公开(公告)号：US11643725B2

公开(公告)日：2023-05-09

申请号：US17214011

申请日：2021-03-26

Applicant: Applied Materials, Inc.

Inventor： Nitin Pathak ,  Tuan A. Nguyen ,  Amit Bansal ,  Badri N. Ramamurthi ,  Thomas Rubio ,  Juan Carlos Rocha-Alvarez

IPC: C23C16/40 ,  C23C16/455 ,  C23C16/44 ,  C23C16/458 ,  C23C16/46

CPC classification number: C23C16/45559 ,  C23C16/4412 ,  C23C16/4585 ,  C23C16/46

Abstract: Exemplary semiconductor processing chambers may include a substrate support including a top surface. A peripheral edge region of the top surface may be recessed relative to a medial region of the top surface. The chambers may include a pumping liner disposed about an exterior surface of the substrate support. The chambers may include a liner disposed between the substrate support and the pumping liner. The liner may be spaced apart from the exterior surface to define a purge lumen between the liner and the substrate support. The chambers may include an edge ring seated on the peripheral edge region. The edge ring may extend beyond a peripheral edge of the substrate support and above a portion of the liner. A gap may be formed between a bottom surface of the edge ring and a top surface of the liner. The gap and the purge lumen may be fluidly coupled.

公开(公告)号：US20220307129A1

公开(公告)日：2022-09-29

申请号：US17210018

申请日：2021-03-23

Applicant: Applied Materials, Inc.

Inventor： Yuxing Zhang ,  Tuan Anh Nguyen ,  Amit Kumar Bansal ,  Nitin Pathak ,  Saket Rathi ,  Thomas Rubio ,  Udit S. Kotagi ,  Badri N. Ramamurthi ,  Dharma Ratnam Srichurnam

IPC: C23C16/44 ,  C23C16/455

Abstract: The present disclosure relates to a cleaning assemblies, components thereof, and methods associated therewith for substrate processing chambers. In one example, a cleaning assembly for a substrate processing chamber includes a distribution ring. The distribution ring comprises a body with an inlet and an outlet. The outlet is fluidly coupled to an internal volume of the substrate processing chamber via a sidewall of the substrate processing chamber. The cleaning assembly includes a cleaning conduit configured to fluidly couple a gas manifold to the distribution ring for diverting a first portion of cleaning fluid from the gas manifold to the distribution ring.

公开(公告)号：US11827980B2

公开(公告)日：2023-11-28

申请号：US17974408

申请日：2022-10-26

Applicant: Applied Materials, Inc.

Inventor： Nitin Pathak ,  Amit Kumar Bansal ,  Tuan Anh Nguyen ,  Thomas Rubio ,  Badri N. Ramamurthi ,  Juan Carlos Rocha-Alvarez

IPC: C23C16/458 ,  C23C16/455 ,  C23C16/44

CPC classification number: C23C16/4585 ,  C23C16/4412 ,  C23C16/45565 ,  H01J2329/94 ,  H01J2329/941

Abstract: Aspects of the present disclosure relate generally to isolator devices, components thereof, and methods associated therewith for substrate processing chambers. In one implementation, a substrate processing chamber includes an isolator ring disposed between a pedestal and a pumping liner. The isolator ring includes a first surface that faces the pedestal, the first surface being disposed at a gap from an outer circumferential surface of the pedestal. The isolator ring also includes a second surface that faces the pumping liner and a protrusion that protrudes from the first surface of the isolator ring and towards the outer circumferential surface of the pedestal. The protrusion defines a necked portion of the gap between the pedestal and the isolator ring.

公开(公告)号：US11492705B2

公开(公告)日：2022-11-08

申请号：US16896982

申请日：2020-06-09

Applicant: Applied Materials, Inc.

Inventor： Nitin Pathak ,  Amit Kumar Bansal ,  Tuan Anh Nguyen ,  Thomas Rubio ,  Badri N. Ramamurthi ,  Juan Carlos Rocha-Alvarez

IPC: C23C16/458 ,  C23C16/455 ,  C23C16/44

Abstract: Aspects of the present disclosure relate generally to isolator devices, components thereof, and methods associated therewith for substrate processing chambers. In one implementation, a substrate processing chamber includes an isolator ring disposed between a pedestal and a pumping liner. The isolator ring includes a first surface that faces the pedestal, the first surface being disposed at a gap from an outer circumferential surface of the pedestal. The isolator ring also includes a second surface that faces the pumping liner and a protrusion that protrudes from the first surface of the isolator ring and towards the outer circumferential surface of the pedestal. The protrusion defines a necked portion of the gap between the pedestal and the isolator ring.

公开(公告)号：US12012653B2

公开(公告)日：2024-06-18

申请号：US17210018

申请日：2021-03-23

Applicant: Applied Materials, Inc.

Inventor： Yuxing Zhang ,  Tuan Anh Nguyen ,  Amit Kumar Bansal ,  Nitin Pathak ,  Saket Rathi ,  Thomas Rubio ,  Udit S. Kotagi ,  Badri N. Ramamurthi ,  Dharma Ratnam Srichurnam

IPC: C23C16/44 ,  C23C16/455

CPC classification number: C23C16/4405 ,  C23C16/45563

Abstract: The present disclosure relates to a cleaning assemblies, components thereof, and methods associated therewith for substrate processing chambers. In one example, a cleaning assembly for a substrate processing chamber includes a distribution ring. The distribution ring comprises a body with an inlet and an outlet. The outlet is fluidly coupled to an internal volume of the substrate processing chamber via a sidewall of the substrate processing chamber. The cleaning assembly includes a cleaning conduit configured to fluidly couple a gas manifold to the distribution ring for diverting a first portion of cleaning fluid from the gas manifold to the distribution ring.

公开(公告)号：US11952663B2

公开(公告)日：2024-04-09

申请号：US18313736

申请日：2023-05-08

Applicant: Applied Materials, Inc.

Inventor： Nitin Pathak ,  Tuan A. Nguyen ,  Amit Bansal ,  Badri N. Ramamurthi ,  Thomas Rubio ,  Juan Carlos Rocha-Alvarez

IPC: C23C16/40 ,  C23C16/44 ,  C23C16/455 ,  C23C16/458 ,  C23C16/46

CPC classification number: C23C16/45559 ,  C23C16/4412 ,  C23C16/4585 ,  C23C16/46

Abstract: Exemplary semiconductor processing chambers may include a substrate support including a top surface. A peripheral edge region of the top surface may be recessed relative to a medial region of the top surface. The chambers may include a pumping liner disposed about an exterior surface of the substrate support. The chambers may include a liner disposed between the substrate support and the pumping liner. The liner may be spaced apart from the exterior surface to define a purge lumen between the liner and the substrate support. The chambers may include an edge ring seated on the peripheral edge region. The edge ring may extend beyond a peripheral edge of the substrate support and above a portion of the liner. A gap may be formed between a bottom surface of the edge ring and a top surface of the liner. The gap and the purge lumen may be fluidly coupled.

公开(公告)号：US20230392259A1

公开(公告)日：2023-12-07

申请号：US18313736

申请日：2023-05-08

Applicant: Applied Materials, Inc.

Inventor： Nitin Pathak ,  Tuan A. Nguyen ,  Amit Bansal ,  Badri N. Ramamurthi ,  Thomas Rubio ,  Juan Carlos Rocha-Alvarez

IPC: C23C16/455 ,  C23C16/44 ,  C23C16/458

CPC classification number: C23C16/45559 ,  C23C16/46 ,  C23C16/4585 ,  C23C16/4412

Abstract: Exemplary semiconductor processing chambers may include a substrate support including a top surface. A peripheral edge region of the top surface may be recessed relative to a medial region of the top surface. The chambers may include a pumping liner disposed about an exterior surface of the substrate support. The chambers may include a liner disposed between the substrate support and the pumping liner. The liner may be spaced apart from the exterior surface to define a purge lumen between the liner and the substrate support. The chambers may include an edge ring seated on the peripheral edge region. The edge ring may extend beyond a peripheral edge of the substrate support and above a portion of the liner. A gap may be formed between a bottom surface of the edge ring and a top surface of the liner. The gap and the purge lumen may be fluidly coupled.

公开(公告)号：US20220307135A1

公开(公告)日：2022-09-29

申请号：US17214011

申请日：2021-03-26

Applicant: Applied Materials, Inc.

Inventor： Nitin Pathak ,  Tuan A. Nguyen ,  Amit Bansal ,  Badri N. Ramamurthi ,  Thomas Rubio ,  Juan Carlos Rocha-Alvarez

IPC: C23C16/455 ,  C23C16/458 ,  C23C16/44

Abstract: Exemplary semiconductor processing chambers may include a substrate support including a top surface. A peripheral edge region of the top surface may be recessed relative to a medial region of the top surface. The chambers may include a pumping liner disposed about an exterior surface of the substrate support. The chambers may include a liner disposed between the substrate support and the pumping liner. The liner may be spaced apart from the exterior surface to define a purge lumen between the liner and the substrate support. The chambers may include an edge ring seated on the peripheral edge region. The edge ring may extend beyond a peripheral edge of the substrate support and above a portion of the liner. A gap may be formed between a bottom surface of the edge ring and a top surface of the liner. The gap and the purge lumen may be fluidly coupled.