一个方面，使用第一洗涤器中的酸性清洁溶液洗涤基底，使用酸性清洁溶液洗涤基底后转移到第二洗涤器，然后使用基本清洁溶液洗涤第二洗涤器中的基底。 公开了许多附加方面。

公开(公告)号：US09508575B2

公开(公告)日：2016-11-29

申请号：US14198150

申请日：2014-03-05

Applicant: Applied Materials, Inc.

Inventor： Hui Chen ,  Sen-Hou Ko

IPC: B08B1/04 ,  B08B11/02 ,  H01L21/67 ,  H01L21/02 ,  B08B1/00

CPC classification number: H01L21/02065 ,  B08B1/002 ,  B08B1/006 ,  B08B1/04 ,  B08B3/10 ,  H01L21/02041 ,  H01L21/02087 ,  H01L21/31053 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67178 ,  H01L21/67219 ,  H01L21/68764

Abstract: A method and apparatus for cleaning a substrate after chemical mechanical planarizing (CMP) is provided. The apparatus comprises a housing, a substrate holder rotatable on a first axis and configured to retain a substrate in a substantially vertical orientation, a first pad holder having a pad retaining surface facing the substrate holder in a parallel and space apart relation, the first pad holder rotatable on a second axis rotatable parallel to the first axis, a first actuator operable to move the pad holder relative to the substrate holder to change a distance defined between the first axis and the second axis, and a second pad holder disposed in the housing, the second pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, wherein the second pad holder is couple with a rotary arm.

Abstract translation: 提供了一种用于在化学机械平面化（CMP）之后清洁衬底的方法和设备。 该装置包括壳体，可在第一轴线上旋转并被配置为将基片保持在基本垂直取向的衬底保持器，第一衬垫保持器具有以平行且间隔开的关系面对衬底保持器的衬垫保持表面，第一衬垫 保持器可在平行于第一轴线旋转的第二轴线上旋转，第一致动器可操作以相对于衬底保持器移动衬垫保持器以改变限定在第一轴线和第二轴线之间的距离，以及设置在壳体中的第二衬垫保持架 ，所述第二焊盘保持器具有以平行和间隔的关系面对所述衬底保持器的焊盘保持表面，其中所述第二焊盘保持器与旋转臂耦合。

公开(公告)号：US09711381B2

公开(公告)日：2017-07-18

申请号：US14167818

申请日：2014-01-29

Applicant: Applied Materials, Inc.

Inventor： Sen-Hou Ko ,  Lakshmanan Karuppiah

IPC: B08B1/04 ,  H01L21/304 ,  B24B37/10 ,  H01L21/67 ,  H01L21/02 ,  H01L21/683 ,  H01L21/463 ,  B08B1/00 ,  B24B37/34

CPC classification number: H01L21/67046 ,  B08B1/008 ,  B08B1/04 ,  B24B37/107 ,  B24B37/34 ,  H01L21/02041 ,  H01L21/02087 ,  H01L21/02096 ,  H01L21/304 ,  H01L21/463 ,  H01L21/67051 ,  H01L21/67219 ,  H01L21/6838

Abstract: A method and apparatus for cleaning a substrate after chemical mechanical planarizing (CMP) is provided. The apparatus comprises a housing, a substrate holder rotatable on a first axis and configured to retain a substrate in a substantially vertical orientation, a first pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, the first pad holder rotatable on a second axis disposed parallel to the first axis, a first actuator operable to move the pad holder relative to the substrate holder to change a distance between the first axis and the second axis, and a second pad holder disposed in the housing, the second pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, the second pad holder rotatable on a third axis parallel to the first axis and the second axis.

公开(公告)号：US20140209239A1

公开(公告)日：2014-07-31

申请号：US14167818

申请日：2014-01-29

Applicant: Applied Materials, Inc.

Inventor： Sen-Hou Ko ,  Lakshmanan Karuppiah

IPC: H01L21/02 ,  H01L21/67

CPC classification number: H01L21/67046 ,  B08B1/008 ,  B08B1/04 ,  B24B37/107 ,  B24B37/34 ,  H01L21/02041 ,  H01L21/02087 ,  H01L21/02096 ,  H01L21/304 ,  H01L21/463 ,  H01L21/67051 ,  H01L21/67219 ,  H01L21/6838

Abstract: A method and apparatus for cleaning a substrate after chemical mechanical planarizing (CMP) is provided. The apparatus comprises a housing, a substrate holder rotatable on a first axis and configured to retain a substrate in a substantially vertical orientation, a first pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, the first pad holder rotatable on a second axis disposed parallel to the first axis, a first actuator operable to move the pad holder relative to the substrate holder to change a distance between the first axis and the second axis, and a second pad holder disposed in the housing, the second pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, the second pad holder rotatable on a third axis parallel to the first axis and the second axis.

Abstract translation: 提供了一种用于在化学机械平面化（CMP）之后清洁衬底的方法和设备。 该装置包括壳体，可在第一轴线上旋转并被构造成将基底保持在基本垂直取向的衬底保持器，第一衬垫保持器具有以平行和间隔的关系面向衬底保持器的衬垫保持表面，第一衬垫 支架可在平行于第一轴线设置的第二轴线上旋转，第一致动器可操作以相对于衬底支架移动衬垫支架以改变第一轴线与第二轴线之间的距离，以及设置在壳体中的第二垫座， 所述第二焊盘保持器具有以平行和间隔的关系面对所述衬底保持器的焊盘保持表面，所述第二焊盘保持器可在平行于所述第一轴线和所述第二轴线的第三轴线上旋转。