公开(公告)号：US20230323543A1

公开(公告)日：2023-10-12

申请号：US17714513

申请日：2022-04-06

申请人： Applied Materials, Inc.

发明人： Tuerxun Ailihumaer ,  Yixiong Yang ,  Annamalai Lakshmanan ,  Srinivas Gandikota ,  Yogesh Sharma ,  Pei Hsuan Lin ,  Yi Xu ,  Zhimin Qi ,  Aixi Zhang ,  Shiyu Yue ,  Yu Lei

IPC分类号： C23C30/00 ,  C23C16/02 ,  C23C16/455 ,  C23C16/56

CPC分类号： C23C30/00 ,  C23C16/0245 ,  C23C16/45525 ,  C23C16/56

摘要： Embodiments of the disclosure advantageously provide in situ selectively deposited molybdenum films having reduced resistivity and methods of reducing or eliminating lateral growth of a selectively deposited molybdenum layer. Additional embodiments provide integrated clean and deposition processes which improve the selectivity of in situ selectively deposited molybdenum films on features, such as a via. Further embodiments advantageously provide methods of improving uniformity and selectivity of bottom-up gap fill for vias with improved film properties.

公开(公告)号：US20230088552A1

公开(公告)日：2023-03-23

申请号：US17478047

申请日：2021-09-17

申请人： Applied Materials, Inc.

发明人： Borui Xia ,  Anthony Chih-Tung Chan ,  Shiyu Yue ,  Wei Lei ,  Aravind Miyar Kamath ,  Mukund Sundararajan ,  Rongjun Wang ,  Adolph Miller Allen

IPC分类号： H01F7/18 ,  C23C14/35

摘要： Magnet assemblies comprising a housing with a top plate each comprising aligned openings are described. The housing has a bottom ring and an annular wall with a plurality of openings formed in the bottom ring. The top plate is on the housing and has a plurality of openings aligned with the plurality of openings in the bottom ring of the housing. The magnet assembly may also include a non-conducting base plate and/or a conductive cover plate. Methods for using the magnet assembly and magnetic field tuning are also described.

公开(公告)号：US12112890B2

公开(公告)日：2024-10-08

申请号：US17478047

申请日：2021-09-17

申请人： Applied Materials, Inc.

发明人： Borui Xia ,  Anthony Chih-Tung Chan ,  Shiyu Yue ,  Wei Lei ,  Aravind Miyar Kamath ,  Mukund Sundararajan ,  Rongjun Wang ,  Adolph Miller Allen

IPC分类号： C23C14/35 ,  H01F7/18

CPC分类号： H01F7/18 ,  C23C14/358

摘要： Magnet assemblies comprising a housing with a top plate each comprising aligned openings are described. The housing has a bottom ring and an annular wall with a plurality of openings formed in the bottom ring. The top plate is on the housing and has a plurality of openings aligned with the plurality of openings in the bottom ring of the housing. The magnet assembly may also include a non-conducting base plate and/or a conductive cover plate. Methods for using the magnet assembly and magnetic field tuning are also described.

公开(公告)号：US20240167148A1

公开(公告)日：2024-05-23

申请号：US17989767

申请日：2022-11-18

申请人： Applied Materials, Inc.

发明人： Tsung-Han Yang ,  Shiyu Yue ,  Rongjun Wang

IPC分类号： C23C16/02 ,  B08B7/00 ,  C23C16/06

CPC分类号： C23C16/0227 ,  B08B7/0035 ,  C23C16/06

摘要： Embodiments of the disclosure are directed to methods of removing metal oxide from a substrate surface by exposing the substrate surface to an un-biased cleaning plasma comprising a mixture of hydrogen (H2) and oxygen (O2). In some embodiments, the substrate surface has at least one feature thereon, the at least one feature defining a trench having a top surface, a bottom surface, and two opposed sidewalls. The un-biased cleaning plasma comprises in a range of from 1% to 20% oxygen (O2) on a molecular basis and greater than or equal to 80% hydrogen (H2). The un-biased cleaning plasma removes substantially all of the metal oxide—such as molybdenum oxide (MoOx), ruthenium oxide (RuOx), or tungsten oxide (WOx)—from the substrate surface, and the top surface, the bottom surface, and the two opposed sidewalls of the trench without damaging the dielectric and/or critical dimension (CD)/profile of the structure.